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    SOLDER BALL SHEAR Search Results

    SOLDER BALL SHEAR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SOLDER BALL SHEAR Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    TEXTOOL

    Abstract: No abstract text available
    Text: 3M Textool™ Test & Burn-In Ball Grid Array Sockets 0.80 mm pitch, Types I, II, III and IV 9000 Series • Double-beam normally-closed contact delivers • • • • • • balanced, opposing forces to solder ball with minimal shear stress Contact tips touch ball above its center plane


    Original     		TS-9000-05 RIA-2217-B TEXTOOL PDF

    foxconn mPGA478

    Abstract: MPGA478 SOCKET 94-V0 MPGA478 SOCKET retention 94V-0 m 94v-0 mPGA478
    Text: SPECIFICATIONS mPGA478 Socket BGA Series CPU Socket Vertical, SMT Type 1.27mm [.050”] Pitch 478 Pos. Mechanical Socket Engagement/Disengagement Force: 4.5Kg max. Durability: 50 Cycles min. Socket Retention Force: 10g min. Solder Ball Shear Force: 500g min.


    Original     		mPGA478 26X26 foxconn mPGA478 MPGA478 SOCKET 94-V0 MPGA478 SOCKET retention 94V-0 m 94v-0 PDF

    AMD socket s1

    Abstract: Foxconn socket amd "socket s1" socket s1 BGA638 638 amd foxconn z638 amd socket s1 mechanical
    Text: SPECIFICATIONS BGA638 Socket BGA Series CPU Socket Vertical, SMT Type 1.27 mm [.05”] Pitch 638 Pos. Mechanical Socket Engagement/Disengagement Force: 3.3Kg max. Durability: 30 Cycles min. Socket Retention Force: 65g/Pos. min. Solder Ball Shear Force: 750g min.


    Original     		BGA638 65g/Pos. 1000M AMD socket s1 Foxconn socket amd "socket s1" socket s1 638 amd foxconn z638 amd socket s1 mechanical PDF

    Solder ball shear

    Abstract: No abstract text available
    Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 Solder ball shear PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 PDF

    Solder ball shear

    Abstract: LGA resistance
    Text: SPECIFICATIONS VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 Solder ball shear LGA resistance PDF

    BGA754

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 754 LP BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05X. 05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max.


    Original     		13kgf 1000gf 1000m 754Pic, 754Pos. BGA754 foxconn PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 PDF

    AM2 socket bga

    Abstract: Socket AM2 Design Specification bga solder ball shear am2 specification am2 socket specification foxconn
    Text: SPECIFICATIONS BGA 940 AM2 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05”] Pitch 940 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. Electrical Contact Resistance : 25 mΩ max.


    Original     		13kgf 750gf 240gf 1000m 31X31 AM2 socket bga Socket AM2 Design Specification bga solder ball shear am2 specification am2 socket specification foxconn PDF

    socket 939

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 939 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”]Pitch 939 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. Electrical Contact Resistance : 20 mΩ max.


    Original     		13kgf 750gf 240gf 1000m Type50 31X31 socket 939 foxconn PDF

    BGA754

    Abstract: Solder ball shear
    Text: SPECIFICATIONS BGA 754 DT BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 BGA754 Solder ball shear PDF

    BGA775

    Abstract: CPU 775 PE0775 foxconn 94V-0 LG
    Text: SPECIFICATIONS LGA/BGA 775 DT LG A/ BG A CPU Socket LG A SM T Type 1,09X1.17mm[0.043X.046”] Pitch 775 Pos. Mechanical Socket Engagement Force: 3.9kgf max. Socket Disengagement Force: 1kgf max. Durability: 20 Cycles min. Solder Ball Shear Force: 500gf min.


    Original     		500gf 12pin/chian) 33X30 15X14 BGA775 CPU 775 PE0775 foxconn 94V-0 LG PDF

    94V-0 LG

    Abstract: socket 775 Foxconn BGA775
    Text: SPECIFICATIONS LGA/BGA 775 DT LG A/ BG A CPU Socket LG A SM T Type 1,09X1.17mm[0.043X.046”] Pitch 775 Pos. Mechanical Socket Engagement Force: 3.9kgf max. Socket Disengagement Force: 1kgf max. Durability: 20 Cycles min. Solder Ball Shear Force: 500gf min.


    Original     		500gf 12pin/chian) 33X30 15X14 94V-0 LG socket 775 Foxconn BGA775 PDF

    500gf

    Abstract: BGA package tray 40 x 40 foxconn
    Text: SPECIFICATIONS BGA 959 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 959 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 500gf min. Electrical Contact Resistance : 25 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 500gf 1000m 959Pos. 32X32 BGA package tray 40 x 40 foxconn PDF

    BGA754

    Abstract: Solder ball shear
    Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 BGA754 Solder ball shear PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS BGA 939 BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05 X.05”] Pitch 939 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. Electrical Contact Resistance : 20 mΩ max.


    Original     		13kgf 750gf 240gf 1000m PDF

    bga solder ball shear

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos 754Pos. 29X29 bga solder ball shear foxconn PDF

    BGA754

    Abstract: Solder ball shear bga solder ball shear foxconn
    Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754PoV-0 754Pos. 29X29 BGA754 Solder ball shear bga solder ball shear foxconn PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS BGA 700 BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05 X.05”] Pitch 700 Pos. Mechanical Contact Rentention Force: 65gf min. Durability: 50 Cycles min. Solder Ball Shear Force: 500 gf min. Electrical Contact Resistance : 35 mΩ max. Insulation Resistance: 800mΩ min.


    Original     		003-S 700Pos. Sn/Ag/Cu800m PDF

    94v-0 lf

    Abstract: Solder ball shear foxconn cpu socket 940
    Text: SPECIFICATIONS Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. BGA 940 AM2 T2 BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05X. 05”] Pitch 940 Pos. Electrical Contact Resistance : 25 mΩ max.


    Original     		13kgf 750gf 240gf 1000m 94v-0 lf Solder ball shear foxconn cpu socket 940 PDF

    foxconn

    Abstract: BGA754
    Text: SPECIFICATIONS BGA 754 DT BG A CPU Socket BG A SM T Type 1.27X1.27mm[.05X. 05”]Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 foxconn BGA754 PDF

    TB478

    Abstract: IPC-A610A
    Text: PCB Assembly Guidelines for Shell-Op 3D Package Technical Brief Introduction The Shell-Op 3D package is a cavity package that utilizes a glass lid and is attached to the board via a solder ball array. The glass lid allows the detector on the die surface to sense blue


    Original     		TB478 IPC-A610A PDF

    Untitled

    Abstract: No abstract text available
    Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12


    Original     		PDF

    208z

    Abstract: SSZA002 Texas Instruments Philippines PBGA 23X23 0.8 pitch tray 23X23 376ZDW high current pogo pin shape 23x23 tray 27X27
    Text: Application Report SSZA002 – August 2009 Plastic Ball Grid Array PBGA . SSZA002 – August 2009 Submit Documentation Feedback


    Original     		SSZA002 208z SSZA002 Texas Instruments Philippines PBGA 23X23 0.8 pitch tray 23X23 376ZDW high current pogo pin shape 23x23 tray 27X27 PDF