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    SOT102 Price and Stock

    Nexperia PSMN3R9-100YSFX

    MOSFETs PSMN3R9-100YSF/SOT1023/4 LEADS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PSMN3R9-100YSFX Reel 1,500 1,500
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.95
    		Buy Now

    Nexperia PSMN1R2-25YL,115

    MOSFETs SO8 N CHAN 25V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PSMN1R2-25YL,115 Reel 1,500 1,500
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.78
    		Buy Now

    Vishay Intertechnologies FSOT1011E2K500KE

    Wirewound Resistors - Chassis Mount 2.5K OHM 10% 10W
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI FSOT1011E2K500KE Bulk 100 10
    • 1 -
    • 10 $9.07
    • 100 $8.72
    • 1000 $8.72
    • 10000 $8.72
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    Nexperia PSMNR58-30YLHX

    MOSFETs PSMNR58-30YLH/SOT1023/4 LEADS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PSMNR58-30YLHX Reel 1,500
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $1.33
    		Buy Now

    Nexperia PSMN1R0-40YLDX

    MOSFETs PSMN1R0-40YLD/SOT1023/4 LEADS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PSMN1R0-40YLDX Reel 1,500
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.77
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    Find more SOT102 price and stock on Findchips.com

    SOT102 Datasheets (18)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1020-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 256 balls Original PDF
    SOT-1020B TT Electronics Resistor: NET: 102: 0.1%: VOLT/D: 3SMD: T/R Original PDF
    SOT102-1 NXP Semiconductors Plastic dual in-line package; 18 leads (300 mil) Original PDF
    SOT1021-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 324 balls Original PDF
    SOT-1021B TT Electronics Resistor: NET: 1.02K: 0.1%: VOLT/D: 3SMD: T/R Original PDF
    SOT102-2 NXP Semiconductors Plastic dual in-line package; 18 leads (300 mil); slim corner leads Original PDF
    SOT1022-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 477 balls Original PDF
    SOT-1022B TT Electronics Resistor: NET: 10.2K: 0.1%: VOLT/D: 3SMD: T/R Original PDF
    SOT1023 NXP Semiconductors Reflow soldering footprint Original PDF
    SOT1023 NXP Semiconductors Plastic single-ended surface-mounted package (LFPAK56); 4 leads Original PDF
    SOT1023_115 NXP Semiconductors LFPAK; Power-SO8; Tape reel; standard product orientation 12NC ending 115 Original PDF
    SOT102-4 NXP Semiconductors Plastic dual in-line package; 18 leads (300 mil); long body Original PDF
    SOT1024-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 169 balls Original PDF
    SOT1024-2 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 169 balls Original PDF
    SOT1024-2 NXP Semiconductors Footprint for reflow soldering SOT1024-2 Original PDF
    SOT1025-1 NXP Semiconductors Plastic thermal enhanced ultra thin quad flat package; no leads; 60 terminals; UTLP based Original PDF
    SOT1026-1 NXP Semiconductors Plastic thermal enhanced very very thin quad flat package; no leads; 28 terminals Original PDF
    SOT1029-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 161 balls Original PDF

    SOT102 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA169 package SOT1024-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF LFBGA169 OT1024-2 OT1024-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-1 A ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13


    Original     		PDF LFBGA169: OT1024-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HUQFN60U: plastic thermal enhanced ultra thin quad flat package; no leads 60 terminals; UTLP based; body 4 x 6 x 0.55 mm B D SOT1025-1 A terminal 1 index area E A A1 detail X e2 v w C A B C M M e1 v w b M M C A B C C 1/2 e e L1 L D2 D6 eR A11


    Original     		PDF HUQFN60U: OT1025-1

    DIP18

    Abstract: MS-011
    Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; slim corner leads SOT102-2 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP18: OT102-2 MS-011 DIP18 MS-011

    0017C

    Abstract: No abstract text available
    Text: PDF: 1999 Jul 16 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; long body SOT102-4 ME seating plane D A2 A A1 L e Z c w M b1 (e 1) b MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)


    Original     		PDF DIP18: OT102-4 OT102-4 MS-001AC 0017C

    h 033

    Abstract: DIP18 MS-001
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; slim corner leads SOT102-2 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP18: OT102-2 MS-001 h 033 DIP18 MS-001

    DIP18

    Abstract: MS-001
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; long body SOT102-4 ME seating plane D A2 A A1 L e Z c w M b1 (e 1) b MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)


    Original     		PDF DIP18: OT102-4 MS-001 DIP18 MS-001

    Untitled

    Abstract: No abstract text available
    Text: PA K SOT1023 LF LFPAK; Power-SO8; Tape reel; standard product orientation 12NC ending 115 Rev. 1 — 26 September 2012 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel


    Original     		PDF OT1023 001aak291 OT1023

    Untitled

    Abstract: No abstract text available
    Text: Package outline DIP18: plastic dual in-line package; 18 leads 300 mil SOT102-1 ME seating plane D A2 A A1 L e Z b1 b 10 18 c w M (e 1) b2 MH pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max.


