Untitled
Abstract: No abstract text available
Text: Eu <^£.mL-donaactoi Lrroaucti, One. TELEPHONE: 973 376-2922 20 STERN AVE. SPRINGFIELD, NEW JERSEY 07081 U.S.A. (212)227-6005 FAX: (973) 376-8960 Schottky Barrier Rectifier MBR16150 FEATURES • Low Forward Voltage » /-^ • • 170°C Operating Junction Temperature
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MBR16150
O-220C
26CTC
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ECRE
Abstract: No abstract text available
Text: 5 -7 Precaution of Assembly for Mini Flat Coupler 5 -7 -1 ) Soldering A vo id th e rise o f device te m p e ra tu re as m u ch as p ossible by th e fo llo w in g c o n d itio n s . a) S old e ring lead d ire c tly by so ld e r header) 26CTC M a x ., 1 0 second M ax.
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26CTC
ECRE
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P-UE27-ACX4
Abstract: No abstract text available
Text: REVISIONS SYM ZONE B ECN. ERN NO. TEMP RATING NOTE ADDED DATE APPRD . NQV06/08 A.G. AMPHENOL PA RT NUMBER: U E 2 7 - A C X 4 - X 0 X SERIES MODIFIER 0 - PB T HOUSING H - HIGH TEMPERATURE HOUSING MAXIMUM TEMPERATURE RATING 26CTC FOR 10s UE27 > RECEPATCLE,
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26CTC
P-UE27-ACX4-X0X
P-UE27-ACX4
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Longwell
Abstract: No abstract text available
Text: 1 I 2 I 3 I 4 I 5 I 6 I 7 I B I 9 I 10 26CTC10 SEC.MAX.I #36,37 3.50 GENERAL 4.25 5.00 #1,17,34,35,51,68 CONTACT NO. TEMP. DIM.L±0.10 •i6trc-20trc1 -2 MINUTES TIME RECOM M ENDED TEM PERATURE PROFILE B B NOTE: 1. MATERIAL: CONTACTS-COPPER ALLOY. HOUSING— UL 94V— 0 RATED LCP, COLOR: BLACK
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26CTC-h
-i6trc-20trc-
500VAC.
1000Mn
500VDC,
100Mn
500VDC.
20lbs)
100ns.
Longwell
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sgold
Abstract: usb female pcb PA66 6
Text: Date 03-0B-10 RevNo Revision note A ORIGINAL S ign ature Checked Note: 1.Material: 1.1 Insulator: Thermal Plastic UL94V—0 1.2 Contact: B ra ss,t= 0 .2 5 m m . 1.3 Shell: Copper a llo y,t= 0 .3 0 m m . 1.4 PA66 For 26CTC/5 Sec 2 .Specification: 2.1 C urrent rating: 1 A Max.
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UL94V-0
26CTC/5
USB-317AE04XXB100X
sgold
usb female pcb
PA66 6
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Untitled
Abstract: No abstract text available
Text: Date 03-08-10 RevNo Revision note ORIGINAL A Note: 1 .Material: 1.1 Insulator: Thermal Plastic U L94V— 0 1.2 Contact: B rass,t=0 .2 5 m m . 1.3 Shell: Copper alloy,t=0.30m m . 1.4 PA66 For 26CTC/5 Sec 2.Specification: 2.1 Current rating: 1 A Max. 2.2 Dielectric withstanding voltage: 5 0 0 V ac
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26CTC/5
USB-317AE04XXB100X
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Untitled
Abstract: No abstract text available
Text: _ A_ I_ D B _ I_ C NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC. HIGH TEMP., U L 9 4 V -0 ; 1.2 CONTACT: COPPER ALLOY 1 .3 FITTING NAIL: COPPER ALLOY 2. FINISH: SEE ACES P /N PLATING CODE 3. REFLOW SOLDER CAPABLE TO 26CTC
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26CTC
88078-XXX
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Untitled
Abstract: No abstract text available
Text: 1. Mechanical Dimensions: 2. S ch e m atic: 3. E l e c t r i c a l S p e c i f i c a t i o n : -Dot locates start lead L . F OCL: 0.66uH Typ 100KHz 0.1V, DAdc 0.422uH Min @100KHz 0.1V, 64.2Adc LO C\| OT lO C\i oi DCR: 2.00 mOhms Max Isat; 64.2Adc Based an 20% drop in OCL
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100KHz
422uH
MIL-STD-202G,
UL94V-0
E151556
26CTC
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Untitled
Abstract: No abstract text available
