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    SOLDER Search Results

    SOLDER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
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    SOLDER Price and Stock

    Digi-Key DKS-SOLDERBREAD-02

    BREADBOARD GENERAL PURPOSE PTH
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    DigiKey DKS-SOLDERBREAD-02 Bulk 3,428
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    Digi-Key DKS-SOLDERBREAD-01

    BREADBOARD GENERAL PURPOSE PTH
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    DigiKey DKS-SOLDERBREAD-01 Bulk 2,084 1
    • 1 $0.58
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    • 100 $0.581
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    Sierra Wireless MANGOHYELLOW_7702_SOLDERED

    MANGOH YELLOW WP7702 APP BOARD
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    DigiKey MANGOHYELLOW_7702_SOLDERED Box 1,984 1
    • 1 $156.25
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    LEDIL C18696_SOLDER-CLIP-2

    ACCESSORY7.0 X 3.3MM (D)7.79MM(H
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey C18696_SOLDER-CLIP-2 Reel 640 650
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    C18696_SOLDER-CLIP-2 Digi-Reel 640 1
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    C18696_SOLDER-CLIP-2 Cut Tape 640 1
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    Avnet Americas C18696_SOLDER-CLIP-2 Reel 650
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    Mouser Electronics C18696_SOLDER-CLIP-2 747
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    Newark C18696_SOLDER-CLIP-2 Reel 1
    • 1 $0.24
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    Chip Quik Inc SOLDERWICK1.5

    1.5MM SOLDER WICK NO CLEAN
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    DigiKey SOLDERWICK1.5 Bulk 458 1
    • 1 $1.99
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    Mouser Electronics SOLDERWICK1.5 622
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    SOLDER Datasheets (7)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    Solder Philips Semiconductors Package information Original PDF
    Soldering Recommendations ACP NXP Semiconductors Soldering Recommendations ACP Original PDF
    Soldering recommendations for Ldmos Power Amplifiers (1) NXP Semiconductors Soldering recommendations for Ldmos Power Amplifiers (1) Original PDF
    SOLDERRM On Semiconductor Soldering and Mounting Techniques Reference Manual Original PDF
    SOLDERWICK1.5 Chip Quik 1.5MM SOLDER WICK NO CLEAN Original PDF
    SOLDERWICK2.0 Chip Quik 2.0MM SOLDER WICK NO CLEAN Original PDF
    SOLDERWICK2.8 Chip Quik 2.8MM SOLDER WICK NO CLEAN Original PDF

    SOLDER Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TOSHIBA ADDC

    Abstract: No abstract text available
    Text: TL19W01-D T32 TOSHIBA LED lamps TL19W01-D(T32 ○ Surface-mount devices Unit: mm 3.1 (L mm x 3.8 (W) mm × 0.65 (H) mm size • High luminous flux LED : 110 lm(typ.) @ IF=300 mA • Color: white (6500K) • Reflow-soldering is available • Applications : general lighting and etc.


    Original     		PDF TL19W01-D 6500K) TOSHIBA ADDC

    SMD 0402

    Abstract: No abstract text available
    Text: 2381 553 2.6/MLV0402E3.3T Vishay BCcomponents SMD 0402 Multilayer Varistor FEATURES • Surface mount multilayer surge suppressor  Inherent bidirectional clamping  Excellent energy/volume ratio  Suitable for reflow soldering  Compliant to RoHS directive 2002/95/EC


    Original     		PDF 6/MLV0402E3. 2002/95/EC 2002/96/EC 2011/65/EU 2002/95/EC. 2011/65/EU. 12-Mar-12 SMD 0402

    40MT160

    Abstract: 40MT140 100mt160
    Text: 40MT1.0P.PbF, 70MT1.0P.PbF, 100MT1.0P.PbF Series Vishay High Power Products Three Phase Bridge Power Module , 45 A to 100 A FEATURES • Low VF • Low profile package • Direct mounting to heatsink • Flat pin/round pin versions with PCB solderable terminals


    Original     		PDF 40MT1 70MT1 100MT1 E78996 2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 40MT160 40MT140 100mt160

    Untitled

    Abstract: No abstract text available
    Text: P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 15x15 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,