    Original     		PDF DIP18: OT102-1 MS-001

    DIP18 package

    Abstract: h 033 DIP18 MS-001
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP18: OT102-1 MS-001 DIP18 package h 033 DIP18 MS-001

    sot1023

    Abstract: lfpak sot1023
    Text: Package outline Plastic single-ended surface-mounted package LFPAK ; 4 leads A E SOT1023 E1 A b2 (3x) c1 b1 mounting base H D1 D L 1 2 3 4 b e A1 w A X c C θ Lp detail X 2.5 A A1 b b1 b2 c c1 D(1) D1(1) E(1) E1(1) max 1.10 0.15 0.50 4.41 0.25 0.30 4.70 4.45 5.30


    Original     		PDF OT1023 sot1023 OT1023 lfpak sot1023

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-2 A ball A1 index area E A2 A A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13


    Original     		PDF LFBGA169: OT1024-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA477: plastic low profile fine-pitch ball grid array package; 477 balls A B D SOT1022-1 ball A1 index area E A2 A A1 detail X e1 AB Y V T P M K H F D B ∅v ∅w b e M M C C A B C y y1 C AC AA W U e R N e2 L J G E C A ball A1 index area


    Original     		PDF LFBGA477: OT1022-1

    SOT1023

    Abstract: lfpak sot1023 sot669 footprint LFPAK footprint so8 footprint PSMN7R0-30YL PSMN1R2-25YL PSMN1R3-30YL PSMN3R0-30YL PSMN3R5-30YL
    Text: Nine new Trench 6 MOSFETs in a Power-SO8 package The world’s first < 1 mΩ Power-SO8 MOSFETs at 25 V We’ve extended our range of Trench 6 MOSFETs with nine new devices at 25 V, 30 V, 40 V and 80 V in the LFPAK SOT669 and SOT1023 package. NXP leads the way with its range of Trench 6 MOSFETs in


    Original     		PDF OT669 OT1023) PSMN1R2-25YL) high-efficien84 SOT1023 lfpak sot1023 sot669 footprint LFPAK footprint so8 footprint PSMN7R0-30YL PSMN1R2-25YL PSMN1R3-30YL PSMN3R0-30YL PSMN3R5-30YL

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA256: plastic low profile fine-pitch ball grid array package; 256 balls B D SOT1020-1 A ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2


    Original     		PDF LFBGA256: OT1020-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; slim corner leads SOT102-2 ME seating plane D A2 A A1 L e Z b1 b 10 18 c w M (e 1) b2 MH pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP18: OT102-2 MS-011

    DIP18

    Abstract: MS-001
    Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP18: OT102-1 015ons) MS-001 DIP18 MS-001

    sot102

    Abstract: SOT102-1
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP18: OT102-1 OT102-1 sot102 SOT102-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline Plastic single-ended surface-mounted package LFPAK56 ; 4 leads A E SOT1023 E1 A b2 (3x) c1 b1 mounting base H D1 D L 1 2 3 4 b e A1 w A X c C θ Lp detail X 2.5 A A1 b b1 b2 c c1 D(1) D1(1) E(1) E1(1) max 1.10 0.15 0.50 4.41 0.25 0.30 4.70 4.45 5.30


    Original     		PDF LFPAK56) OT1023 sot1023

    Untitled

    Abstract: No abstract text available
    Text: Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; long body SOT102-4 ME seating plane D A2 A A1 L e Z c w M b1 (e 1) b MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions)


    Original     		PDF DIP18: OT102-4 MS-001

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA161: plastic low profile fine-pitch ball grid array package; 161 balls B D SOT1029-1 A ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12 13


    Original     		PDF LFBGA161: OT1029-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HWQFN28: plastic thermal enhanced very very thin quad flat package; no leads; 28 terminals; body 5 x 5 x 0.75 mm B D SOT1026-1 A terminal 1 index area E A A1 c detail X e1 b e 8 14 v w C C A B C M M y1 C y L 7 15 e e2 Eh 21 1 terminal 1 index area


    Original     		PDF HWQFN28: OT1026-1

    DIP18

    Abstract: MS-001 SOT102-4 sot102
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; long body SOT102-4 ME seating plane D A2 A A1 L e Z c w M b1 (e 1) b MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions)


    Original     		PDF DIP18: OT102-4 MS-001 DIP18 MS-001 SOT102-4 sot102

    sot102

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DIP18: plastic dual in-line package; 18 leads 300 mil ; slim corner leads SOT102-2 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF DIP18: OT102-2 OT102-2 sot102