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    SOLDERING TECHNIQUES Search Results

    SOLDERING TECHNIQUES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SOLDERING TECHNIQUES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    seam seal process

    Abstract: No abstract text available
    Text: Soldering Methodologies MEMSIC products are designed to withstand the temperature excursions experienced during hand soldering, reflow soldering, or wave soldering as the following procedures are followed. Manual Soldering. When soldering manually or repairing via soldering Iron or heat gun the time should be limited


    Original     		PDF

    Melf composition

    Abstract: No abstract text available
    Text: Recommended Soldering Techniques Recommended Soldering Techniques by David B. Hutchins, Senior Applications Engineer Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Recommended Soldering Techniques Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original


    Original     		PDF AP02014

    MICRON 63

    Abstract: SOLDERING REFLOW smt
    Text: TN-00-15: Recommended Soldering Parameters Introduction Technical Note Recommended Soldering Parameters Introduction This technical note defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. Using these techniques and parameters will prevent


    Original     		PDF TN-00-15: 09005aef809140c7/Source: 09005aef80914088 MICRON 63 SOLDERING REFLOW smt

    ssop24 footprint

    Abstract: PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil
    Text: DISCRETE SEMICONDUCTORS Mounting and soldering PowerMOS transistors 1998 Dec 02 Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE


    Original     		PDF OT186A; OT263; 220AB MLC747 SSOP16 OT338-1) SSOP24 OT340-1) OT338-1 ssop24 footprint PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil

    SOD80 footprint

    Abstract: SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus
    Text: SECTION 17 MOUNTING AND SOLDERING contents page INTRODUCTION 17 - 2 AXIAL AND RADIAL LEADED DEVICES 17 - 2 Handling 17 - 2 Soldering 17 - 2 Mounting 17 - 3 SURFACE-MOUNT DEVICES 17 - 3 Reflow soldering process 17 - 3 Double-wave soldering process 17 - 7 Hand soldering of microminiature components


    Original     		PDF MSB461 OT163-1) MLC745 SOD80 footprint SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus

    hallsensor 120

    Abstract: hall-sensor hallsensor Application Note 27703 ALLEGRO Hallsensor an+503+hall+sensor 50G+HALL+SENSOR Hall+sensor+44e
    Text: Application Note 27703.2* APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering Manual soldering of surface-mount products is not recommended! Hall sensors are sensitive to thermal shock. When the soldering temperature is high enough, and the transmission of


    Original     		PDF GH-062-4 hallsensor 120 hall-sensor hallsensor Application Note 27703 ALLEGRO Hallsensor an+503+hall+sensor 50G+HALL+SENSOR Hall+sensor+44e

    hallsensor

    Abstract: hallsensor application hallsensor 120 metcal ALLEGRO Hallsensor 50G+HALL+SENSOR
    Text: Application Note 27703.2 APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering Manual soldering of surface-mount products is not recommended! Hall sensors are sensitive to thermal shock. When the soldering temperature is high enough, and the transmission of


    Original     		PDF GH-062-4 hallsensor hallsensor application hallsensor 120 metcal ALLEGRO Hallsensor 50G+HALL+SENSOR

    J-STD-020A

    Abstract: TB334
    Text: Application Note 7528 April 2002 TB334 Guidelines for Soldering Surface Mount Components to PC Boards 1. Introduction Special care must be taken when soldering surface mount components to a printed circuit (PC) board. There are 4 commonly used techniques for soldering surface mount components


    Original     		PDF TB334) J-STD-020A TB334

    TQFP80 footprint

    Abstract: TQFP100 footprint QFP160 diode databook package outline SMD CODE databook SMD Packages TQFP80 package LQFP32 LQFP48 LQFP64
    Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is


    Original     		PDF SSOP16 OT369-1) SSOP20 OT266-1) QFP52 OT379-1) QFP100 OT317-1, OT317-2, OT382-1) TQFP80 footprint TQFP100 footprint QFP160 diode databook package outline SMD CODE databook SMD Packages TQFP80 package LQFP32 LQFP48 LQFP64

