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    SENJU SOLDER Search Results

    SENJU SOLDER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SENJU SOLDER Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    senju solder paste

    Abstract: Senju
    Text: !Solder and Flux 1 Solder Paste Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%) For your reference, we are using 'SPT-70-0F-2063', manufactured by SENJU METAL INDUSTRY CO.,


    Original     		PDF SPT-70-0F-2063' senju solder paste Senju

    Senju

    Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
    Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).


    Original     		PDF SPT-70-OF-2063 Senju H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste Ultrasonic flow

    Senju

    Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
    Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).


    Original     		PDF SPT-70-OF-2063 Senju senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A

    Senju M705-GRN360-K2-V

    Abstract: Senju M705-GRN360-K2-V solder paste Senju eco solder paste Senju M705-GRN360-K2-V TYPE 4 OZ63-221CM5-42-10 senju type 5
    Text: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series back-lock LIF connector allows for design flexibility by incorporating both an upper contact and a lower contact to interface with a 0.15mm thick FPC at a 0.3mm pitch. The low profile


    Original     		PDF M705-GRN360-K2-V Senju M705-GRN360-K2-V Senju M705-GRN360-K2-V solder paste Senju eco solder paste Senju M705-GRN360-K2-V TYPE 4 OZ63-221CM5-42-10 senju type 5

    Untitled

    Abstract: No abstract text available
    Text: 0.5mm Pitch FPC/FFC/Membrane FF14A Series 【Cable Lock Type】 OUTLINE FF14A series is a 0.9mm height connector with a cable lock mechanism, in conformity to FPC of 0.5mm pitch and 0.2mm thick. Applicable cable is 0.2mm thick FPC, FFC and membrane. APPLICATIONS


    Original     		PDF FF14A

    SENJU SOLDER PASTE

    Abstract: Senju Senju metal solder paste Senju flux senju solder h63 37wt viscosity senju H63
    Text: gSolder and Flux 1 Solder Paste 1) Flow Soldering : Use H60 (Sn:Pb=60wt%:40wt%) type, H63 (Sn:Pb=63wt%:37wt%) type or equivalent type of solder paste. 2) Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%)


    Original     		PDF SPT-70-0F-2063' SENJU SOLDER PASTE Senju Senju metal solder paste Senju flux senju solder h63 37wt viscosity senju H63

    Senju oz

    Abstract: senju solder alloys Howard H. Manko Senju
    Text: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Page-1 Walsin Technology Corporation Background Pb free solder material was started in 1995. A composition of Sn-4Bi-2Ag-0.5Cu-0.1Ge was announced in July


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 0.5mm pitch low profile FPC LIF back-lock connector FF14C Series OUTLINE The FF14C series low profile FPC LIF connector has a back-lock mechanism with a 0.5mm contact pitch. It mates with a standard FPC circuit of 0.3mm thick. The upper contact is utilized as the electrical contact for the FPC material.


    Original     		PDF FF14C M705-GRN360-K2-V

    SnBiAg

    Abstract: senju solder paste WALSIN philips mlcc Senju flux Senju oz
    Text: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Version 03 Page-1 Walsin Technology Corporation Background Sn/Pb Phase Diagram Engineering version Pb free solder material was started in 1995. A


    Original     		PDF OZ-7085-340F-32-12) 2Ag-20In SnBiAg senju solder paste WALSIN philips mlcc Senju flux Senju oz

    Senju M705-GRN360-K1

    Abstract: senju solder paste m705-grn360-k1 v Senju M705-GRN360-K1 15Z202-1H1L5 M705-GRN360-K
    Text: TECHNICAL DATA SHEET DRAFT 15 15C102-40ML-NM PCB HOUSING RF_35/06.07/5.0 All dimensions are in mm; tolerances according to ISO 2768 m-H Rosenberger Hochfrequenztechnik GmbH & Co. KG P.O.Box 1260 D-84526 Tittmoning Germany www.rosenberger.de Tel.: +49 8684 18-0


    Original     		PDF 15C102-40ML-NM D-84526 15Z202-1H1L5, M705-GRN360-K1 Senju M705-GRN360-K1 senju solder paste m705-grn360-k1 v Senju 15Z202-1H1L5 M705-GRN360-K

    Senju M705

    Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
    Text: Application Report SWPA156 – February 2009 Part – II Assembly Guidelines for 0.4-mm Package-On-Package Packages Steven Kummerl . OMAP ABSTRACT


    Original     		PDF SWPA156 Senju M705 Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar

    Senju M705-GRN360-K2-V solder paste

    Abstract: Senju M705-GRN360-K2-V
    Text: 0.5mm Pitch Back-lock FPC Connectors FF14 Series OUTLINE The FF14 FPC connector utilizes a back-lock mechanism with 0.5mm pitch. This ultra-low profile ZIF connector has a height of only 0.9mm. The FF14 connector series offers flexibility in FPC design as it mates with 0.20mm thick or 0.12mm thick


    Original     		PDF M705-GRN360-K2-V Senju M705-GRN360-K2-V solder paste Senju M705-GRN360-K2-V

    Senju

    Abstract: OX63-101F senju L1 flux
    Text: LOW Ohm METAL PLATE Current sensing CERAMIC CASE BLR W NE STRUCTURE Ceramic case Termination electrode Resistive element metal plate Cement Heat sink LOW OHM 1 2 3 4 5 Identification produCt code coating color BLR marking None (White Ceramic) Alpha Numeric


    Original     		PDF OX63-101F D-25578 Senju OX63-101F senju L1 flux

    Untitled

    Abstract: No abstract text available
    Text: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series has a back-lock mechanism connector with a 0.3mm contact pitch. It fits 0.15mm thick FPCs and has upper and lower contacts, but the connector height has a low profile of 0.9mm, making the PCB mounting space the smallest in the market.


    Original     		PDF M705-GRN360-K2-V

    Senju M705

    Abstract: Senju Sn Pb 60 40 solder Senju PASTE Senju
    Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices


    Original     		PDF

    senju M705 solder paste

    Abstract: Senju M705 senju solder paste M705 senju solder paste M705 solder paste Senju metal solder paste senju solder specification
    Text: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.


    Original     		PDF 51pos. 11gramms. senju M705 solder paste Senju M705 senju solder paste M705 senju solder paste M705 solder paste Senju metal solder paste senju solder specification

    OZM10-729C-32-11

    Abstract: senju type 5
    Text: BILL OF MATERIALS Subject: STEVAL-SPBT3ATV3 Q.TY 1 6 2 CODE REFERENCE 0ADL500D -C40ADL572D -C1-C3-C7-C8-C10-C110ADL306E -C6-C13- DESCRIPTION CHIP CAPACITOR 10nF 50V CHIP CAPACITOR 100nF 16V CHIP CAPACITOR 1uF 10V 0ADL310E CHIP CAPACITOR 10uF p/n C2012X5R0J106K


    Original     		PDF 0ADL500D -C40ADL572D -C1-C3-C7-C8-C10-C110ADL306E -C6-C13- 100nF 0ADL310E C2012X5R0J106K -C2-C9-C120ADL023G 0ADL495G 0ADL542G OZM10-729C-32-11 senju type 5

    Senju

    Abstract: MARKING CODE 2l marking code 1L
    Text: POWER TYPE RESISTORS TECHNOLOGY OF TOMORROW METAL PLATE CERAMIC CASE BLR W NE STRUCTURE 1 Ceramic case 2 Termination electrode 3 Resistive element metal plate 4 Cement IDENTIFICATION PRODUCT CODE COATING COLOR MARKING BLR None (White Ceramic) Alpha Numeric


    Original     		PDF OX63-101F D-25578 Senju MARKING CODE 2l marking code 1L

    senju m705 solder paste

    Abstract: senju M705-221BM5-42-11 M705-221BM5-42-11 RMA9086 senju solder paste M705 SENJU m705 NCP18 90-4-M20 NCP03 NCP15
    Text: catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF catalog to prevent


    Original     		PDF R44E8 40kHz. NCP03 NCP15 NCP18/NCP21 senju m705 solder paste senju M705-221BM5-42-11 M705-221BM5-42-11 RMA9086 senju solder paste M705 SENJU m705 NCP18 90-4-M20

    senju m705 solder paste

    Abstract: senju solder paste Senju M705 Senju metal solder paste Senju M705-221CM5 SENJU 221CM5 senju M705 solder paste data sheet M705 solder paste stiffener
    Text: 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.


    Original     		PDF 51pos. 11gramms. senju m705 solder paste senju solder paste Senju M705 Senju metal solder paste Senju M705-221CM5 SENJU 221CM5 senju M705 solder paste data sheet M705 solder paste stiffener

    senju solder paste

    Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste


    Original     		PDF 80-95wt% 63Sn/37Pb) 62Sn/36Pb/2Ag) senju solder paste senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag

    Untitled

    Abstract: No abstract text available
    Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.


    Original     		PDF 51pos. 11gramms.

    senju m705 solder paste

    Abstract: Senju M705 SENJU mobile actuator ltds senju solder paste
    Text: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices


    Original     		PDF

    Senju M705

    Abstract: No abstract text available
    Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices


    Original     		PDF