7007S
Abstract: BARb TRANSISTOR SMD Diode HER 507
Text: WOW! Catalogue World of Weller Inhalt 2 Page 06 – Seite 219 Soldering, Microtools, Desoldering, Hot Air, Rework, Fume Extraction, Electronic Screwdrivers, Dispensing Systems, Accessories, etc. Page 220 – Seite 323 Tweezers, Cutters, Pliers, EROP, Stripping Tools, Kits, etc.
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24-7068-1407
Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com
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sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
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GR-78-CORE
Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with
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65-0n-Tien
GR-78-CORE
ROSIN FLUX TYPE ROL0
sn63pb37
Sn62Pb36Ag2
J-STD-006A
RF771
bellcore GR-78
sn63pb37 solder wire
959T
TC-527
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SN63PB37
Abstract: No abstract text available
Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product
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EM907
EM828
SN63PB37
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Alumina ceramic AI203
Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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gold metal detectors
Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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solid solubility
Abstract: chemical control process block diagram
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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Ultrasonic Cleaning Transducer
Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family
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gold metal detectors
Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of
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CH03WIP
gold metal detectors
soft solder die bonding
schematic diagram intel atom
INCOMING RAW MATERIAL INSPECTION
lead side brazed hermetic
X-RAY INSPECTION
ausi die attach
electrical three phase schematic riser DIAGRAM
epoxy adhesive paste cte table
intel 24008
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bonder
Abstract: welding machine circuit soft solder wire dispensing Logo soft manual
Text: Beam Lead Attachment Methods Application Note AN 992 Introduction Attachment Methods This application note gives the first time user a general description of various attachment methods for beam lead devices. The attached table summarizes the salient features of all the methods including the advantages,
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5091-0974E
bonder
welding machine circuit
soft solder wire dispensing
Logo soft manual
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thermocompression
Abstract: soft solder wire dispensing
Text: Beam Lead Attachment Methods Application Note 992 Introduction This application note gives the first time user a general description of various attachment methods for beam lead devices. The attached table summarizes the salient features of all the methods including the
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5091-9074E
thermocompression
soft solder wire dispensing
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welding supply
Abstract: soft solder wire dispensing thermocompression welding machine circuit
Text: Beam Lead Attachment Methods Application Note 992 Introduction This application note gives the first time user a general description of various attachment methods for beam lead devices. The attached table summarizes the salient features of all the methods including the
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5091-9074E
welding supply
soft solder wire dispensing
thermocompression
welding machine circuit
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seam seal process
Abstract: LMC7255 Minco Products PC16552 LMC668
Text: N ANALYSIS OF VOLUME NO. 6 2000 DIE ASSEMBLY TECHNIQUES CONTENTS PAGE 1 ystem and board manufacturers that use bare die or flip-chip – such as National Semiconductor’s Die Products – have access to a wide variety of assembly methods that will produce high yield, high reliability systems. The following review of
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HSMX-T400
Abstract: 3M Touch Systems HP LED handbook FC-53-11
Text: Surface Mounting SMT LED Indicator Components Application Note 1060 Contents • Surface Mount LED Indicators • Standard EIA Tape and Reel Packaging • Moisture Barrier Envelope Packaging • SMT LED Device Lead Material • PC Board Pad Design • Automatic Placement
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HSMX-TX00
EIA-535
5091-6704E
HSMX-T400
3M Touch Systems
HP LED handbook
FC-53-11
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HU-22124
Abstract: varicon toko HU-22124 ic tea5711t TDA7050 fm frontend fm radio printed circuit board 301SS-0200 301SS-0100 TOKO Coils CDA 10.7 MC 40
Text: INTEGRATED CIRCUITS DATA SHEET TEA5711; TEA5711T AM/FM stereo radio circuit Product specification Supersedes data of October 1992 File under Integrated Circuits, IC01 Philips Semiconductors September 1994 Philips Semiconductors Product specification AM/FM stereo radio circuit
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TEA5711;
TEA5711T
OT232
OT287
HU-22124
varicon toko HU-22124
ic tea5711t
TDA7050
fm frontend
fm radio printed circuit board
301SS-0200
301SS-0100
TOKO Coils
CDA 10.7 MC 40
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N2T-TR-A02-00250
Abstract: TRANSCALC N2A-XX-S1449-1KB HA 11561 N2F-TR-E01-00005 N2A-XX-S056R-350 t029 ir M-Flux AR kit fet 27611 U G N 3140 sensor v
Text: VISHAY INTERTECHNO L O G Y , INC . INTERACTIVE data book transducer-class strain gages vishay micro-measurements vse-db0075-0802 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents
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vse-db0075-0802
N2T-TR-A02-00250
TRANSCALC
N2A-XX-S1449-1KB
HA 11561
N2F-TR-E01-00005
N2A-XX-S056R-350
t029 ir
M-Flux AR kit
fet 27611
U G N 3140 sensor v
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NATIONAL SEMICONDUCTOR ink MARKING
Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as
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tetra-etch
Abstract: MR1-350-130 Gore tetra etch PCT-2M 430-FST 136-awp 134-AWP MR1-350-127 M-line accessories MCA-2 EPOXYLITE 813
Text: VISHAY INTERTECHNO L O G Y , INC . INTERACTIVE data book strain gage accessories vishay micro-measurements vse-db0065-0707 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents
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vse-db0065-0707
tetra-etch
MR1-350-130
Gore tetra etch
PCT-2M
430-FST
136-awp
134-AWP
MR1-350-127
M-line accessories MCA-2
EPOXYLITE 813
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Untitled
Abstract: No abstract text available
Text: •I 4447564 Q 0 0 tlbD4 02^ ■ H P A HEIilLETT-PACKAR] / CMPNTS m,~m LIE I HEWLETT mPrM D A HKion GaAs Beam Lead Schottky Barrier Ring and Bridge Diodes Technical Data HSCH-9301 HSCH-9351 Features • Gold T ri-M etal System For Improved Reliability • Low C ap acitan ce
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HSCH-9301
HSCH-9351
HSCH-9301
HSCH-9351
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Bridge diodes
Abstract: No abstract text available
Text: Whal HEWLETT iL'ttM PACKARD GaAs Beam Lead Schottky Barrier Ring and Bridge Diodes Technical Data HSCH-9301 HSCH-9351 F eatu res • Gold Tri-M etal System For Improved Reliability • Low C ap acitan ce • Low S eries R esistan ce • H igh C utoff F req u en cy
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HSCH-9301
HSCH-9351
HSCH-9351
HSCH-9301
Bridge diodes
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84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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Untitled
Abstract: No abstract text available
Text: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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