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    SOT1172-2 Search Results

    SOT1172-2 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1172-2 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT1172-2_118 NXP Semiconductors HTSSOP28; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF