FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
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ST-300
Workshop/54th
FLUX TYPE ROL0
ALLOY leadframe C7025
C7025 strip specification
smd EDL 63
ST-50
adrian borg
10X10
C151
C194
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Untitled
Abstract: No abstract text available
Text: Remote control receiver Modules Photo Link Modules Lead frame type zRecommended soldering conditions (Lead frame type) 1. Not to apply high temperature exceeding the maximum storage temperature to the epoxy resin. 2. Not to apply any force to the epoxy resin at high temperature.
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Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-F1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.
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Untitled
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-A1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.
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Untitled
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-V56* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 2. 9 2. SOLDERING LED products do not contain reinforcement
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SML-V56*
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washing machine circuit
Abstract: SMLV36 SML-V36
Text: Attention Points In Handling Surface Mount Chip LEDs SML-V36* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 2. 9 2. SOLDERING LED products do not contain reinforcement
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SML-V36*
washing machine circuit
SMLV36
SML-V36
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LF-301MA
Abstract: LF-301MK LF-301VA LF-301VK 7 segment LED display 7 Segment single Display COMMON anode PIN detail
Text: LF-301 A / K Series LED displays Single Digit Surface Mount LED Numeric Display LF-301 A / K Series zDimensions Unit : mm 5±0.5 0.2 13 11 8 1 (1) zFeatures 1) Re-flow soldering ∗ 2) Pb-free availabe 3) Automatic mounting with taping pack ∗Number of re-flow process shall be recommend
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LF-301
LF-301VA
LF-301VK
LF-30
LF-301MA
LF-301MK
LF-301VA
LF-301VK
7 segment LED display
7 Segment single Display COMMON anode PIN detail
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Untitled
Abstract: No abstract text available
Text: LF-301 A / K Series LED displays Single Digit Surface Mount LED Numeric Display LF-301 A / K Series Dimensions Unit : mm 6.8 PIN No.6 P1.27x4=5.08 10-0.4 10˚ 0.2 (1 ) 13 11 8 1 Features 1) Re-flow soldering ∗ 2) Pb-free availabe 3) Automatic mounting with taping pack
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LF-301
LF-301VA
LF-301VK
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Untitled
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-21* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 1.1mm 1.DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.
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SML-21*
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Reflow Soldering
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-31* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 0.8mm 1.DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.
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SML-31*
Reflow Soldering
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silica gel
Abstract: rohm process soldering
Text: Attention Points In Handling Surface Mount Chip LEDs SML-R1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 1.2mm 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.
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Reflow Soldering
Abstract: 1.5mm LED
Text: Attention Points In Handling Surface Mount Chip LEDs SML-11* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 2.SOLDERING Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu
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SML-11*
Reflow Soldering
1.5mm LED
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SML-Y1
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-Y1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 2.3mm 3.HANDING AFTER MOUNTING As shown right drawing, in case outside force is given
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CSL0101
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs CSL0101* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.31mm Fig-1 1. DESIGNING OF PCB
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CSL0101*
CSL0101
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SML-P1
Abstract: ultra sonic
Text: Attention Points In Handling Surface Mount Chip LEDs SML-P1* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.6mm Fig-1 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.
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Untitled
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-E1* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.8mm 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.
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MAX260
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-P2* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. Fig-1 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.
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LF-301VA
Abstract: LF-301VK LF-301MA LF-301MK
Text: LF-301 A / K Series LED displays Single Digit Surface Mount LED Numeric Display LF-301 A / K Series zExternal dimensions Unit : mm 5±0.5 0.2 13 11 8 1 (1) zFeatures 1) Re-flow soldering ∗ 2) Pb-free availabe 3) Automatic mounting with taping pack ∗Number of re-flow process shall be recommend
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LF-301
LF-301VA
LF-301VK
LF-301MA
LF-301MK
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SMLP34
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-P34* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.45 0.4 0.45 2. SOLDERING Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu
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SML-P34*
SMLP34
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Untitled
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-J1* Series This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 0.7 1.1 0.7 1.DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1.
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Untitled
Abstract: No abstract text available
Text: Attention Points In Handling Surface Mount Chip LEDs SML-P36* Series This product was developed as a surface mount LED especially suitable for reflow soldering. Please take care of following points when using this device. 0.4 0.45 0.45 0.45 0.4 0.45 1. DESIGNING OF PCB
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SML-P36*
80100m
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Untitled
Abstract: No abstract text available
Text: Introduction Outline of Rohm manufacturing processes Rohm's LEDs are checked thoroughly for reliability at the design stage. In addition, complete quality control is achieved at each manufacturing stage. The diagram shows the manufacturing process for LEDs.
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C7022
Abstract: JIS-C-7022 H63A
Text: Notes About Quality Assurance Hybrid 1C Notes About Quality Assurance Rohm hybrid IC s are guaranteed in terms of high prod uct quality and high reliability through the manufactur ing flow shown below. • H y b rid !C manufacturing process flow \ y /
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C7022
JIS-C-7022
H63A
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C7022
Abstract: cutting paste C-7022 H63A
Text: Hybrid 1C Notes About Quality Assurance Notes About Quality Assurance Rohm hybrid ICs are guaranteed in terms of high prod uct quality and high reliability through the manufactur ing flow shown below. H y b rid 1C manufacturing process flow v1/ •Q u a lity assurance testing program
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C7022
cutting paste
C-7022
H63A
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