MA4E2513L-1289
Abstract: MA4E2513L-1289W MA4E2513-1289
Text: SURMOUNTTM Low Barrier Tee “0301” Footprint Silicon Schottky Diodes Features • Extremely Low Parasitic Capitance and Inductance • Extremely Small “0301” 1000 x 300um Footprint • Surface Mountable in Microwave Circuits, No Wirebonds Required
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300um)
MA4E2513-1289
MA4E2513L-1289
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MA4E2513L-1289W
MA4E2513L-1289W
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0201 footprint
Abstract: MA4E2501-1290 MA4E2501L-1290 MA4E2501L-1290W
Text: MA4E2501-1290 Series SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes Rev. V1 Features A • Extremely Low Parasitic Capitance and Inductance • Extremely Small 0201 600x300um Footprint • Surface Mountable in Microwave Circuits , No Wirebonds
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MA4E2501-1290
600x300um)
MA4E2501L-1290
0201 footprint
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0201 footprint
Abstract: MA4E2501-1290 MA4E2501L-1290 MA4E2501L-1290T MA4E2501L-1290W
Text: SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes Features • Extremely Low Parasitic Capitance and Inductance • Extremely Small 0201 600x300um Footprint • Surface Mountable in Microwave Circuits, No Wirebonds Required • Rugged HMIC Construction with Polyimide
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600x300um)
MA4E2501-1290
MA4E2501L-1290
MA4E2501L-1290
MA4E2501L-1290W
0201 footprint
MA4E2501-1290
MA4E2501L-1290T
MA4E2501L-1290W
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Silicones
Abstract: Tyco SESD feeder SESD0201C-006-058 SESD0402S-005-054
Text: Silicon ESD Protection Devices Silicon ESD Protection Devices NEW Silicon ESD SESD devices help protect electronic circuits against damage from electrostatic discharge (ESD) events. The 0201-sized SESD device’s miniature footprint – measuring 0.6mm x 0.3mm x 0.3mm - is
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0201-sized
SESD0201C-006-058
Silicones
Tyco SESD
feeder
SESD0402S-005-054
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SESD0402P
Abstract: Mark B1 SESD0201P SESD0402P1BN-0450-090
Text: Silicon ESD Protection Devices Silicon ESD Protection Devices NEW Silicon ESD SESD devices help protect electronic circuits against damage from electrostatic discharge (ESD) events. The 0201-sized SESD device’s miniature footprint – measuring 0.6mm x 0.3mm x 0.3mm - is
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0201-sized
SESD0201C-006-058
SESD0402P
Mark B1
SESD0201P
SESD0402P1BN-0450-090
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Untitled
Abstract: No abstract text available
Text: MA4E2513L-1289 SURMOUNTTM Low Barrier Tee “0301” Footprint Silicon Schottky Diodes Features • Extremely Low Parasitic Capitance and Inductance • Extremely Small “0301” 1000 x 300 um Footprint • Surface Mountable in Microwave Circuits, No Wire•
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MA4E2513L-1289
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500 platinum Hot wire
Abstract: MA4E2513L-1289 MA4E2513L-1289W MACOM Schottky Diode
Text: MA4E2513L-1289 SURMOUNTTM Low Barrier Tee “0301” Footprint Silicon Schottky Diodes Features • Extremely Low Parasitic Capitance and Inductance • Extremely Small “0301” 1000 x 300 um Footprint • Surface Mountable in Microwave Circuits, No Wire•
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MA4E2513L-1289
MA4E2513L-1289
500 platinum Hot wire
MA4E2513L-1289W
MACOM Schottky Diode
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varactor
Abstract: No abstract text available
Text: DATA SHEET SMV2019 to SMV2023: Silicon Hyperabrupt Varactor Diode Chips Features High Q for low loss resonators Low leakage current ● High tuning ratio for wideband VCOs ● SPICE model parameters ● Small footprint chip design ● ● Description Skyworks silicon hyperabrupt junction varactor diode chips are
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SMV2019
SMV2023:
varactor
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HP85047A
