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    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Search Results

    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPHR7404PU Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 0.00074 Ω@10V, SOP Advance, U-MOS-H Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH8R316MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH3R10AQM Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY National Semiconductor Semiconductor Packaging Assembly Technology Original PDF

    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

    Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
    Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .


    Original     		PDF

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


    Original     		PDF 25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles

    90Pb 10Sn solder paste

    Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA


    Original     		PDF 25x25x1 90Pb 10Sn solder paste 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola

    D2PAK1

    Abstract: No abstract text available
    Text: Cherry Semiconductor offers a wide variety of traditional packages in addition to more advanced package technology. Flip Chip is an example of the advanced packaging technologies offered by Cherry Semiconductor. An application note included in this section explains the Flip Chip manufacturing process and the methods available for Flip Chip assembly.


    Original     		PDF MS-026 MO-108 D2PAK1

    landing

    Abstract: AN-19 AN-20 16 QSOP pcb footprint qsop 16 pcb footprint
    Text: AN-20 Q QUALITY SEMICONDUCTOR, INC. Board Assembly Techniques for 0.4mm Pin Pitch Surface Mount Packages The need for higher performance systems continues to push both silicon and packaging technologies to new advances. As an example, in 1991 Quality Semiconductor QSI introduced the QSOP (Quarter


    Original     		PDF AN-20 150-mil) 25-mil MAPN-00020-00 landing AN-19 AN-20 16 QSOP pcb footprint qsop 16 pcb footprint

    conveyor belt

    Abstract: AN8820 harris varistors 62Sn harris varistor varistor harris disc varistors Alpha Metals 62-SN mov VARISTOR
    Text: Harris Semiconductor No. AN8820.2 Harris MOVs April 1993 Recommendations for Soldering Terminal Leads to MOV Varistor Discs Introduction Fluxes The CA series of MOV varistor discs with silver electrodes are specifically designed for custom assembly and packaging. To take advantage of the excellent performance and


    Original     		PDF AN8820 62Sn/36Pb/2AG 179oC 221oC 96Sn/5 221oC 245oC 10Sn/88Pb/2Ag 268oC 302oC conveyor belt harris varistors 62Sn harris varistor varistor harris disc varistors Alpha Metals 62-SN mov VARISTOR

    tamura solder paste

    Abstract: AN-1035 SN63 PB37 multicore SN62 PB36 ag2 kester SN62 MP AN1035 tamura solder paste PROFILE Litton SN62 PB36 ag2 100N
    Text: Application Note AN-1035 DirectFET Technology Board Mounting Table of Contents Page Device construction Design considerations Assembly considerations Mechanical test results Model-specific data 2 2 3 5 8 DirectFET™ is a new surface mount semiconductor technology designed primarily for boardmounted power applications. It eliminates unnecessary elements of packaging that contribute to


    Original     		PDF AN-1035 150mm 025mm 500mm tamura solder paste AN-1035 SN63 PB37 multicore SN62 PB36 ag2 kester SN62 MP AN1035 tamura solder paste PROFILE Litton SN62 PB36 ag2 100N

    ebonol

    Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB

    ebonol

    Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb

    217-36CTT6

    Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 217-36CTT6 ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5

    ebonol

    Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm

    Untitled

    Abstract: No abstract text available
    Text: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 217-36CTR6 1-866-9-OHMITE 217-36CTT6 O-263 MO-169

    ebonol

    Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 ebonol abe sot-223 217-36CTRE6 217-36CT6 MO-169

    N10015

    Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 292-AB 292-AB N10015 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01

    Untitled

    Abstract: No abstract text available
    Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF WTS001 p1-25 O-220, OT-223, SOL-20

    mos-fet darlington

    Abstract: madison igbt module testing military switch POW-R-BRIK missile launching system SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY pioneer mosfet SCR Inverter datasheet NATIONAL IGBT
    Text: MILITARY POWER From A Global Power In Power Semiconductor Technology Powerex . . . on the leading edge of research and manufacturing technology … The Mission Powerex has positioned itself as a prime supplier to the defense industry. Since 1986, Powerex has been a