Text: s 31DF4 - 31DF6 TAIWAN SEMICONDUCTOR 3.0 AMPS. Super Fast Rectifiers DO-2Q1AD RoHS COMPLIANCE 1 F e atures ❖ -r<> -> High efficiency, Lo w V F High current capability High reliability Hig h 5 u rgc c u rrc n t ca pabi lily Low pow er loss. Green onm fxxjno with suffix 'G " c n p a c in g
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31DF4
31DF6
ictni22
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fci dh 22
Abstract: JSA93382 HLW25R-2C7LF 6R2C HLW22R-2C7LF HLW31R-2C7LF JSA93626 HLW23S-2C7 1J23 HLW11S-2C7LF
Text: REVISIONS D E S C R IP T IO N REV A ECN BY D A TE J05-027 0 H.T 5/10/'05 RFI .EA SED CAT. NO. & DIMENSIONS ND. DF CONTACTS n DIMENSIONS (NOTED CAT. ND. RIGHT ANGLE TYPE A 1 0.3 STRAIGHT TYPE B C 4 HLW 4R-2C7LF HLW 4S-2C7LF 6.6 5.12 5 HLW 5R-2C7LF HLW 5S-2C7LF
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J05-0270
10R-2C7LF
10S-2C7LF
HLW11R-2C7LF
HLW11S-2C7LF
HLW12R-2C7LF
HLW12S-2C7LF
HLW13R-2C7LF
HLW13S-2C7LF
HLW14R-2C7LF
fci dh 22
JSA93382
HLW25R-2C7LF
6R2C
HLW22R-2C7LF
HLW31R-2C7LF
JSA93626
HLW23S-2C7
1J23
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lm 2491
Abstract: No abstract text available
Text: a*'1* " c • «- » «>* *' f t x- - i -ff-#—» —- - FOUR CHARACTER &9 mm Q.2f JftKH 5X7 ALPHANUMERIC DISPLAYS - * • \ H- v —5-» - ~: HEWLETT " ? ^ _ PACKARD STANÉFÂSBffiÔ ¿iy : YEUQW HIGH EFFICIENCY RED HIGH PERFORMANCE GREEN fH?SP-?490 HPSP-2491
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HPSP-2491
HOSP-2492
HDSP-2493
HDSP-2491/2493
lm 2491
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AX5208
Abstract: 103x2
Text: DS2130Q DALLAS SEMICONDUCTOR FEATURES DS2130Q Voice Messaging Processor PIN ASSIGNMENT • P er-channel voice m essaging processor for digitized voice storage and retrieval DT1 [ 1 RST [ 2 28 H Vcc 27 H PCMIN • High fidelity speech recording and playback at 8, 12,
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DS2130Q
DS2130Q
DS2130
AX5208
103x2
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Untitled
Abstract: No abstract text available
Text: DS21T09 PRELIMINARY DALLAS s e m ic o n d u c to r FEATURES DS21T09 Plu9 ar|d Plsy SCSI Terminator PIN ASSIGNMENT Fully com pliant with S C S I-1 , Fast SCSI and Ultra SCSI Com patible with Plug and Play SCSI Profile Functional drop in replacem ent for the DS2109
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DS21T09
DS2109
DS21T07
DS21T09
28-PIN
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Untitled
Abstract: No abstract text available
Text: DS1075-1ND PRELIMINARY DALLAS SEMICONDUCTOR FEATURES D S 1 0 7 5 - I N D EconO scillator/D ivider PIN ASSIGNMENT • Dual Fixed frequency outputs 200 KHz - 100 MHz I/O Q D • U ser-program m able o n -ch ip dividers (from 1 - 5 1 3 ) • U ser-program m able o n -ch ip prescaler (1, 2, 4)
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DS1075-1ND
DS1075Z
150-M
DS1075M--
DS1075--
256tM
256tM
DS1075-IN
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T1X14
Abstract: No abstract text available
Text: DS2151Q DALLAS SEMICONDUCTOR FEATURES D S 2 1 5 1 Q T1 Single-Chip Transceiver PIN ASSIGNMENT • Com plete D S1/IS D N -P R I transceiver functionality • Line interface can handle both long and short haul trunks • 3 2 -b it or 12 8 -b it jitte r attenuator
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DS2151Q
DS2151Q
44-PIN
T1X14
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Untitled
Abstract: No abstract text available
Text: DS21T07 PRELIMINARY DALLAS SEMICONDUCTOR FEATURES • Fully com pliant with S C S I-1 , Fast SCSI and Ultra SCSI • Backward com patible to the DS2107, DS2107A, and DS21T07 • Provides active term ination for nine signal lines • Laser-trim m ed 110 ohm term ination resistors have
