H63A Search Results

LQN4N

Abstract: C2404 LQN21
Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. 7.5 1.5 3.0 LQH4N LQN4N LQH4C Solder:Use H60A,H63A JIS Z 3282 or equivalent. Use solder paste equivalent to H60A for

LQH3ER

Abstract: MURATA LQW18A H60A H63A LQH43C LQH43M LQH43N LQW18A jis magnetic
Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. LQH43M LQH43N LQH43C 1.5 3.0 7.5 1.5 1.5 1.5 Land Pattern Solder Resist in mm Solder : Use H60A,H63A JIS Z 3282 or equivalent.

flux NF-3000

Abstract: C2404 LQN21A LQG3 LQS33N MURATA LQH
Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. Solder:Use H60A,H63A JIS Z 3282 or equivalent. Use solder paste equivalent to H60A for LQP10A/11A and LQG10A/11A.

JIS-C-0021

Abstract: H63A H60A
Contextual Info: E. Reliability Test; No. 1 Item Solderbility Condition Temperature: 230° ± 5°C Solder time: 3 ± 0.5 seconds Solder: H60A or H63A Flux: 75% Methanol and 25% Rosin Temperature: 260° ± 5°C Solder time: 10 ± 1 seconds Solder: H60A or H63A Flux: 75% Methanol and

175G

Abstract: E41515 omron g6s-2
Contextual Info: Omron 08 Cat 1-302 5/10/07 15:39 Page 230 Surface-Mounting Signal Relay – G6K Text Text Surface-Mounting Signal Relay – G6S Precautions Surface-Mounting DPDT Relay • ROHS compliant. Handling Leave the Relay unpacked until mounting it. Soldering Solder: JIS Z3282, H63A

H63A

Abstract: inductor design AIML-0603
Contextual Info: RELIABILITY AND TEST CONDITIONS ACML Series • Terminal Strength: 0.5Kg min, 30±5 seconds, the terminal shall not break off. • Solderability: Preheat 120°C to 150°C for 60 seconds. Solder : H63A eutectic solder Solder temperature: 230±5°C. Flux: Rosin. Dip time: 4±1 seconds.

H63A

Abstract: H60A
Contextual Info: F. Reliability Test; No. 1 Item Solderbility Condition Temperature: 230° ± 5°C Solder time: 3 ± 0.5 seconds Solder: H60A or H63A Flux: 75% Methanol and 25% Rosin Temperature: 260° ± 5°C Solder time: 10 ± 1 seconds Solder: H60A or H63A Flux: 75% Methanol and

H60A

Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. Reflow soldering should be applied for LQS33N 5.5 1.0 2.0 LQH3Nxx24/3Cxx24 LQS33N Solder:Use H60A,H63A JIS Z 3282 or equivalent.

Senju

Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

Senju

Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

H63A

Contextual Info: RELIABILITY AND TEST CONDITIONS ACML Series • Terminal Strength: 0.5Kg min, 30±5 seconds, the terminal shall not break off. • Solderability: Preheat 120°C to 150°C for 60 seconds. Solder : H63A eutectic solder Solder temperature: 230±5°C. Flux: Rosin. Dip time: 4±1 seconds.

Contextual Info: Test and Reliability Data Environmental Data MECHANICAL Test Number Test Methods Requirement 1 Solderability After steam aging, immerse in the solder H63A of 230 ±5° for 3 ±0.5 seconds. Approximately 95% of the terminal should be covered with new solder.

33pF Y2 murata x7r 1808 capacitor

Abstract: GR721 GA355 E 203 M 1KV GA342QR7GD102KW01L X7T voltage dependence IEC6038 GRJ31CR72E104KWJ3L Fuse 250V 1A GMA 1 GR72
Contextual Info: !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.

CC0201

Abstract: C0603C0G1E0R7W C0603C0G1E100DT c0603c0g1e5r6
Contextual Info: C Series High Q Capacitors Type: C0603 [EIA CC0201] Issue date: April 2011 TDK MLCC US Catalog Version B11 REMINDERS Please read before using this product SAFETY REMINDERS REMINDERS 1. 2. 3. 4. 5. 6. 7. If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other

2j 103k

Contextual Info: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C3216C0

Abstract: C3225X7S2A475K C1005 C1608 C2012 C3216 C3225 C4532 C3216C0G2J CC0805
Contextual Info: C Series Mid Voltage Application Type: C1005 [EIA CC0402] C1608 [EIA CC0603] C2012 [EIA CC0805] C3216 [EIA CC1206] C3225 [EIA CC1210] C4532 [EIA CC1812] C5750 [EIA CC2220] Issue date: January 2011 TDK MLCC US Catalog Version A11 REMINDERS Please read before using this product

reliability BLM21pg331sn1

Abstract: IC-7404 IC 7404 271 Ceramic Disc Capacitors 74ALS00 BLM41AF800SN1 BLM31AJ601SN cha 0438 VFS9VD31B223 BLM21BB331SN1
Contextual Info: !Note Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this PDF catalog to prevent smoking and/or burning, etc. This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

2482S

Abstract: mm1167 LQG15HS27NJ02 MURATA VCO Series 2.4GHz Cordless Phone circuit diagram CHOKE RF 1206 LQH MURATA LQH55DN102M03 LQH66SN100M03 LQH32MN1R5 SMD MARKING CODE N03
Contextual Info: !Note Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this PDF catalog to prevent smoking and/or burning, etc. This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

05c06

Abstract: SAMSUNG CHIP CAPACITOR CL series H63A cap. 1000 uf 50v dip
Contextual Info: Multilayer Chip Capacitors – High Frequency FEATURE Inner Electrode Ceramic Body Cu or Ni Outer Electrode Cu Ni Sn/Pb - LOW ESR at high frequencies - High Q at high frequencies - Stable C0G temperature coefficient - Ultra-Miniature Size - Highly Reliable Performance

100812

Abstract: H63A
Contextual Info: Ferrite Chip EMI Suppressors ACB Series RELIABILITY AND TEST CONDITIONS Item Performance Operating temperature range -2 5 to +85°C Test conditions Storage temperature and humidity ranges 40°C max., 70%RH max. Soldering heat resistance The chip must have no cracks.

Contextual Info: No. MLPGE11010 PRODUCT SPECIFICATION P/N: FI212L062009-T Type: MULTILAYER FILTER Soldering : Reflow only Issue date: 14.Feb.2011 Applicable products to RoHS restriction TAIYO YUDEN CO., LTD. MULTILAYER FILTER Table of Contents 1. Scope 2. Part Numbering System

Contextual Info: NO.MLPGE10021 SPECIFICATIONS HIGH FREQUENCY MULTILAYER CHIP FILTER Fl 168D087018-T TAIYO YUDEN CO., LTD. Date :4.Aug.2010 HIGH FREQUENCY MULTILAYER CHIP FILTER Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification 3-1 Electrical Characteristics

Contextual Info: NO.MLPGE10028 SPECIFICATIONS HIGH FREQUENCY MULTILAYER CHIP FILTER FI 212B448802-T TAIYO YUDEN CO., LTD. Date: 20.0ct.2010 HIGH FREQUENCY MULTILAYER CHIP FILTER Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification 3-1 Electrical Characteristics

271 Ceramic Disc Capacitors

Abstract: VFS9VD31B223 DLM11 microwave product 74ALS00 Wireless Speakers/Headphones Murata varistor DSS6NF31C223 EN55015 EN55015 driver
Contextual Info: !Note Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this PDF catalog to prevent smoking and/or burning, etc. This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.