Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOIC 20 JEDEC PACKAGE OUTLINE Search Results

    SOIC 20 JEDEC PACKAGE OUTLINE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SOIC 20 JEDEC PACKAGE OUTLINE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    jedec MS-013

    Abstract: MS-013 20-Lead
    Text: Revised January 1999 Package M20B 20-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-013, 0.300” Wide Package Number M20B 1999 Fairchild Semiconductor Corporation m20b.prf www.fairchildsemi.com Package M20B January 1999


    Original     		PDF 20-Lead MS-013, jedec MS-013 MS-013

    020 497

    Abstract: No abstract text available
    Text: Package Drawing 20S, 20-lead, 0.300" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Dimensions in Inches and (Millimeters) 0.020 (0.508) 0.013 (0.330) 0.299 (7.60) 0.420 (10.7) 0.291 (7.39) 0.393 (9.98) PIN 1 .050 (1.27) BSC 0.513 (13.0) 0.497 (12.6) 0.105 (2.67)


    Original     		PDF 20-lead, 1115C 020 497

    MS-013 Package

    Abstract: MS-013-AC
    Text: Plastic Package Small Outline Plastic Package SOIC M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)


    Original     		PDF MS-013-AC MS-013 Package

    MS-013-AC

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- A D hx -CA1 B C 0.10(0.004)


    Original     		PDF MS-013-AC 5M-1982.

    MS-013-AC

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M


    Original     		PDF MS-013-AC

    MO-142

    Abstract: PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description See Page 32B 32 Lead, 0.600" Wide,


    Original     		PDF 32DW6 MO-142 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    jedec MS-012

    Abstract: MS-012BA jedec MS-012-AC MS-012 Package jedec MS-012-AA jedec MS-013 28 MS-013 Package MS-012AA MS-012AC MS-013
    Text: PACKAGE OUTLINES PLASTIC SMALL OUTLINE PACKAGE SOIC 3.9 mm width (narrow), 8 leads Package Designator: L (Reference MS-012AA) 6.20 .419 5.80 .393 0.25 [.010] M B M 5.00 .197 4.80 .189 A 8º 0º B 8 0.25 .010 0.17 .007 A 1 4.00 .157 3.80 .150 1.27 .050 0.40 .016


    Original     		PDF MS-012AA) MS-012 MS-013 jedec MS-012 MS-012BA jedec MS-012-AC MS-012 Package jedec MS-012-AA jedec MS-013 28 MS-013 Package MS-012AA MS-012AC

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)


    Original     		PDF DS571J

    LD128

    Abstract: PPF leadframe
    Text: LEADFRAME data sheet SOIC Features Small Outline IC Package SOIC : SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and


    Original     		PDF MS-013 MO-119 LD128 PPF leadframe

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB

    98ARL10519D

    Abstract: JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8
    Text: Freescale Semiconductor Application Note AN2409 Rev. 1.0, 12/2005 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


    Original     		PDF AN2409 98ARL10519D JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


    Original     		PDF AN2409

    soic 20 Jedec package outline

    Abstract: MO-150-AE ADG333ABN ADG333ABR ADG333ABRS MS-001-AD ADG333A ADG333ABR-REEL MS-013AC RS-20
    Text: ADG333A OUTLINE DIMENSIONS 1.060 26.92 1.030 (26.16) 0.980 (24.89) 20 1 11 10 13.00 (0.5118) 12.60 (0.4961) 0.280 (7.11) 0.250 (6.35) 0.240 (6.10) 20 0.325 (8.26) 0.310 (7.87) 0.300 (7.62) PIN 1 0.100 (2.54) BSC 7.60 (0.2992) 7.40 (0.2913) 0.060 (1.52) MAX


    Original     		PDF ADG333A 20-Lead soic 20 Jedec package outline MO-150-AE ADG333ABN ADG333ABR ADG333ABRS MS-001-AD ADG333A ADG333ABR-REEL MS-013AC RS-20

    CERAMIC LEADLESS CHIP CARRIER LCC 68

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad


    Original     		PDF 180Pin, CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC

    68L SOT 353

    Abstract: tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm
    Text: SECTION 11 PACKAGING Outlines and Parameters . 1 Product Tape and Reel Specifications . 58


    Original     		PDF DS00049R-page 68L SOT 353 tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm

    20P3

    Abstract: MS-001 MS-011 MS-016 MS-018
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).7-4


    Original     		PDF 28-Lead, 20-Lead, 20P3 MS-001 MS-011 MS-016 MS-018

    74F86

    Abstract: No abstract text available
    Text: Revised July 1999 74F86 2-Input Exclusive-OR Gate General Description This device contains four independent gates, each of which performs the logic exclusive-OR function. Ordering Code: Order Number Package Number Package Description 74F86SC M14A 14-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-120, 0.150 Narrow


    Original     		PDF 74F86 74F86SC 74F86SJ 74F86PC 14-Lead MS-120, MS-001,

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    74f32

    Abstract: EIAJ SOIC 8 BODY MARKING F32 marking 74f32 fairchild
    Text: Revised July 1999 74F32 Quad 2-Input OR Gate General Description This device contains four independent gates, each of which performs the logic OR function. Ordering Code: Order Number Package Number Package Description 74F32SC M14A 14-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-120, 0.150 Narrow


    Original     		PDF 74F32 74F32SC 74F32SJ 74F32PC 14-Lead MS-120, MS-001, EIAJ SOIC 8 BODY MARKING F32 marking 74f32 fairchild

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE soie DIAGRAM OUTLINES PACKAGE DIAGRAM OUTLINES SOIC C o n t i n u e d REVISIONS DWG § NOM N MAX T E S 0 18- -1 DWG § JEDEC VARIATION □ AA MIN DWG § S016- JEDEC VARIATION □ AB MIN NOM MAX S020- 2 JEDEC VARIATION T E NOM MAX T E S024- 2 NOM


    OCR Scan     		PDF S016N M0-059, -330T

    TTL SERIES 74AS

    Abstract: toshiba cmos
    Text: PRODUCT OUTLINE OF THE TC74AC SERIES PRODUCT OUTLINE OF THE TC74AC SERIES 3-1 Features THE TC74AC/ACT series has the following features as compared to other standard Logic ICs: • • • • • • • • • • High Speed Operation: Low Power Dissipation:


    OCR Scan     		PDF TC74AC TC74AC/ACT 200mil 150mil 150/300mil 300mil 300mil TTL SERIES 74AS toshiba cmos