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    SOLDER WITH FLUX Search Results

    SOLDER WITH FLUX Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM4GQF15FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4GRF20FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP176-2020-0.40-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4KMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4MMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4NQF10FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation

    SOLDER WITH FLUX Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    copper wire s.w.g 22

    Abstract: swg copper wire 18SWG EN29454 EN29453 22swg swg copper wire datasheet 22 swg copper wire Halide 43C501D
    Text: SOLDERING SOLDER WIRES, Flux-cored HAND LEAD-FREE SOLDER, ROSIN-FREE FLUX Lead-free solder wires employing a rosin colophony free flux conforming to EN29454. Ideal alternatives for tin/lead cored solder wires in most applications. Offered in a choice of two alloys, these solder wires can be used with existing processes, with minor increases to bit temperatures.


    Original     		PDF EN29454. EN29454 18swg 22swg PG/0412 copper wire s.w.g 22 swg copper wire EN29454 EN29453 swg copper wire datasheet 22 swg copper wire Halide 43C501D

    Senju

    Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
    Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).


    Original     		PDF SPT-70-OF-2063 Senju H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste Ultrasonic flow

    Senju

    Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
    Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).


    Original     		PDF SPT-70-OF-2063 Senju senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A

    7528A1317

    Abstract: ansi-j-std-006 raychem cable D60709
    Text: CUSTOMER DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. 3. TERMINATOR BODY: Copper alloy, solder- plated.


    Original     		PDF ANSI-J-STD-006. ANSI-J-STD-004. 5028A1317, 5026A1317, 7028A1317, 7528A1317, RG-178, D-607-09 11May ECO-11-005139 7528A1317 ansi-j-std-006 raychem cable D60709

    ANSI-J-STD-006

    Abstract: raychem cable 7528A1317 HEATSHRINKABLE solder SLEEVE
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. 3. TERMINATOR BODY: Copper alloy, solder- plated.


    Original     		PDF ANSI-J-STD-006. ANSI-J-STD-004. 5028A1317, 5026A1317, 7028A1317, 7528A1317, RG-178, D010089 D-607-09 04-Apr ANSI-J-STD-006 raychem cable 7528A1317 HEATSHRINKABLE solder SLEEVE

    PBT-GF30-FR

    Abstract: precidip 110 93 330 Preci-Dip Durtal SA C17200 CH-2800 110-PP-308-41-001001 299-PP-312-XX-001001 15X-PP-632-00-XXX001
    Text: Quick Selector Chart DIL / SIL / TO Sockets DIL Grid 2.54 mm 1.778 mm Sockets Solder tail DIL Sockets 101 102 Solder tail with decoupling capacitor 103 Solder tail ultralow profile 109 Solder tail interconnect 110 Surface mount pick and place Solderless press-fit


    Original     		PDF P-314-10-001001 110-PP-314-10-002001 110-PP-316-01-822001 110-PP-316-01-931001 110-PP-316-10-003001 110-PP-328-01-777001 110-PP-328-01-762001 510-PP-010-01-504101 510-PP-010-01-783101 510-PP-018-01-504101 PBT-GF30-FR precidip 110 93 330 Preci-Dip Durtal SA C17200 CH-2800 110-PP-308-41-001001 299-PP-312-XX-001001 15X-PP-632-00-XXX001

    Soldering Conditions

    Abstract: soldering
    Text: Recommended soldering conditions of EOREX Pb-Free products 1 Surface Mount Type SMD IR reflow with a peak temperature of 260°C Wave soldering with molten solder in a 260°C soldering bath Partial lead heating via a 350°C solder iron tip 2 Through Hole Type (THD) Wave soldering with molten solder in a 260°C soldering bath


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Lead Free Solder Page 1 of 2 Lead Free Solder Sn99 4901 99.3% tin and 0.7% copper M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu Tin/Copper alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to


    Original     		PDF J-Std-006 4901-112G 4901-227G 4901-454G 4901-2LB com/products/4901

    J-STD-006

    Abstract: D-110-35 ANSI-J-STD-004 ANSI-J-STD 004
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. Maximum Recovered I.D. - 0.76 0.030 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006.


    Original     		PDF J-STD-006. ANSI-J-STD-004. D000143 D-110-35 22-Mar-00 J-STD-006 D-110-35 ANSI-J-STD-004 ANSI-J-STD 004

    Raychem splice

    Abstract: ANSI-J-STD-006 RT-1404 raychem rt-1404 Raychem Specification RT-1404
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. Recovered I.D.: 1.90 0.075 max. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI-J-STD-006. FLUX:


    Original     		PDF ANSI-J-STD-006. ANSI-J-STD-004. D010097 D-110-0181 04-Apr Raychem splice ANSI-J-STD-006 RT-1404 raychem rt-1404 Raychem Specification RT-1404

    bellcore GR-78

    Abstract: J-STD-006 SAC305
    Text: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.


