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    SOJ26/20-P-300-1.27 PACKAGE OUTLINE Search Results

    SOJ26/20-P-300-1.27 PACKAGE OUTLINE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SOJ26/20-P-300-1.27 PACKAGE OUTLINE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DIP24-P-600-2

    Abstract: oki qfp tray SEPT24
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


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    PDF 100mil 70mil 50mil 40PQFP DIP24-P-600-2 oki qfp tray SEPT24

    d1884

    Abstract: TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


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    PDF 50mil 100mil 70mil 40PQFP d1884 TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B

    oki qfp tray

    Abstract: 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


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    PDF 50mil 100mil 70mil 40PQFP oki qfp tray 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


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    PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    SMD IC 2025 bl

    Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
    Text: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機


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    PDF J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20

    MSM7731-02

    Abstract: P-BGA313-3535-1 TBA 931 MsM82C59 MSM66 arm processor msm5299 SSOP20-P-250-0 QFJ28-P-S450-1 MSM65524A
    Text: Datasheet CD-ROM Ver 1.23, July 1999 Bay of Islands, New Zealand Attention Please! People to People Technology 1. Regarding Operation • This is NOT a music CD. Please do not play it on an ordinary music CD player. It may cause damage to your ears and loudspeakers.


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    PDF 270MB ML670100 D-41460 MSM7731-02 P-BGA313-3535-1 TBA 931 MsM82C59 MSM66 arm processor msm5299 SSOP20-P-250-0 QFJ28-P-S450-1 MSM65524A

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


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    ba732

    Abstract: COBCHIP ON BOARD ED-7303 QFP 128 bonding
    Text: 作成: 前回作成: 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 1 章 パッケージの分類 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 1 章部分とな


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    SOJ 44 PCB land

    Abstract: SOJ package MSL QFP 128 bonding tsop package MSL 48 pin ic qfj HQFP208 R400 S115 ED-7401-2 TSOP II 54 Package
    Text: 1. パッケージの分類 1. パッケージの分類 1 1-1. パッケージの動向 - 2 1-2. パッケージの分類 - 5 1-3. パッケージの種類と特徴 - 7


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    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI LSIs Rev 1 1 M5M4V4405CJ,TP-6,-7,-6S,-7S EDO HYPER PAGE MODE 4194304-BIT ( 1048576-WQRD BY 4-BIT ) DYNAMIC RAM DESCRIPTION This is a fam ily of 1048576-word by 4-bit dynam ic RAMS, fabricated with the high perform ance CMOS process,and is ideal for large-capacity m em ory system s w here high speed,


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    PDF M5M4V4405CJ 4194304-BIT 1048576-WQRD 1048576-word 26pin lfl55

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI LSIs M5M416100C J,TP -5, -6, -7, -5S, -6S, -7S FAST PAGE MODE 16777216-BIT 16777216-W ORD BY 1-BIT DYNAMIC RAM D ESC RIPTIO N This is a fam ily of 16777216-word by 1-bit dynam ic RAMS, fabricated with the high perform ance CMOS process,and is


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    PDF M5M416100C 16777216-BIT 6777216-W 16777216-word 26pin

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI LSIs 1 M5M44405CJ,TP-5,-6,-7,-5S,-6S,-7S EDO HYPER PAGE MODE 4194304-BIT ( 1048576-WQRD BY 4-BIT ) DYNAMIC RAM DESCRIPTION PIN CONFIGURATION (T O P V IE W ) This is a fam ily of 1048576-word by 4-bit dynam ic RAMs, fabricated with the high perform ance CM OS process,and is


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    PDF M5M44405CJ 4194304-BIT 1048576-WQRD 1048576-word 26pin

    bt 33 f

    Abstract: No abstract text available
    Text: SIEM EN S 4M x 4-Bit Dynamic RAM 2k & 4k Refresh Fast Page Mode HYB 5116400BJ-50/-60 HYB 5117400BJ-50/-60 HYB 3116400BJ/BT-50/-60 HYB 3117400BJ-50/-60 Advanced Information • 4 194 304 words by 4-bit organization • 0 to 70 °C operating temperature •


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    PDF 5116400BJ-50/-60 5117400BJ-50/-60 3116400BJ/BT-50/-60 3117400BJ-50/-60 400BJ-50/-60 400BJ/BT-50/-60 P-TSOPII-26/24-1 GPX05857 bt 33 f

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI LSIs M5M4V4400CJ,TP-6,-7,-6S,-7S R e v . 1 .1 FAST PAGE MODE 4194304-BIT 1048576-WORD BY 4-BIT DYNAMIC RAM DESCRIPTION T h is is a fa m ily o f 1 0 4 8 5 7 6 -w o rd b y 4 -b it d y n a m ic R A M s, fa b ric a te d w ith th e high p e rfo rm a n c e C M O S pro c e s s , a n d is ideal fo r


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    PDF M5M4V4400CJ 4194304-BIT 1048576-WORD 26P0J SOJ26/20-P-300-1 26pin lfl55

    Untitled

    Abstract: No abstract text available
    Text: IBM0116400 IBM0116400M IBM0116400B IBM0116400P 4M x 4 12/10 DRAM Features • 4,194,304 word by 4 bit organization • Single 3.3V + 0.3V or 5.0V + 0.5V power supply • Standard Power SP and Low Power (LP) • 4096 Refresh Cycles - 64 ms Refresh Rate (SP version)


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    PDF IBM0116400 IBM0116400M IBM0116400B IBM0116400P SA14-4203-06

    Untitled

    Abstract: No abstract text available
    Text: IBM0117400 IBM0117400M IBM0117400B IBM0117400P 4M x 4 11/11 DRAM Features • 4,194,304 word by 4 bit organization • Single 3.3V ± 0.3V or 5.0V ± 0.5V power supply • Standard Power SP and Low Power (LP) • 2048 Refresh Cycles - 32 ms Refresh Rate (SP version)


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    PDF IBM0117400 IBM0117400M IBM0117400B IBM0117400P 300jiA Add43G9649. 350ns

    44201

    Abstract: No abstract text available
    Text: IBM0117400 IBM0117400M IBM0117400B IBM0117400P 4M x 4 11/11 DRAM Features • 4,194,304 word by 4 bit organization • Single 3.3V ±0.3V or 5.0V ±0.5V power supply • Standard Power SP and Low Power (LP) • 2048 Refresh Cycles - 32 ms Refresh Rate (SP version)


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    PDF IBM0117400 IBM0117400M IBM0117400B IBM0117400P 200nA 44201

    Untitled

    Abstract: No abstract text available
    Text: IBM014400 IBM014400M IBM014400B IBM014400P 1 M x 4 10/10 DRAM Features • 1,048,576 word by 4 bit organization • Power Dissipation - Active max - 85 mA / 70 mA (5.0V) - 95 mA / 80 mA (3.3V) - Standby Current: TTL Inputs (max) - 2.0 mA (SP version) - 1.0 mA (LP version)


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    PDF IBM014400 IBM014400M IBM014400B IBM014400P 27H4339 SA14-4219-03

    Untitled

    Abstract: No abstract text available
    Text: IBM0117400 IBM0117400M IBM0117400B IBM0117400P 4M x 4 11/11 DRAM Features • 4,194,304 word by 4 bit organization • Single 3.3V + 0.3V or 5.0V + 0.5V power supply • Standard Power SP and Low Power (LP) • 2048 Retresh Cycles - 32 ms Retresh Rate (SP version)


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    PDF IBM0117400 IBM0117400M IBM0117400B IBM0117400P SA14-4201-07

    Untitled

    Abstract: No abstract text available
    Text: IBM014440 IBM014440M IBM014440P 1M x 4 10/10 QUAD CAS DRAM Features • 1,048,576 word by 4 bit organization • Low Power Dissipation - Active max - 95 m A / 8 0 mA (3.3V) - 85 mA / 70 mA (5.0V) - Standby Current: TTL Inputs (max) - 2.0 mA (SP version)


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    PDF IBM014440 IBM014440M IBM014440P SOJ-26/24s 82F6673 0QG3G32

    Untitled

    Abstract: No abstract text available
    Text: IBM014440 IBM014440M IBM014440P 1M x 4 10/10 QUAD CAS DRAM Features • 1,048,576 word by 4 bit organization • Low Power Dissipation - Active max - 95 mA / 80 mA (3.3V) - 85 mA / 70 mA (5.0V) - Standby Current: TTL Inputs (max) - 2.0 mA (SP version) - 1.0 mA (IP version)


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    PDF IBM014440 IBM014440M IBM014440P DDD1777 82F6673

    Untitled

    Abstract: No abstract text available
    Text: IBM014400 IBM014400M IBM014400B IBM014400P 1 M x 4 10/10 DRAM Features • 1,048,576 word by 4 bit organization • Power Dissipation - Active max - 85 mA / 70 mA (5.0V) - 95 mA / 80 mA (3.3V) - Standby Current: TTL Inputs (max) - 2.0 mA (SP version) - 1.0 m A(LP version)


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    PDF IBM014400 IBM014400M IBM014400B IBM014400P 27H4339