Abstract: 15KV IEC1000-4-2 WLP200 WLP200-01 WLP200-02 WLP-20
Text: WLP200 CALIFORNIA MICRO DEVICES Wafer Level Package Evaluation RC Filter Network Features Applications • 6 Filters per device • Ultra small footprint, 0.5mm pitch • EMI filter for Mobile Equipment e.g. Cellular Phones • Silicon substrate • Evaluation Device
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WLP200
WLP200-02
HP85047A
15KV
IEC1000-4-2
WLP200
WLP200-01
WLP-20
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15KV
Abstract: 30KV IEC1000-4-2 WLP200 WLP200-01 WLP200-02
Text: WLP200 CALIFORNIA MICRO DEVICES Wafer Level Package Evaluation RC Filter Network Features Applications • 6 Filters per device • Ultra small footprint, 0.5mm pitch • EMI filter for Mobile Equipment e.g. Cellular Phones • Silicon substrate • Evaluation Device
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WLP200
WLP200-02
15KV
30KV
IEC1000-4-2
WLP200
WLP200-01
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WLP200
Abstract: 15KV IEC1000-4-2 WLP200-01 WLP200-02
Text: WLP200 CALIFORNIA MICRO DEVICES Wafer Level Package Evaluation RC Filter Network Features Applications • 6 Filters per device • Ultra small footprint, 0.5mm pitch • EMI filter for Mobile Equipment e.g. Cellular Phones • Silicon substrate • Evaluation Device
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WLP200
WLP200-02
WLP200
15KV
IEC1000-4-2
WLP200-01
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QFN-12
Abstract: IBM3115Q012 NC12 QFN12
Text: IBM3115Q012 Product Overview Tri-Band GSM Integrated Voltage Controlled Oscillator Advance Features Applications • IBM Silicon Germanium BiCMOS 5DM Technology with Cu Metallurgy • GSM/DCS/PCS tri-band direct conversion receivers • Small-footprint, low-profile QFN-12 package
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IBM3115Q012
QFN-12
IBM3115Q012
QFN-12)
vco3115
NC12
QFN12
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AP4341
Abstract: MAGJACK application pcb H5007 lan driver SCHEMATIC DIAGRAM OF intel 8086 DA82562EM 82562EZ bob smith termination grid tie inverter schematic diagram intel ic 8086 MAG-JACK
Text: 82562EZ EX /82540EM Dual Footprint LOM Design Guide Application Note (AP-434) Networking Silicon Notice: This document contains information on products in the design phase of development. Product features and specifications are subject to change without notice. Verify with your local
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82562EZ
/82540EM
AP-434)
1500pF/2KV
25Mhz
AP4341
MAGJACK application pcb
H5007 lan driver
SCHEMATIC DIAGRAM OF intel 8086
DA82562EM
bob smith termination
grid tie inverter schematic diagram
intel ic 8086
MAG-JACK
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Untitled
Abstract: No abstract text available
Text: BGA725L6 Silicon Germanium Low Noise Amplifier for Global Navigation Satellite Systems GNSS in ultra small package with 0.77mm² footprint Data Sheet Revision 2.0, 2012-03-09 Preliminary RF & Protection Devices Edition 2012-03-09 Published by Infineon Technologies AG
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BGA725L6
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BGA725L6
Abstract: gps trimble glonass gps TSLP-6 lna 2.5 GHZ s parameter ads design
Text: BGA725L6 Silicon Germanium Low Noise Amplifier for Global Navigation Satellite Systems GNSS in ultra small package with 0.77mm² footprint Data Sheet Revision 2.0, 2012-03-09 Preliminary RF & Protection Devices Edition 2012-03-09 Published by Infineon Technologies AG
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BGA725L6
BGA725L6
gps trimble
glonass gps
TSLP-6
lna 2.5 GHZ s parameter ads design
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BGA925L6
Abstract: 925L BGA925
Text: BGA925L6 Silicon Germanium GNSS Low Noise Amplifier in ultra small package with 0.77mm² footprint Data Sheet Revision 3.0, 2012-01-13 RF & Protection Devices Edition 2012-01-13 Published by Infineon Technologies AG 81726 Munich, Germany 2012 Infineon Technologies AG