    Original     		PDF 96-160M65 160-Position, 15x15 C36000, B16/B16M B579-73 AMS-QQ-N-290 96-160M65-P

    BY252P

    Abstract: No abstract text available
    Text: BY251P thru BY255P Vishay General Semiconductor General Purpose Plastic Rectifier FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 A • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in


    Original     		PDF BY251P BY255P 22-B106 2002/95/EC 2002/96/EC DO-201AD AEC-Q101 DO-201AD, 2011/65/EU 2002/95/EC. BY252P

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 3158-0-00-15-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-15-00-00-03-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL:


    Original     		PDF C36000) C/885 2002/95Annex

    9940

    Abstract: mal215099xxxe3 MAL215099 99101E3 99804E3 150631-2 99103E3 99515E3 99603E3 MAL215
    Text: 150 CRZ www.vishay.com Vishay BCcomponents Aluminum Capacitors SMD Chip , Very Low Z FEATURES • Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing • SMD-version with base plate, lead (Pb)-free reflow solderable • Very low impedance, very high ripple current


    Original     		PDF J-STD-020 AEC-Q200 MAL215099. 9991trademarks 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 9940 mal215099xxxe3 MAL215099 99101E3 99804E3 150631-2 99103E3 99515E3 99603E3 MAL215

    Untitled

    Abstract: No abstract text available
    Text: P300A thru P300M Vishay General Semiconductor General Purpose Plastic Rectifier FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 A • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in


    Original     		PDF P300A P300M 22-B106 2002/95/EC 2002/96/EC DO-201AD AEC-Q101 DO-201AD, 2011/65/EU 2002/95/EC.

    Vitreous enamel coating wirewound

    Abstract: No abstract text available
    Text: 210 Series Features • Terminals suitable for soldering or bolt connection. • Adjustable lug supplied. • High wattage applications. • All-welded construction. • Rugged lead free vitreous enamel coating. • Flame resistant coating. • Thumb-screw-adjustable lug


    Original     		PDF 1-866-9-OHMITE Vitreous enamel coating wirewound

    MILL-MAX

    Abstract: No abstract text available
    Text: Product Number: 3158-0-00-01-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-01-00-00-03-0 200 - 300 " Tin/Lead over Nickel 00 RoHS Compliant SHELL MATERIAL:


    Original     		PDF C36000) C/885 2002/95Annex MILL-MAX

    2331-ZX

    Abstract: Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650
    Text: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than


    Original     		PDF 2331-ZX 2331-ZX. J-STD-004, IPC-TM-650, 04Jun07 Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650

    Untitled

    Abstract: No abstract text available
    Text: Board to Board Connectors FH Free Height 0.8mm Pitch Connectors Board to Board SMT Typed/With Solder Peg Receptacle Assemblies Applicable Board Stacking Heights = 5mm/6mm/7mm/8mm Material and Finish: Housing- UL94V-0 rated, heat-resistant thermoplastic,


    OCR Scan     		PDF UL94V-0 -177984-Q 179485-D* -179029-D 2-179485-D* -179030-n 4-179485-Q* 6-179485-D*

    Untitled

    Abstract: No abstract text available
    Text: h- .5 0 - - .2 5 0 |.0 7 5 — .19 r t 1 t 1 RF□ 0 5 5 -1 r .031 — c ri T -lo .38 T - .35 1 I IF MATERIAL El STANDARD □ SPECIAL ° BASE o COVER ° MARKING » FINISH F R -4 VECTRA LASER SOLDER TIN HIGH DYNAMIC RANGE DOUBLE BALANCED MIXER MAX


    OCR Scan     		PDF MXR/6EF-02HD

    Untitled

    Abstract: No abstract text available
    Text: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. REVISIONS LOC DIST CM 00 LTR DESCRIPTION K .125/3 POST BOTH .225 + .010 II .005 MEASURED P LA S TIC PARTS D 05 APPLY AT TO SOLDER


    OCR Scan     		PDF 08JULY2005 08JULY2005 31MAR2000

    Untitled

    Abstract: No abstract text available
    Text: CO NOTES: 1 .MATERIAL: HOUSiNG : THERMOPLASTIC CONTACT : COPPER ALLOY. SHELL : COPPER ALLOY. CD O O + ü 15.2 0 1 4.50 2 .FINISH: CONTACT: GOLD PLATING SEE TABLE ON CONTACT AREA TIN-LEAD ON SOLDER TAILS. NICKEL UNDERPLATED OVER ALL SHELL: NICKEL PLATING OVER COPPER.


