805 smd code capacitor
Abstract: MLCC rework S42E 4001 smd mlcc soldering S42 SMD high power diode 500v 210F J-STD-002 MIL-STD-202G method 103A
Text: Johanson Technology, Inc. 4001 Calle Tecate, Camarillo, CA 93012 805 -389-1166 www.johansontechnology.com S42E Silver Series Specification 1.0 Scope This capacitor belongs to the Silver Series family and is based on SMD Multilayer Ceramic technology. JTI uses nearly pure Silver electrodes while our competitors use Palladium electrodes. Silver is a much
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35S0144B
805 smd code capacitor
MLCC rework
S42E
4001 smd
mlcc soldering
S42 SMD
high power diode 500v
210F
J-STD-002
MIL-STD-202G method 103A
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Untitled
Abstract: No abstract text available
Text: Mounting Instructions for Chip Capacitors 1 Terminations 1.1 Silver/nickel/tin terminations Sizes 0402, 0603, 0805, 1206, 1210 Tin Nickel Silver As shown in the diagram above, the terminations consist of three metallic layers. A primary silver layer with high conductivity provides for good electrical contact. “Leaching” of the silver is prevented
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KKE0283-B
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Abstract: No abstract text available
Text: Toggles Series MB2400 Electrical Capacity Resistive Load Power Level (silver): Logic Level (gold): Logic/Power Level: (gold over silver) C 3A @ 125V AC 0.4VA maximum @ 28V AC/DC maximum (Applicable Range 0.1mA ~ 0.1A @ 20mV ~ 28V) Combines silver & gold ratings
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MB2400
AT513H
AT515
AT507H
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Untitled
Abstract: No abstract text available
Text: Toggles Series MB2400 Electrical Capacity Resistive Load Power Level (silver): Logic Level (gold): Logic/Power Level: (gold over silver) C 3A @ 125V AC 0.4VA maximum @ 28V AC/DC maximum (Applicable Range 0.1mA ~ 0.1A @ 20mV ~ 28V) Combines silver & gold ratings
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MB2400
AT465
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Untitled
Abstract: No abstract text available
Text: Toggles Series M2 Electrical Capacity Resistive Load Power Level (silver): Logic Level (gold): Logic/Power Level: (gold over silver) C 1A @ 125V AC or 1A @ 30V DC 0.4VA maximum @ 28V AC/DC maximum (Applicable Range 0.1mA ~ 0.1A @ 20mV ~ 28V) Combines silver & gold ratings
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M2B15AA5G40-FC
M2B25AA5G40-FC
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RC1100 CE
Abstract: RC05 SN62 PB36 ag2 RC0550 RC1206 RC2010 RC-722 Vishay Techno RC
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available
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18-Jul-08
RC1100 CE
RC05
SN62 PB36 ag2
RC0550
RC1206
RC2010
RC-722
Vishay Techno RC
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SN62 PB36 ag2
Abstract: No abstract text available
Text: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold
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2002/95/EC
11-Mar-11
SN62 PB36 ag2
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500 platinum Hot wire
Abstract: No abstract text available
Text: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination material: Gold, palladium silver, platinum gold, platinum silver or platinum
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
500 platinum Hot wire
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Untitled
Abstract: No abstract text available
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available
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2002/95/EC
11-Mar-11
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RC1206* Vishay
Abstract: No abstract text available
Text: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold
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2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
RC1206* Vishay
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Untitled
Abstract: No abstract text available
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available
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2002/95/EC
18-Jul-08
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8288
Abstract: 2p3t MSS12AR 4p2t MSS12A 4P3T 2P4T MSS24AG
Text: MSS Series Standard Size Slide Switches SPECIFICATIONS FEATURES MODEL NO. O PLATING MSS12A SILVER MSS12AG GOLD VERTICAL ACTUATOR MODEL NO. PLATING MSS12AR SILVER Bifurcated wiping contact design. Epoxy sealed terminals. Wash-through open frame construction.
