Solder paste volume
Abstract: No abstract text available
Text: HSDL-2XXX Surface Mount Technology Assembly Application Note 1138 Solder Pad, Mask and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1. Stencil and PCBA Recommended Land Pattern for HSDL-2XXX
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5966-3027E
Solder paste volume
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solder stop mask
Abstract: No abstract text available
Text: PCBs for SMD Solder Practice RE715001-LF - PCB for pick-and-place of fine pitch QFP 256 - a challenge to the solder equipment - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree ; solder stop mask and additional print
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RE715001-LF
solder stop mask
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RSLP8
Abstract: No abstract text available
Text: PRODUCTS Type Photo Link Module Mounting Pad Specification RSLP8 H12 Recommended land pattern (note) Deviation from above dimensions is necessary as the conditions of - cleanness of circuit boards - solder strength - pattern precision of solder mask - solder bridge
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Untitled
Abstract: No abstract text available
Text: PCBs for SMD Solder Practice RE713001-LF - PCB for solder practices pick-and-place for BGA 169 and 225 grid 1.50 mm including daisychain test points - introduction into trend-setting technology - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree ; solder stop mask and additional print
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RE713001-LF
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RE714001-LF
Abstract: Re714
Text: PCBs for SMD Solder Practice RE714001-LF - PCB for solder practices for SMD fine pitch QFP 208 - the new standard technology 0.50 mm - for manual soldering and pick-and-place very well suitable - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree ; solder stop mask and additional print
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RE714001-LF
RE714001-LF
Re714
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Photo Modules
Abstract: No abstract text available
Text: PRODUCTS Type Photo Link Module Land pattern RSLP8-H14 Recommended land pattern UNIT:mm ETH669 note Deviation from above dimensions is necessary as the conditions of - cleanness of circuit boards - solder strength - pattern precision of solder mask - solder bridge
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RSLP8-H14
ETH669
Photo Modules
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RSLP7-H16
Abstract: photo photo diode Photo Modules photo transistor
Text: PRODUCTS Type Photo Link Module Land pattern RSLP7-H16 Recommended land pattern UNIT:mm ETH670 note Deviation from above dimensions is necessary as the conditions of - cleanness of circuit boards - solder strength - pattern precision of solder mask - solder bridge
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RSLP7-H16
ETH670
photo
photo diode
Photo Modules
photo transistor
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solder mask
Abstract: photo transistor diode bridge photo diode SRSLP7-H11 bridge datasheet transistor photo free download transistor data sheet free transistor equivalent book free transistor equivalent book download
Text: PRODUCTS Type Photo Link Module Land pattern SRSLP7-H11 Recommended land pattern UNIT:mm ETH667 note Deviation from above dimensions is necessary as the conditions of - cleanness of circuit boards - solder strength - pattern precision of solder mask - solder bridge
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SRSLP7-H11
ETH667
solder mask
photo transistor
diode bridge
photo diode
bridge
datasheet transistor photo
free download transistor data sheet
free transistor equivalent book
free transistor equivalent book download
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CHIP TANTAL
Abstract: SOT-143 tantal 1206 melf
Text: PCB for Introduction to SMD Surface Mounting RE711001-LF - board for introducing solder practice, suitable for pick & place - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air levelling HAL-leadfree - solder stop mask and additional print
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RE711001-LF
SOM16:
CHIP TANTAL
SOT-143
tantal
1206 melf
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smd transistor 2x
Abstract: SMD transistor 2x sot 23 2x smd
Text: TSSOP-SMD Multiadapter thin shrink small outline package RE710001-LF - PCB for SMD standard and fine pitch solder practices - also suitable for pick-and-place. - EPOXY resin FR4 1.50 mm, single-sided 35 µm CU - Solder side hot air leveling coated (HAL-leadfree), solder stop mask and additional print
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RE710001-LF
smd transistor 2x
SMD transistor 2x sot 23
2x smd
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3m 4200
Abstract: No abstract text available
Text: 3M Pak 20 Thru-Board Socket 2 mm x 2 mm Straight, Solder Tails 1532 Series S S S S S S High temperature dielectric IR and wave solder compatible Maximizes use of PC board space Integral solder mask plug Minimizes PC board stacking heights End and side stackable feature
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TS-0522-15
QQ-N-290,
MIL-G-45204,
MIL-P-81728
3m 4200
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epoxy resin
Abstract: No abstract text available
Text: PCB for Pick and Place of Fine Pitch QFP 256 RE715001-LF - PCB for pick-and-place of fine pitch QFP 256 - a challenge to the solder equipment - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree , solder stop mask and additional print
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RE715001-LF
epoxy resin
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sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
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Untitled
Abstract: No abstract text available
Text: 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.