    Original     		PDF MPB-000 LVG-5K-6/01 mos-fet darlington madison igbt module testing military switch POW-R-BRIK missile launching system SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY pioneer mosfet SCR Inverter datasheet NATIONAL IGBT

    lQFP256

    Abstract: TEQFP208 QFP PACKAGE thermal resistance SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY BGA and QFP Package LQFP-256
    Text: Technical Analysis Low-Cost Packaging Technology Using QFP Low-Cost Packaging Technology Using QFP The combination of bus bar technology and TEQFP technology is currently receiving attention in the development of a semiconductor package that realizes function


    Original     		PDF

    JESD51-8

    Abstract: JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
    Text: Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc. PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts solutions together in single packages to accomodate power and high voltages.


    Original     		PDF BR1568/D JESD51-8 JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint

    ipc 610D

    Abstract: IPC-SM-7525A entek ht plus AN-9049 j-std-001d JESD22-B102D Fairchild, leadframe materials 100C IPC7525 J-STD-001C
    Text: www.fairchildsemi.com Application Note AN-9049 Assembly Guidelines for Fairchild’s TinyBuck Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild TinyBuck™ package is based on Molded Leadless Packaging MLP technology. This technology


    Original     		PDF AN-9049 FAN2103MPX, FAN2103EMPX, FAN2106MPX, FAN2106EMPX, FAN2106MPX AA3E249, FAN2108MPX, FAN2108EMPX, FAN21SV06MPX, ipc 610D IPC-SM-7525A entek ht plus AN-9049 j-std-001d JESD22-B102D Fairchild, leadframe materials 100C IPC7525 J-STD-001C

    pcb board of miniskiip 2

    Abstract: semikron skiip IGBT Intelligent Power Module semikron semikron skiip SKIIP DRIVER SEMITOP weight miniskiip board SEMITOP 1 Package
    Text: Reliable and cost effective power packages Pressure contacts in power semiconductor devices Autor: Klaus Backhaus, SEMIKRON International, e-mail: k.backhaus@semikron.com Introduction Power semiconductors ask for a modern packaging technology to achieve high output


    Original     		PDF

    HC735

    Abstract: 6 mhz quartz oscillator Quartz Oscillator AN279 analog Quartz Clock applications of blocking oscillator blocking oscillator applications HLMP-1485 quartz 20 MHZ Si500
    Text: Advances in Silicon Technology Enables Replacement of Quartz-Based Oscillators I. Introduction With a market size estimated at more than $650M and more than 1.4B crystal oscillators supplied annually[1], quartz crystal oscillators have long been the preferred choice for clock generation in


    Original     		PDF Si500 AN279: HC735 6 mhz quartz oscillator Quartz Oscillator AN279 analog Quartz Clock applications of blocking oscillator blocking oscillator applications HLMP-1485 quartz 20 MHZ

    Untitled

    Abstract: No abstract text available
    Text: TECHNOLOGY BACKGROUND &KLS6FDOH 3DFNDJLQJ IRU $0' ODVK 0HPRU\ 3URGXFWV 2 Chip-Scale Packaging Technology Background The AMD Fine-pitch Ball Grid Array FBGA) The FBGA package offers system designers a chip-scale package for Flash memories that provides a significant reduction in board real estate over TSOP packages and provides many


    Original     		PDF Am29SL800 XXX-00-06/98 21627B

    Loctite 3567

    Abstract: underfill Kester FDZ202P fbga Substrate design guidelines reflow hot air BGA fine BGA thermal profile reball INTEL underfill SMT
    Text: Application Note 7001 March 2002 Guidelines for Mounting Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling capability, ultra-low profile


    Original     		PDF

    4 PIN TO 220 IC

    Abstract: dp 502 t
    Text: Cherry Semiconductor offers a wide variety of traditional packages in addition to more advanced package technology. Flip Chip is an example of the advanced packaging technologies offered by Cherry Semiconductor. An application note included in this section explains the Flip Chip m anufacturing process and the m ethods available for Flip Chip assembly.


    OCR Scan     		PDF