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MSS12A
MSS12AG
MSS12AR
MSS42R
MSS42RG
MSS43
MSS42
8288
2p3t
MSS12AR
4p2t
MSS12A
4P3T
2P4T
MSS24AG
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Untitled
Abstract: No abstract text available
Text: TP Series Pushbutton Switches, Tiny, Part Number Matrix MATERIAL SPECIFICATIONS: TYPICAL PERFORMANCE CHARACTERISTICS: Contacts .Gold - gold plate, silver - silver plate Case Material.High temperature polyester
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TPF21RGRA(
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RC1206
Abstract: RC1206* Vishay
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications Available • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold RoHS*
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18-Jul-08
RC1206
RC1206* Vishay
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet Product 3888 July 2003 PRODUCT DESCRIPTION LOCTITE 3888 Silver Filled Conductive Adhesive provides the following product characteristics: Technology Epoxy Chemical Type Epoxy Appearance Resin Silver pasteLMS Appearance (Hardener) Clear to amber liquidLMS
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ASTM-D-2393
Abstract: amicon "good adhesive bonding starts" ASTM-D-257 amicon silver Cuming Amicon die attach adhesive Amicon D 125 ASTM-D-792 ASTMD257
Text: Technical Data Sheet AMICON C 850-6 Internet Address: www.emersoncuming.com Key Feature: • One component • Silver filled • Low viscosity Silver Filled, Epoxy Die Attach Adhesive Benefit: • Ease of use • Yields excellent electrical and thermal conductivities
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B-2260
1755-C-850-6/09-00
ASTM-D-2393
amicon
"good adhesive bonding starts"
ASTM-D-257
amicon silver
Cuming
Amicon die attach adhesive
Amicon D 125
ASTM-D-792
ASTMD257
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RM73Z
Abstract: KOA Chip Resistors Packaging RK73Z
Text: RK73Z resistors zero ohm jumper chip resistor features • • • • • Silver element Anti-leaching nickel barrier terminations 90/10 solder plated terminations, standard Available in 100% tin terminations no lead Also available with epoxy bondable palladium silver
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RK73Z
PDP-100,
MIL-R-55342F
RM73Z
KOA Chip Resistors Packaging
RK73Z
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K680 varistor
Abstract: B72500T0250 CT1210K B72530T0300 b72510v0250 B72530V0350 B72530T0400 B72540V05 B72500V B72510T014
Text: SIOV Metal Oxide Varistors SMD Varistors Standard; MLV Series Multilayer (CT/CN) Standard Construction • Multilayer technology ■ Termination: nickel barrier or silver palladium (silver platinum for arrays) ■ No plastic or epoxy packaging assures better than UL 94 V-0 flammability rating
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8/12-mm
0603sent
K680 varistor
B72500T0250
CT1210K
B72530T0300
b72510v0250
B72530V0350
B72530T0400
B72540V05
B72500V
B72510T014
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire Solder Lead Plating Silicon Die Rev ECN A 032006HC03 B 101410HC01 Component Weight :
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QSOPEP-16LD-PBY-RS-1
032006HC03
101410HC01
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : TSSOP 16 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Leadframe Plating Silver Die Attach Epoxy Gold Wire Silicon Die Content in % 51.84% 32.35% 1.01% 1.94% 2.44%
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TSSOP-16LD-PBY-RS-3
120909HC01
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B72520V0110K062
Abstract: CN1206 EPCOS B72540V0350K062 CN0402 B72520V0080L062 CT1206K25G b72520v0600k062 B72540T0300K062 CN1206K25G K 241 VARISTOR
Text: SMD Varistors MLV; Standard Series Construction • Multilayer technology ■ Termination: nickel barrier CT series or silver palladium (CN series) or silver platinum (only for CN0402 … K2) ■ No plastic or epoxy encapsulation assures better than UL 94 V-0 flammability rating
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CN0402
8/12-mm
B72520V0110K062
CN1206 EPCOS
B72540V0350K062
CN0402
B72520V0080L062
CT1206K25G
b72520v0600k062
B72540T0300K062
CN1206K25G
K 241 VARISTOR
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Material Component Weight : QFN 7x7mm Document No : 84 Process Type : Content in % Molding Compound 70.09% Copper Alloy Frame 15.36% Spot Silver Plating 0.07% Silver Die Attach Epoxy
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QFN77-84LD-PBY-RS-3B
122210HC09
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Untitled
Abstract: No abstract text available
Text: M A T E R IALS BUSHING PIN -COPPER ALLOY, NICKEL PLATED TERMINALS -COPPER ALLOY, SILVER PLATED WASHERS -GLASS PIN -COPPER HOUSING SLEEVE SHUNT EPOXY ALLOY, SILVER PLATED -BLACK THERMOPLASTIC, UL94V-0 - PHOS. BRONZE, PLATED SILVER PC B OA RD L A Y O U T 4 -
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OCR Scan
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UL94V-0
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Untitled
Abstract: No abstract text available
Text: PART NO. P C 7 I 2 A MATER I A L S PIN BUSHING - COPPER ALLOY, NICKEL PLATED TERMINALS - COPPER ALLOY, SILVER PLATED SILVER PLATED WASHERS - GLASS PIN - COPPER HOUSING SLEEVE PC BOARD I SHUNT ALLOY, THERMOPLASTIC, UL94V-0 - BERYLLIUM COPPER, SILVER PLATED
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UL94V-0
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