senju solder paste
Abstract: Senju
Text: !Solder and Flux 1 Solder Paste Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%) For your reference, we are using 'SPT-70-0F-2063', manufactured by SENJU METAL INDUSTRY CO.,
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SPT-70-0F-2063'
senju solder paste
Senju
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Senju
Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
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SPT-70-OF-2063
Senju
H60A
senju h63a
Senju Sn Pb 60 40 solder
senju solder paste
H63A
Senju metal solder paste
Ultrasonic flow
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Senju
Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
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SPT-70-OF-2063
Senju
senju h63a
senju solder paste
Senju flux
solder paste
H63A
Senju metal solder paste
H60A
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Senju M705-GRN360-K2-V
Abstract: Senju M705-GRN360-K2-V solder paste Senju eco solder paste Senju M705-GRN360-K2-V TYPE 4 OZ63-221CM5-42-10 senju type 5
Text: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series back-lock LIF connector allows for design flexibility by incorporating both an upper contact and a lower contact to interface with a 0.15mm thick FPC at a 0.3mm pitch. The low profile
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M705-GRN360-K2-V
Senju M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
Senju eco solder paste
Senju M705-GRN360-K2-V TYPE 4
OZ63-221CM5-42-10
senju type 5
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Untitled
Abstract: No abstract text available
Text: 0.5mm Pitch FPC/FFC/Membrane FF14A Series 【Cable Lock Type】 OUTLINE FF14A series is a 0.9mm height connector with a cable lock mechanism, in conformity to FPC of 0.5mm pitch and 0.2mm thick. Applicable cable is 0.2mm thick FPC, FFC and membrane. APPLICATIONS
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FF14A
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SENJU SOLDER PASTE
Abstract: Senju Senju metal solder paste Senju flux senju solder h63 37wt viscosity senju H63
Text: gSolder and Flux 1 Solder Paste 1) Flow Soldering : Use H60 (Sn:Pb=60wt%:40wt%) type, H63 (Sn:Pb=63wt%:37wt%) type or equivalent type of solder paste. 2) Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%)
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SPT-70-0F-2063'
SENJU SOLDER PASTE
Senju
Senju metal solder paste
Senju flux
senju solder h63
37wt
viscosity
senju H63
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Untitled
Abstract: No abstract text available
Text: 0.5mm pitch low profile FPC LIF back-lock connector FF14C Series OUTLINE The FF14C series low profile FPC LIF connector has a back-lock mechanism with a 0.5mm contact pitch. It mates with a standard FPC circuit of 0.3mm thick. The upper contact is utilized as the electrical contact for the FPC material.
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FF14C
M705-GRN360-K2-V
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Senju M705-GRN360-K1
Abstract: senju solder paste m705-grn360-k1 v Senju M705-GRN360-K1 15Z202-1H1L5 M705-GRN360-K
Text: TECHNICAL DATA SHEET DRAFT 15 15C102-40ML-NM PCB HOUSING RF_35/06.07/5.0 All dimensions are in mm; tolerances according to ISO 2768 m-H Rosenberger Hochfrequenztechnik GmbH & Co. KG P.O.Box 1260 D-84526 Tittmoning Germany www.rosenberger.de Tel.: +49 8684 18-0
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15C102-40ML-NM
D-84526
15Z202-1H1L5,
M705-GRN360-K1
Senju M705-GRN360-K1
senju solder paste m705-grn360-k1 v
Senju
15Z202-1H1L5
M705-GRN360-K
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Senju M705
Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
Text: Application Report SWPA156 – February 2009 Part – II Assembly Guidelines for 0.4-mm Package-On-Package Packages Steven Kummerl . OMAP ABSTRACT
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SWPA156
Senju M705
Senju eco solder M705
Senju M705 m705 m705-tva
Senju eco solder paste
senju m705 solder paste
Solder bar of Senju M705
M705-TVA03
Senju
m705-tva
senju solder bar
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Senju M705-GRN360-K2-V solder paste
Abstract: Senju M705-GRN360-K2-V
Text: 0.5mm Pitch Back-lock FPC Connectors FF14 Series OUTLINE The FF14 FPC connector utilizes a back-lock mechanism with 0.5mm pitch. This ultra-low profile ZIF connector has a height of only 0.9mm. The FF14 connector series offers flexibility in FPC design as it mates with 0.20mm thick or 0.12mm thick
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M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
Senju M705-GRN360-K2-V
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Untitled
Abstract: No abstract text available
Text: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series has a back-lock mechanism connector with a 0.3mm contact pitch. It fits 0.15mm thick FPCs and has upper and lower contacts, but the connector height has a low profile of 0.9mm, making the PCB mounting space the smallest in the market.
