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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: NOTES : 1. PIN PUSH OUT FORCE: 2 LBS. MIN. 2. PIN SOLDERABILITY PER MOLEX ENG. STD. No. 53 3. DIMENSIONS SHOWN ARE MILLIMETERS OVER INCHES MM/IN. STACKABLE SIDE BY SIDE 3H OF WAFER <£0F WAFER (2.50 0.098 STACKABLE END TO END 22- 03-1202 HE-3022-20B 1 -1192	OCR Scan	PDF	HE-3022-20B 022-2B SD3022NBoDGN CHARTSDAE-3022

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: NOTES : 1. PIN PUSH OUT FORCE: 2 LBS. MIN. 2. PIN SOLDERABILITY PER MOLEX ENG. STD. No. 53 3. DIMENSIONS SHOWN ARE MILLIMETERS OVER INCHES MM/IN. STACKABLE SIDE BY SIDE 3H OF WAFER <£0F WAFER (2.50 0.098 STACKABLE END TO END 22- 03-1202 HE-3022-20B 1 -1192

OCR Scan

PDF

HE-3022-20B 022-2B SD3022NBoDGN CHARTSDAE-3022