    Application Note 27703

    Abstract: Allegro
    Text: SOLDERING OF SURFACE-MOUNT DEVICES Leaded through-hole products Allegro leaded products are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature excursions experienced during hand soldering, reflow soldering, or wave soldering as long as normal, good


    Original     		PDF GH-062-1 Application Note 27703 Allegro

    LQFP64. footprint

    Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
    Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is


    Original     		PDF QFP52 OT379-1) QFP100 OT317-1, OT317-2, OT382-1) QFP160 OT322-1) LQFP64. footprint dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64

    TQFP100 footprint

    Abstract: TQFP80 footprint diode databook package outline SMD codes databook LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160
    Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is


    Original     		PDF QFP52 OT379-1) QFP100 OT317-1, OT317-2, OT382-1) QFP160 OT322-1) TQFP100 footprint TQFP80 footprint diode databook package outline SMD codes databook LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160

    TQFP100 footprint

    Abstract: TQFP80 footprint SMD CODE databook HDIP TQFP 44 PACKAGE footprint diode databook package outline SMD Packages TQFP80 package LQFP32 LQFP48
    Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is


    Original     		PDF QFP52 OT379-1) QFP100 OT317-1, OT317-2, OT382-1) QFP160 OT322-1) TQFP100 footprint TQFP80 footprint SMD CODE databook HDIP TQFP 44 PACKAGE footprint diode databook package outline SMD Packages TQFP80 package LQFP32 LQFP48

    JEDEC J-STD-020d.1

    Abstract: paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033
    Text: Reflow Soldering Guidelines for Lead-Free and RoHS-Compliant Packages AN-353-3.0 Application Note This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow


    Original     		PDF AN-353-3 JEDEC J-STD-020d.1 paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033

    JEDEC J-STD-020d.1

    Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
    Text: AN 353: Reflow Soldering Guidelines for Lead-Free Packages February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow


    Original     		PDF AN-353-2 JEDEC J-STD-020d.1 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA

    Rosin Flux Type RMA

    Abstract: No abstract text available
    Text: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.


    Original     		PDF 01-Apr-08 Rosin Flux Type RMA

    vapor condensation cooling

    Abstract: 45034
    Text: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.


    Original     		PDF 03-Sep-09 vapor condensation cooling 45034

    Untitled

    Abstract: No abstract text available
    Text: Soldering Recommendations Vishay Vitramon Monolithic Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 5. Soldering Techniques: Follow the soldering curves shown on next page. A. Our tin plate nickel barrier termination Termination


    OCR Scan     		PDF 22-Sep-99

    Untitled

    Abstract: No abstract text available
    Text: Philips Components Soldering SOLDERING PLASTIC MINI­ PACKS By hand-held soldering iron or pulse-heated solder tool Fix the component by first soldering two, diagonally opposite, end leads. Apply the heating tool to the flat part of the lead only. Contact time must


    OCR Scan     		PDF

    LQFP64. footprint

    Abstract: T317 HDIP
    Text: Philips Semiconductors Soldering Package information INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is


    OCR Scan     		PDF

    sot89 stencil

    Abstract: No abstract text available
    Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION 1898 LEADED DEVICES Handling Soldering 1898 GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements


    OCR Scan     		PDF OT186A; OT263; 220AB T0220 SSOP16 SSOP24 OT338-1 OT34Q-1 sot89 stencil

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors Product specification LCD row/column driver for dot matrix graphic displays CONTENTS PCF8578 18 SOLDERING Introduction Reflow soldering Wave soldering LQFP VSO Method LQFP and VSO Repairing soldered joints 1 FEATURES 2 APPLICATIONS


    OCR Scan     		PDF

    UEI 20 SP 010

    Abstract: bord SAA7140A SAA7140B FEY G4 LQFP128 VR029 SAA7196 t3044 UL705
    Text: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION


    OCR Scan     		PDF SAA7140A; SAA7140B SAA7140A) SAA7140B) 711062b UEI 20 SP 010 bord SAA7140A SAA7140B FEY G4 LQFP128 VR029 SAA7196 t3044 UL705