DP7310J
Abstract: ASTM-B16-85
Text: 3155-111-18N REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.
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Original
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PDF
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3155-111-18N
DP7310J
SN74ACT564DWJ
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
DP7310J
ASTM-B16-85
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Untitled
Abstract: No abstract text available
Text: 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.
|
Original
|
PDF
|
DP7310J
SN74ACT564DWJ
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
|
DP7310J
Abstract: No abstract text available
Text: 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.
|
Original
|
PDF
|
DP7310J
SN74ACT564DWJ
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
DP7310J
|