    OCR Scan     		PDF 36Kg/R

    Untitled

    Abstract: No abstract text available
    Text: 3 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 2 - LOC ALL RIGHTS RESERVED. CM DIST R E VIS IO N S LTR R DESCRIPTION EC 0G3B 0 2 4 9 DATE DWN 24SEP05 05 1. FITS SOCKET HOUSING 2. ASSEMBLY CONFORMS TO AMP SOLDERABILITY


    OCR Scan     		PDF 24SEP05 27APR95 27APR98

    ECRE

    Abstract: No abstract text available
    Text: 5 -7 Precaution of Assembly for Mini Flat Coupler 5 -7 -1 ) Soldering A vo id th e rise o f device te m p e ra tu re as m u ch as p ossible by th e fo llo w in g c o n d itio n s . a) S old e ring lead d ire c tly by so ld e r header) 26CTC M a x ., 1 0 second M ax.


    OCR Scan     		PDF 26CTC ECRE

    Untitled

    Abstract: No abstract text available
    Text: 4. Solder-mounting Flat Package ICs 1. Soldering conditions a. Soldering iron Solder a t lead tem p eratu re of 2 6 0 t for no m ore than 10 seconds or a t 350°C fo r no m ore th a n 3 seconds. b. Infrared reflow 1 W e recom m end heating m ethods in far-interm ediate infrared shown a t the top and bottom of


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Special Connectors Battery Connectors 2.5mm/3.0mm Pitch 3.0mm Pitch, Plug Assembly 8 Position, Material and Finish : Housing — Thermoplastic UL94V-0 rated, black Contact — Copper Alloy, Nickel-underplated all over, tin-lead plated on soldering area Housing


    OCR Scan     		PDF UL94V-0

    D325

    Abstract: No abstract text available
    Text: 8 Manufacturing date c o n s i s t i n g o f : 2 d i g i t s f o r the year Y Y , 2 d i g i t s old P/N Tyco (without the week ( WW) and 1 digit for the day -x-xxxxxxx-x V Code 0,6 P/N TYCO V Soldering/Wire-Wrap pins V42254-) 00 -0. 4 YYWWD +XXXX-+XXX


    OCR Scan     		PDF DIN41612 IEC603-2 V42254-) V42254- -D325 SR10-0177-03 SR10-0157-02 V42254-B1xxx-D325- D325

    Untitled

    Abstract: No abstract text available
    Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. REVISIONS DIST CM LTR T DESCRIPTION DATE DWN BSV RCJ 27SEP05 EC 0G3B 0249 05 APVD ANTI SOLDER WICKING TAB FITS SOCKET HOUSING 640525.


    OCR Scan     		PDF 27SEP05 Z8APR98

    OV 5693

    Abstract: No abstract text available
    Text: / j \ HOUSING & TINE PLATE - LIQUID CRYSTAL POLYMER LC P , UL 9 4 V —0 , BLACK. 2. CONNECTOR SOLDER TAILS WILL ACCOMMODATE PRINTED CIRCUIT BOARD THICKNESS OF 0 .8 TO 1.6 [.0 3 1 TO .0 6 3 ], ^ G, J, H INDICATE NUMBER OF POSITION MARKED ON ASSEMBLY. ALSO SEE TABLE.


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 3 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 2 - LOC ALL RIGHTS RESERVED. CM DIST R E VIS IO N S LTR N D o ASSEMBLY CONEORMS TO AMP SOLDERABILITY SPEC. 1 0 9 - 1 1 - 3 . C UL AND o .020 .0 6 3 BSV RCJ


    OCR Scan     		PDF 28APR98 28APR98

    Untitled

    Abstract: No abstract text available
    Text: Electronics Standard Edge II Card Edge Connectors Solder Type Board-to-Board Connectors .100 [2.54] Centerline Vertical Solder Posts, Retention Feature, Without Mounting Ears M a te ria l and F in is h : .064 [1.63] Sq. X .130 [3.301 Dp. — Intercontact Key Slot


    OCR Scan     		PDF