BLH load cell
Abstract: Vishay nobel BLH load cell kis nobel SE-691 BLH sr-4 celtron TEDEA BLH transducer load cell to measure load and torque
Text: z F z x KIS transducers are of the shear-beam type. They measure the strains that arise from the shear forces caused by a load. x y M F, x M (F, x) σx(z) T (F) T (F) τ (a) (z) xz WHY KIS’S FEATURES ARE UNBEATABLE (b) Distribution of bending moment M, shear force T, normal
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VTR-PL0316-0402
BLH load cell
Vishay nobel
BLH load cell kis
nobel
SE-691
BLH sr-4
celtron
TEDEA
BLH transducer
load cell to measure load and torque
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Shear-Beam-Load-Cell
Abstract: BEAM LOAD CELL load cell
Text: Shear Beam Load Cell Construction: Shear beam load cell has cantilever beam structure， with one fixed， another end loaded. Force is transferred by unique rocker. it is no sensitive when the point change ,it has good ability to correct action point cove .it can be installed and has
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Untitled
Abstract: No abstract text available
Text: OBSOLETE APPLICATOR No. 69001-1000 PRODUCT No. 90020/21 - 01XX FEED FINGER:90020-01XX USE 69001-0105,90021-01XX USE 69001-0106 ITEM 1 PART NUMBER 69001-0000 2 69001-0060 SHEAR PUNCH 3 69001-0075 SHEAR DIE 4 69001-0041 CONDUCTOR PUNCH 5 69001-0040 CONDUCTOR ANVIL
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90020-01XX
90021-01XX
29/ISSUE
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Untitled
Abstract: No abstract text available
Text: OBSOLETE APPLICATOR No. 69001-1010 PRODUCT No. 90022/24 - 01XX FEED FINGER 69001-0105 ITEM 1 PART NUMBER 69001-0000 DESCRIPTION BASE MODULE UNTOOLED 2 69001-0060 SHEAR PUNCH 3 69001-0075 SHEAR DIE 4 69001-0055 CONDUCTOR PUNCH 5 69001-0056 CONDUCTOR ANVIL
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INTERLOCK VALVE
Abstract: BALL VALVE DATA SHEET BALL VALVE en1088 valve interlock ball valve interlock AS4024 ISO12100-1 ISO14119 valve
Text: Prosafe Trapped Key Interlock Switches Miniature Valve Interlocks Specifications Standards Approvals Ambient Temperature Mechanical Operations Maximum Shear Force to Key Maximum Torque to Key Relative Operating Humidity Material EN292-1&2, EN1088, ISO12100-1&2,
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EN292-1
EN1088,
ISO12100-1
ISO14119,
AS4024
3398lbs)
124lb
375in
cloSFC10
INTERLOCK VALVE
BALL VALVE DATA SHEET
BALL VALVE
en1088
valve interlock
ball valve interlock
ISO14119
valve
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foxconn mPGA478
Abstract: MPGA478 SOCKET 94-V0 MPGA478 SOCKET retention 94V-0 m 94v-0 mPGA478
Text: SPECIFICATIONS mPGA478 Socket BGA Series CPU Socket Vertical, SMT Type 1.27mm [.050”] Pitch 478 Pos. Mechanical Socket Engagement/Disengagement Force: 4.5Kg max. Durability: 50 Cycles min. Socket Retention Force: 10g min. Solder Ball Shear Force: 500g min.
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mPGA478
26X26
foxconn mPGA478
MPGA478 SOCKET
94-V0
MPGA478 SOCKET retention
94V-0
m 94v-0
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PT102K1002B1
Abstract: PT102
Text: g THIN-FILM RESISTANCE ELEMENTS TYPES PRE/K DESCRIPTION: A ceramic substrate supports a structured platinum layer covered with glass. The connection lead contacts are shear force resistant. FEATURES: • Small dimensions available • High electrical insulation is guaranteed by
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PT101K0402B3
PT101K2002B1
PT101K2002A1
PT101K2002B3
PT102K1002B1
PT102
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shear force
Abstract: led tactile switch
Text: K5V Right Angle Lighted SMT Tact Switch Features Tactile Switches B Typical Applications Gold plated dome contact SPST/SPDT Excellent ergonomie High bright LEDs Reduced space usage on board 70 N min shear force Tape and reel Lead free compliant • • •
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20mVdc
shear force
led tactile switch
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Solder ball shear
Abstract: LGA resistance
Text: SPECIFICATIONS VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. Electrical Contact Resistance : 18 mΩ max.