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BGA925L6
BGA925L6
925L
BGA925
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Untitled
Abstract: No abstract text available
Text: BGA925L6 Silicon Germanium GNSS Low Noise Amplifier in ultra small package with 0.77mm² footprint Data Sheet Revision 3.0, 2012-01-13 RF & Protection Devices Edition 2012-01-13 Published by Infineon Technologies AG 81726 Munich, Germany 2012 Infineon Technologies AG
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SMV1405-040LF: Surface Mount, 0402 Silicon Abrupt Tuning Varactor Diode Applications • Wide bandwidth VCOs • Wide range voltage-tuned phase shifters and filters Features • Low series resistance: 0.8 Ω typical • High Q: 3200 typical • Industry-standard 0402 footprint
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SMV1405-040LF:
J-STD-020
SMV1405-040LF
01625A
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SMV2020-000
Abstract: SMV2019 SMV2019-000 SMV2020 SMV2021 SMV2021-000 SMV2022 SMV2022-000 SMV2023 SMV2023-000
Text: DATA SHEET SMV2019 to SMV2023: Silicon Hyperabrupt Varactor Diode Chips Features High Q for low loss resonators Low leakage current ● High tuning ratio for wideband VCOs ● SPICE model parameters ● Small footprint chip design ● Available lead Pb -free, RoHS-compliant, and Green
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SMV2019
SMV2023:
SMV2020-000
SMV2019-000
SMV2020
SMV2021
SMV2021-000
SMV2022
SMV2022-000
SMV2023
SMV2023-000
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SMV2019 to SMV2023: Silicon Hyperabrupt Varactor Diode Chips Features High Q for low loss resonators Low leakage current ● High tuning ratio for wideband VCOs ● SPICE model parameters ● Small footprint chip design ● Available lead Pb -free, RoHS-compliant, and Green
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SMV2019
SMV2023:
SMV2020
SMV2021
SMV2022
SMV2023
APN1004.
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SMV1405-040LF
Abstract: varactor diode SPICE model
Text: DATA SHEET SMV1405-040LF: Surface Mount, 0402 Silicon Abrupt Tuning Varactor Diode Applications • Wide bandwidth VCOs • Wide range voltage-tuned phase shifters and filters Features • Low series resistance: 0.8 Ω typical • High Q: 3200 typical • Industry-standard 0402 footprint
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SMV1405-040LF:
J-STD-020
SMV1405-040LF
01625A
varactor diode SPICE model
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free circuit diagram of USB modem
Abstract: BGA-64 pad LOG RX 2 1301 16 pin IC R01A SiW1602 latest bluetooth circuits diagrams free circuit diagram of bluetooth modem SiW1701 MC145481 SiW1502
Text: SiW1760 Baseband Processor Data Sheet 2 FEATURES • Small footprint 64-pin BGA packag9 6 x 6 mm . CLOCK and RESET LOGIC PWR1_EN PWR2_EN ENABLE_RM VSS_PLL VSS_USB VSS_C VSS_P VDD_S VDD_P VDD_C VDD_RM VDD_PLL VDD_USB VDD_UART CLK32K_OUT CLK32K_IN The SiW1760 Baseband Processor is part of Silicon
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SiW1760
64-pin
CLK32K
SiW1701
SiW1502
free circuit diagram of USB modem
BGA-64 pad
LOG RX 2 1301 16 pin IC
R01A
SiW1602
latest bluetooth circuits diagrams
free circuit diagram of bluetooth modem
MC145481
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Untitled
Abstract: No abstract text available
Text: AUIRF8736M2TR AUTOMOTIVE GRADE Automotive DirectFET Power MOSFET • V BR DSS RDS(on) typ. max. ID (Silicon Limited) Qg Advanced Process Technology Optimized for Automotive Motor Drive, DC-DC and other Heavy Load Applications Exceptionally Small Footprint and Low Profile
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AUIRF8736M2TR
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Untitled
Abstract: No abstract text available
Text: AUIRF8736M2TR AUTOMOTIVE GRADE Automotive DirectFET Power MOSFET • V BR DSS RDS(on) typ. max. ID (Silicon Limited) Qg Advanced Process Technology Optimized for Automotive Motor Drive, DC-DC and other Heavy Load Applications Exceptionally Small Footprint and Low Profile
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