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DP7310J
SN74ACT564DWJ
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
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DP7310J
Abstract: ASTM-B16-85
Text: 3155-111-18N REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.
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3155-111-18N
DP7310J
SN74ACT564DWJ
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
DP7310J
ASTM-B16-85
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TC-2419
Abstract: TC-527 TC-447 TC-527HB LB 2 resin compound TC-564-1 Tc 521 A latex TC530
Text: Techform Products E L E C T R O N I C S, I N C. Temporary Solder Masks and Adhesives are now available through Kester's Techform line. The solder masks are applied to printed circuit boards to prevent solder from flowing onto edge connectors, gold fingers, or empty through-holes. The adhesives are designed to form a bond that will maintain
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4662-SM
2331-ZX
TC-2419
TC-527
TC-447
TC-527HB
LB 2
resin compound
TC-564-1
Tc 521 A
latex
TC530
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RSLP8
Abstract: diode E4 mounting pad diode bridge free transistor equivalent book photo diode photo transistor Photo Modules specification sheet of diode transistor equivalent book
Text: PRODUCTS Type Photo Link Module Mounting Pad Specification RSLP8 Top view Recommended land pattern Packaging : E4 (note) Deviation from above dimensions is necessary as the conditions of - cleanness of circuit boards - solder strength - pattern precision of solder mask
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M705-GRN360-MZ
Abstract: M705-GRN360 M705-GRN360-M-Z NC257 senju solder bar WLCSP stencil design
Text: AN11046 DSN0603-2 SOD962 soldering requirements Rev. 1 — 1 June 2012 Application note Document information Info Content Keywords DSN0603-2 (SOD962), 0201 package size, reflow soldering, surface mount, solder paste, solder mask opening, Printed-Circuit Board (PCB),
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AN11046
DSN0603-2
OD962)
M705-GRN360-MZ
M705-GRN360
M705-GRN360-M-Z
NC257
senju solder bar
WLCSP stencil design
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE931-05PI - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 28 - size 13.0 x 23.5 mm
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RE931-05PI
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Untitled
Abstract: No abstract text available
Text: Accu-Pak PCB Mountable Connectors with Solder Resist Technology Zierick’s Accu-Pak™ connector line now features optional NEW technology to prevent solder from wicking onto the internal contact areas during the wave solder process. Zierick’s TapeResist™ solder masking technology is
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SOLDERING REFLOW smt
Abstract: No abstract text available
Text: MOUNTING PROCEDURES FOR SURFACE MOUNT COMPONENTS Pulsar Microwave Corporation recommends that our surface mount SMT components be mounted using a controlled amount of solder with a specific temperature reflow pattern. A common technique used for applying solder is to print a pattern of solder paste on the PC board (called a solder mask).
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Untitled
Abstract: No abstract text available
Text: 2mm X 2mm Thru Board Socket Straight, Solder Tails 1532 Series High temperature dielectric IR and wave solder compatible Maximizes use of PC board space Integral solder mask plug Minimizes PC board stacking heights End stackable feature Side stackable feature
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TS-0522-10
QQ-N-290,
MIL-G-45204,
MIL-P-81728
X1532XX-600XXX
TS-0522-09
TD35312
D004245
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Untitled
Abstract: No abstract text available
Text: 2mm X 2mm Thru Board Socket Straight, Solder Tails 1532 Series • • • • • • • High temperature dielectric IR and wave solder compatible Maximizes use of PC board space Integral solder mask plug Minimizes PC board stacking heights End stackable feature
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TS-0522-10
QQ-N-290,
MIL-G-45204,
MIL-P-81728
X1532XX-600XXX
TS-0522-09
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W8X00
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; SEE TABLE 1 FOR LAND PAD AND SOLDER MASK COORDINATES; SEE TABLE 2 FOR SOLDER PASTE STENCIL COORDINATES. 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS4802X
W8X00
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