    Original     		PDF SAC305 J-Std-006 J-Std-006 4900-35G 4900-112G 4900-227G 4900-454G com/products/4900 bellcore GR-78 J-STD-006 SAC305

    full automatic Washing machines circuit diagram

    Abstract: automatic washing machine control system circuit fully automatic washing machine electronic circuit A6S-4101-H A6S-1104-PH 9101h full automatic Washing machines state diagram 4 pole 3 way rotary switch diagram
    Text: DIP Switch A6S-H Previous A6S Model Upgraded to Surface-mounting Type with Increased Solder Heat Resistance • Designed to enable replacement of previous (A6S) model, featuring the same dimensions and improved solder heat resistance (peak solder temperature: 260°C).


    Original     		PDF A6S-1101-H A6S-1102-H A6S-1104-H A512-E-01A full automatic Washing machines circuit diagram automatic washing machine control system circuit fully automatic washing machine electronic circuit A6S-4101-H A6S-1104-PH 9101h full automatic Washing machines state diagram 4 pole 3 way rotary switch diagram

    murata chip suppression filter NFA

    Abstract: NFA81
    Text: 2. Solder Paste Printing and Adhesive Application When reflow soldering the chip EMI suppression filter, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will prone to be


    Original     		PDF NFA3216G/3216D murata chip suppression filter NFA NFA81

    J-STD-004

    Abstract: J-STD-006 D-129-05
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. APPLICATION


    Original     		PDF J-STD-006. J-STD-004. 056x0 009x0 D-714-01. D000393 D-129-05 17-July-00 J-STD-004 J-STD-006 D-129-05

    J-STD-006

    Abstract: J-STD-004 raychem heat shrinkable sleeve J-STD-004 SN63 rol1 06090 ansi-j-std-006
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. APPLICATION


    Original     		PDF J-STD-006. J-STD-004. D-714-00. D010033 085x0 020x0 D-129-03 08-Feb J-STD-006 J-STD-004 raychem heat shrinkable sleeve J-STD-004 SN63 rol1 06090 ansi-j-std-006

    06090

    Abstract: J-STD-006 ansi-j-std-006 raychem solder sleeve ANSI-J-STD-004
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn96 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. APPLICATION


    Original     		PDF J-STD-006. ANSI-J-STD-004. D060359 D-210-0213 7-Nov-06 06090 J-STD-006 ansi-j-std-006 raychem solder sleeve ANSI-J-STD-004

    J-STD-006

    Abstract: 06090 ansi-j-std-006 J-STD-004 solder sn63 j-std-004
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. APPLICATION


    Original     		PDF J-STD-006. J-STD-004. D010037 D-129-0043 08-Feb J-STD-006 06090 ansi-j-std-006 J-STD-004 solder sn63 j-std-004

    Raychem splice

    Abstract: J-STD-006
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004.


    Original     		PDF J-STD-006. ANSI-J-STD-004. D990733 D-110-0071 06-July-00 Raychem splice J-STD-006

    IR-1052

    Abstract: J-STD-006 ansi-j-std-004 a solder wire
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROM1 per ANSI-J-STD-004. APPLICATION


    Original     		PDF J-STD-006. ANSI-J-STD-004. IR-1052 D990722 D-110-0090 06-July-00 J-STD-006 ansi-j-std-004 a solder wire

    D-110

    Abstract: J-STD-006 ANSI-J-STD-004 HEATSHRINKABLE solder SLEEVE
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004.


    Original     		PDF J-STD-006. ANSI-J-STD-004. D-110-40 06-July-00 D990948 D-110 J-STD-006 ANSI-J-STD-004 HEATSHRINKABLE solder SLEEVE

    thermofit insulation

    Abstract: No abstract text available
    Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. APPLICATION


    Original     		PDF J-STD-006. J-STD-004. D-141-19 D000399 17-July-00 thermofit insulation

    Untitled

    Abstract: No abstract text available
    Text: PCMCIA and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Solder-Flux Bearing Lead Connector Soldering Equipment Reduced applied cost with increased output. Interconnection Systems •* H#1' , f f / / ^ ,_


    OCR Scan     		PDF SZGH88A

    Untitled

    Abstract: No abstract text available
    Text: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering


    OCR Scan     		PDF IS09001 ISO9001

    TEKAS00056

    Abstract: No abstract text available
    Text: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering


    OCR Scan     		PDF IS09001 TEKAS00056 IS0900? TEKAS00056