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Senju M705
Abstract: M705 solder paste senju m705 solder paste
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju M705
Abstract: Senju Sn Pb 60 40 solder Senju PASTE Senju
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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senju M705 solder paste
Abstract: Senju M705 senju solder paste M705 senju solder paste M705 solder paste Senju metal solder paste senju solder specification
Text: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.
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51pos.
11gramms.
senju M705 solder paste
Senju M705
senju solder paste M705
senju solder paste
M705 solder paste
Senju metal solder paste
senju solder specification
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senju m705 solder paste
Abstract: senju solder paste Senju M705 Senju metal solder paste Senju M705-221CM5 SENJU 221CM5 senju M705 solder paste data sheet M705 solder paste stiffener
Text: 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.
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51pos.
11gramms.
senju m705 solder paste
senju solder paste
Senju M705
Senju metal solder paste
Senju
M705-221CM5
SENJU 221CM5
senju M705 solder paste data sheet
M705 solder paste
stiffener
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senju solder paste
Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste
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80-95wt%
63Sn/37Pb)
62Sn/36Pb/2Ag)
senju solder paste
senju printing speed
Senju metal solder paste
viscometer
Rosin Flux Type RMA
Senju flux
Senju
soldering paste
solder powder
62Sn36Pb2Ag
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Untitled
Abstract: No abstract text available
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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11gramms.
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senju m705 solder paste
Abstract: Senju M705 SENJU mobile actuator ltds senju solder paste
Text: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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Senju M705
Abstract: No abstract text available
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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senju m705 solder paste
Abstract: Senju M705 SENJU SENJU SOLDER PASTE M705-221CM5 Senju metal solder paste standard ul94v0 plastic paste M705 solder paste
Text: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.
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51pos.
11gramms.
senju m705 solder paste
Senju M705
SENJU
SENJU SOLDER PASTE
M705-221CM5
Senju metal solder paste
standard ul94v0 plastic paste
M705 solder paste
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15K101-40ME4
Abstract: Senju M705-GRN360-K1 rosenberger
Text: TECHNICAL DATA SHEET 15 15K101-40ME4 RF TEST SWITCH Circuit Antenna RF_35/05.04/2.0 All dimensions are in mm; tolerances according to ISO 2768 m-H Rosenberger Hochfrequenztechnik GmbH & Co. KG P.O.Box 1260 D-84526 Tittmoning Germany www.rosenberger.de Tel.: +49 8684 18-0
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15K101-40ME4
D-84526
15K101-40ME4
Senju M705-GRN360-K1
rosenberger
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Senju M705-GRN360-K1
Abstract: 15K101-40M M705-GRN360 senju solder paste m705-grn360-k1 v 15K101-40MB1-NM M705-GRN360-K1
Text: TECHNICAL DATA SHEET 15 15K101-40MB1-NM RF TEST SWITCH Circuit Antenna All dimensions are in mm; tolerances according to ISO 2768 m-H Material and plating RF_35/05.04/2.0 Non-magnetic version Connector parts Housing Switching spring Stationary spring Spring carrier
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15K101-40MB1-NM
D-84526
Senju M705-GRN360-K1
15K101-40M
M705-GRN360
senju solder paste m705-grn360-k1 v
15K101-40MB1-NM
M705-GRN360-K1
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Senju oz
Abstract: senju solder alloys Howard H. Manko Senju
Text: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Page-1 Walsin Technology Corporation Background Pb free solder material was started in 1995. A composition of Sn-4Bi-2Ag-0.5Cu-0.1Ge was announced in July
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Senju M705
Abstract: M705-221CM5 senju m705 solder paste senju solder paste senju Senju metal solder paste SENJU 221CM5 M7052 M705-221CM5-42-10 221CM5
Text: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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