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DS21T07
DS2107,
DS2107A,
DS21T07S)
DS21T07E)
DS21T07
DS21T07S
16-PIN
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SFM 27-11
Abstract: No abstract text available
Text: F-206-1 samTec SFM-130-01- S -D .050" x .050" SOCKETS SFM SERIES SPECIFICATIONS For complete specifications see www.samtec.com?SFM Insulator Material: Black Liquid Crystal Polymer Contact Material: Tiger Eye= BeCu Tiger Eye LITE= Phosphor Bronze Plating: Au over 50p“ 1,27pm Ni
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F-206-1
SFM-130-01-
SFM689CG37
SFM 27-11
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samtec connector tsm
Abstract: No abstract text available
Text: F-207 ~ Through V T,H BOX CONNECTOR STRIPS SERIES S P E C IF IC A T IO N S For complete specifications see www.samtec.com?BCS Insulator Material: Black Liquid Crystal Polymer C ontact Material: Phosphor Bronze Plating: Au or Sn over 50p" 1,27pm Ni C urrent Rating:
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F-207
2-26904858-F
samtec connector tsm
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Untitled
Abstract: No abstract text available
Text: RECTANGULAR 3 LEADS BICOLOR QUALITY TECHNOLOGIES S0L,D STATELAMPS HIGH EFFICIENCY GREEN/HIGH EFFICIENCY RED M V 5 4 3 7 R A • PACKAGE DIMENSIONS DESCRIPTION The rectangular LED is a three leaded bicolor light source with a central common cathode lead. T
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C11948
C654A
26CTC,
MIL-S-750,
D005Q01
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RTC6593
Abstract: RTC-6593 114-bytes
Text: Real time clock module REAL TIME CLOCK MODULE FOR PC/AT ,1 RTC-6593 • • • • Builtin crystal unit allows adjustm ent-free efficient operation. Provides 1 14-bytes of backed-up RAM . Extended alarm function. Low current consumption. . • A builtin pow er supply switching circuit m akes it possible to provide
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RTC-6593
114-bytes
33tm34
RTC6593
RTC-6593
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MB2S
Abstract: Ms6s MB6S TR
Text: PATENT PENDING PATENT PENDING PATENT PENDING _ MB2S THRU MB6S_ MINIATURE GLASS PASSIVATED SINGLE-PHASE SURFACE MOUNT BRIDGE RECTIFIER Reverse Voltage - 200 to 600 Volts _ Forward Current - 0 . 5 Ampere_ Case Style MBS »I
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E54214
26CTC/10
MB2S
Ms6s
MB6S TR
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Untitled
Abstract: No abstract text available
Text: HFD3038 125 MHz PIN Plus Preamplified Analog Receiver FEATURES • High-speed operation, Rise/Fall times are 3.5 ns typical • Low pulse width distortion over a wide range of inputs because of 23 dB typical dynamic range • Wide variety of cable options, operates with
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HFD3038
HFD3038
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BA1360
Abstract: control ic for induction heating cooker epoxy adhesive paste cte table BA1360F
Text: Monolithic ICs S m a ll S ma l l Outline Package Outline Package High-density packaging is strongly requested lor e le c 2 Are package power smaller than M odel DIP? — tronic parts as the electronic equipment and devices are There is a difference with a single production unit. How
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Untitled
Abstract: No abstract text available
Text: D fth 1/ L O CN O 2 .8 5 TERMINAL Circuit No.1 1 0.6±o> r,_L 1,0*0.05 A±o.i 010.05 0 .2 NOTES: 1. MATERIAL: ’l.1 HOUSING: THERMOPLASTIC, HIGH TEMP.UL94V-0; 1.2 ACTUATOR: THERMOPLASTIC, HIGH TEMP.U194V-0; 1.3 CONTACT: COPPER ALLOY 1.4 FITTING NAIL-COPPER ALLOY
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UL94V-0;
U194V-0;
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