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13x30
Solder ball shear
LGA resistance
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KSS241G
Abstract: No abstract text available
Text: KSS Series Subminiature SMT Side Actuated Features/Benefits • Low profile of 1.7 mm • Excellent tactile feel • High shear force • Range of actuation forces • Large flat top • RoHS compliant and compatible Typical Applications • Cellular phone
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KSS221G
KSS231G
KSS241G
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Untitled
Abstract: No abstract text available
Text: KSS Series Subminiature SMT Side Actuated Features/Benefits • Low profile of 1.7 mm • Excellent tactile feel • High shear force • Range of actuation forces • Large flat top • RoHS compliant and compatible Typical Applications • Cellular phone
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KSS221G
KSS231G
KSS241G
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AMD socket s1
Abstract: Foxconn socket amd "socket s1" socket s1 BGA638 638 amd foxconn z638 amd socket s1 mechanical
Text: SPECIFICATIONS BGA638 Socket BGA Series CPU Socket Vertical, SMT Type 1.27 mm [.05”] Pitch 638 Pos. Mechanical Socket Engagement/Disengagement Force: 3.3Kg max. Durability: 30 Cycles min. Socket Retention Force: 65g/Pos. min. Solder Ball Shear Force: 750g min.
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BGA638
65g/Pos.
1000M
AMD socket s1
Foxconn socket amd
"socket s1"
socket s1
638 amd
foxconn
z638
amd socket s1 mechanical
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TACTILE SWITCHES
Abstract: No abstract text available
Text: KSS Series Subminiature SMT Side Actuated Features/Benefits • Low profile of 1.6 mm • Excellent tactile feel • High shear force • Range of actuation forces • Large flat top • IP 40 sealed • RoHS compliant and compatible Typical Applications • Cellular phone
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KSS221G
KSS231G
KSS241G
00cifications
TACTILE SWITCHES
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BGA775
Abstract: CPU 775 PE0775 foxconn 94V-0 LG
Text: SPECIFICATIONS LGA/BGA 775 DT LG A/ BG A CPU Socket LG A SM T Type 1,09X1.17mm[0.043X.046”] Pitch 775 Pos. Mechanical Socket Engagement Force: 3.9kgf max. Socket Disengagement Force: 1kgf max. Durability: 20 Cycles min. Solder Ball Shear Force: 500gf min.
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500gf
12pin/chian)
33X30
15X14
BGA775
CPU 775
PE0775
foxconn
94V-0 LG
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94V-0 LG
Abstract: socket 775 Foxconn BGA775
Text: SPECIFICATIONS LGA/BGA 775 DT LG A/ BG A CPU Socket LG A SM T Type 1,09X1.17mm[0.043X.046”] Pitch 775 Pos. Mechanical Socket Engagement Force: 3.9kgf max. Socket Disengagement Force: 1kgf max. Durability: 20 Cycles min. Solder Ball Shear Force: 500gf min.
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500gf
12pin/chian)
33X30
15X14
94V-0 LG
socket 775 Foxconn
BGA775
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500gf
Abstract: BGA package tray 40 x 40 foxconn
Text: SPECIFICATIONS BGA 959 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 959 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 500gf min. Electrical Contact Resistance : 25 mΩ max. Insulation Resistance: 1000mΩ min.
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13kgf
500gf
1000m
959Pos.
32X32
BGA package tray 40 x 40
foxconn
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KSS221G
Abstract: KSS231G KSS233W KSS241G
Text: KSS Series Subminiature SMT Side Actuated Features/Benefits • Low profile of 1.6 mm • Excellent tactile feel • High shear force • Range of actuation forces • Large flat top • Redundant contacts option • IP 40 sealed • RoHS compliant and compatible
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Untitled
Abstract: No abstract text available
Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.
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Untitled
Abstract: No abstract text available
Text: g THIN-FILM RESISTANCE ELEMENTS TYPES PRE/C DESCRIPTION: A ceramic substrate supports a structured platinum layer covered with glass. The connection lead contacts are shear force resistant. FEATURES: • Connection leads made of gold plated brass, allow problem-free soft solder.
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PT101C1002B3
PT501C1002B3
PT102C1002B31
PT101C0403B3
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up 6261
Abstract: EPKV-10M crystal 3 x 6 200 khz crystal
Text: FORCE SENSITIVE QUARTZ CRYSTAL EPKV-10M APPLICATIONS The force sensitive quartz crystal EPKV-10M is intended for operation in a structure of precision electronic balances. It converts face shear strain into a frequency variation. Using this crystal, it is possible to design
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EPKV-10M
EPKV-10M
EPKV-10M.
D-74821
up 6261
crystal 3 x 6
200 khz crystal
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Solder ball shear
Abstract: No abstract text available
Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.
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13x30
Solder ball shear
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BGA754
Abstract: foxconn
Text: SPECIFICATIONS BGA 754 LP BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05X. 05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max.
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13kgf
1000gf
1000m
754Pic,
754Pos.
BGA754
foxconn
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Untitled
Abstract: No abstract text available
Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.
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13x30
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bga solder ball shear
Abstract: foxconn
Text: SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max. Insulation Resistance: 1000mΩ min.
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13kgf
1000gf
1000m
754Pos
754Pos.
29X29
bga solder ball shear
foxconn
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