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    ROBINSON NUGENT PGA SOCKET Search Results

    ROBINSON NUGENT PGA SOCKET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB50SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals Datasheet

    ROBINSON NUGENT PGA SOCKET Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Robinson Nugent pga

    Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


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    AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa PDF

    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


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    AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap PDF

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


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    AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1 PDF

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    Abstract: No abstract text available
    Text: HIGH DENSITY PGA Socket Tooling PGA-ET Series • Allows device removal without damaging | or device body • Available for 10 x 10 through 21 x 21 grids • 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10x10 - Robinson Nugent, Inc. •


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    18x18 PGA-ET-10x10 PGA-ET-12x12 PGA-ET-13x13 PGA-ET-14x14 PGA-ET-15x15 PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH DENSITY_ PGA Interstitial Sockets PGA-INT Series 9 .050" staggered design mates with n high density devices 9 Molded high temperature body mate - Suitable for infrared and vapor ph soldering applications 9 Screw machine reliability 9 Uses RN’s ultra-low force contact


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    fUS-XX-TG30 PGA-INT-325AH-XX-TG30 NT-391 AX-XX-TG30 PGA-INT-S03AS-XX-TG30 PDF

    McKenzie technology

    Abstract: burndy zif YAMAICHI 132 PGA MAXCONN ms McKenzie technology pga
    Text: Sockets Below are two lists of manufactures known to offer sockets for Xilinx package types. This list does not imply an endorsement by Xilinx. Each user must evaluate the particular socket type. a compatible PGA socket with wire-wrap pins. Note that the board-layout then differs from a PGA board layout.


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    Abstract: No abstract text available
    Text: HIGH DENSITY Pin Grid Array Sockets . ^ ^ 7 . PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermittent solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press-fit


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    15x15 16x16 18x18 19x19 10x10 SP138 PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermitte solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press tails


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    12x12 13x13 14x14 15x15 16x16 17x17 18x18 10x10 PDF

    Robinson Nugent

    Abstract: Robinson Nugent pga 18x18 Nugent
    Text: HIGH DENSITY_ PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints 9 Insures a reliable solder joint by provid­ ing an exact amount of solder * Eliminates the need for solder paste and


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    13x13 18x18 Robinson Nugent Robinson Nugent pga Nugent PDF

    Robinson Nugent pga

    Abstract: Robinson Nugent
    Text: HIGH DENSITY Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit tails


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    10x10 11x11 15x15 16x16 17x17 18x18 E73746 27urn) Robinson Nugent pga Robinson Nugent PDF

    Robinson Nugent

    Abstract: Robinson Nugent SCREW MACHINE SOCKET Motorola 68040
    Text: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series CLIP HEAT SINK • High temp molded insulator body compatible with IR and vapor phase soldering MICROPROCESSOR • Precision screw machine sockets for high reliability PGA SOCKET • “Ultra Low Force” 6-finger contact


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    PGHS-179CH3-US-TG 50ninch PGHS-T79CH3-US-TG Robinson Nugent Robinson Nugent SCREW MACHINE SOCKET Motorola 68040 PDF

    Untitled

    Abstract: No abstract text available
    Text: Sockets -interstitial Pin Grid Array Sockets PGA-INT Series * .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications * Screw machine reliability * Uses RN’s ultra-low force contact


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    27\im) PGA-INT-296BS-XX-XX PGA-INT-321AX-XX-XX PGA-INT-503AS-XX-XX PGA-INT-504AS-XX-XX PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH DENSITY PGA Sockets PGA-ET Series 9 Allows device removal without damaging pins or device body 9 Available for 10 x 10 through 21 x 21 grids 9 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10X10 SOCKETS PGA-ET-11X11


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    18x18 PGA-ET-11X11 PGA-ET-12X12 PGA-ET-13X13 PGA-ET-10 PGA-ET-17x17 PGA-ET-18x4 PGA-ET-19X4 PGA-ET-20x4 PGA-ET-21x4 PDF

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    Abstract: No abstract text available
    Text: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements SOCKETS * Mates with PGA Series "A" SQUARE Grid Size Dimension A 8x8 .800“ 20 . 32 9x9 .900" (22 . 86)


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    10x10 12x12 15x15 18x18 19x19 PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste


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    18x18 PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH DENSITY_ PGA Interstitial Sockets 7.' t PGA-INT Series * .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications * Screw machine reliability


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    E73746 PGA-INT-296BS3-XX-TG30 NT-321 AS-XX-TG30 NT-325AH-XX-TG30 PGA-INT-391AX-XX-TG30 NT-503AS-XX-TG30 PDF

    Robinson Nugent pga

    Abstract: No abstract text available
    Text: SCREW MACHINE Terminal Strips Solderless Backplane Socket SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit assembly technology Hi temp IR compatible


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    08urn) Robinson Nugent pga PDF

    Untitled

    Abstract: No abstract text available
    Text: Sockets HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit


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    16x16 18x18 10x10 SP138 PDF

    Untitled

    Abstract: No abstract text available
    Text: Robinson Nugent- Screw Machine Terminal Strips I Solderless Backplane Socket r SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Sockets HIGH DENSITY Pin Grid Array Headers 5X&tJ. PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements * Mates with PGA Series "A" SQUARE .1 2 0 Grid Size Dimension A 8x8 .800" 20 . 32


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    10x10 11x11 12x12 PDF

    ROGERS MEKTRON

    Abstract: Rogers 104JEV 104KEx
    Text: Performance Characteristics Dissipation Factor Tem perature Characteristics 20 10 Ui -30 g 1 5 40 -50 -60 2 -ra o -80 -90 -100 -55 -3 5 -15 5 25 45 65 85 105 125 TEMPERATURE, °C Environmental Parameters Impedance Curves Per MIL-C-39014D, MIL-STD-202F - As Applicable


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    MIL-C-39014D, MIL-STD-202F ROGERS MEKTRON Rogers 104JEV 104KEx PDF

    Robinson Nugent CATALOG

    Abstract: MC68461 SAB80286 WE32104 Z80000 IMST414 FGE2000 MCA2800ALS 82786 intel TC110G
    Text: T Circuit C o m p o n en ts Inc. r MicrofQ 3000 PGA Decoupling Capacitors Micro/Q 3000 ceramic capacitors are a family of very low inductance decoupling capacitors specifically designed to be through-hole mounted under pin grid arrays PGAs , PGA sockets, and


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    Untitled

    Abstract: No abstract text available
    Text: Introduction 1. Distinctive Features The V29BMC is a memory controller designed specifically for use in Am29000 based systems. The specific nature of such systems preclude the V29BMC from being a general purpose device. However, within the constraints of the targeted applications, it imposes few architectural restrictions.


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    V29BMC Am29000 V29BM PDF

    744040

    Abstract: scx6206 74589 744020 Flip-Flop 7471 744017 744017 counter sn 74373 scx6218 74395
    Text: July 1985 SCX m icroC M O S G ate A rray Fam ily A pplication G uide TABLE OF CONTENTS 1.0 General Description . 2 2.0 Product Features. 2 Enhanced Product Features. . 2


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    AA32096 744040 scx6206 74589 744020 Flip-Flop 7471 744017 744017 counter sn 74373 scx6218 74395 PDF