Robinson Nugent pga
Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
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AP-577
Box5200,
Robinson Nugent pga
burndy die set specifications
Intel CPGA with 296 pins
AP-577
thermalcote
Matthey
PEAK tray drawing
cpga dimensions
QUAD Video Processor 208 pin ap
Evox Rifa
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Matthey
Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
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Original
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PDF
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AP-577
Box5200,
Matthey
sanyodenki driver
Sanyo Denki cooler
AP-577
burndy
diode MARKING CODE 917
Evox Rifa
sanyo denki stepping
PEAK tray drawing
QUAD Video Processor 208 pin ap
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tucker
Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
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Original
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PDF
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AP-577
Box5200,
tucker
CPGA
AP-577
intel DOC
CPGA large cavity
ppga package
Robinson Nugent pga
QUAD Video Processor 208 pin ap
296-Pin
Socket1
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY PGA Socket Tooling PGA-ET Series • Allows device removal without damaging | or device body • Available for 10 x 10 through 21 x 21 grids • 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10x10 - Robinson Nugent, Inc. •
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18x18
PGA-ET-10x10
PGA-ET-12x12
PGA-ET-13x13
PGA-ET-14x14
PGA-ET-15x15
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY_ PGA Interstitial Sockets PGA-INT Series 9 .050" staggered design mates with n high density devices 9 Molded high temperature body mate - Suitable for infrared and vapor ph soldering applications 9 Screw machine reliability 9 Uses RN’s ultra-low force contact
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fUS-XX-TG30
PGA-INT-325AH-XX-TG30
NT-391
AX-XX-TG30
PGA-INT-S03AS-XX-TG30
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McKenzie technology
Abstract: burndy zif YAMAICHI 132 PGA MAXCONN ms McKenzie technology pga
Text: Sockets Below are two lists of manufactures known to offer sockets for Xilinx package types. This list does not imply an endorsement by Xilinx. Each user must evaluate the particular socket type. a compatible PGA socket with wire-wrap pins. Note that the board-layout then differs from a PGA board layout.
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY Pin Grid Array Sockets . ^ ^ 7 . PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermittent solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press-fit
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15x15
16x16
18x18
19x19
10x10
SP138
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermitte solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press tails
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12x12
13x13
14x14
15x15
16x16
17x17
18x18
10x10
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Robinson Nugent
Abstract: Robinson Nugent pga 18x18 Nugent
Text: HIGH DENSITY_ PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints 9 Insures a reliable solder joint by provid ing an exact amount of solder * Eliminates the need for solder paste and
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13x13
18x18
Robinson Nugent
Robinson Nugent pga
Nugent
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Robinson Nugent pga
Abstract: Robinson Nugent
Text: HIGH DENSITY Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit tails
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10x10
11x11
15x15
16x16
17x17
18x18
E73746
27urn)
Robinson Nugent pga
Robinson Nugent
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Robinson Nugent
Abstract: Robinson Nugent SCREW MACHINE SOCKET Motorola 68040
Text: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series CLIP HEAT SINK • High temp molded insulator body compatible with IR and vapor phase soldering MICROPROCESSOR • Precision screw machine sockets for high reliability PGA SOCKET • “Ultra Low Force” 6-finger contact
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PGHS-179CH3-US-TG
50ninch
PGHS-T79CH3-US-TG
Robinson Nugent
Robinson Nugent SCREW MACHINE SOCKET
Motorola 68040
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Untitled
Abstract: No abstract text available
Text: Sockets -interstitial Pin Grid Array Sockets PGA-INT Series * .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications * Screw machine reliability * Uses RN’s ultra-low force contact
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27\im)
PGA-INT-296BS-XX-XX
PGA-INT-321AX-XX-XX
PGA-INT-503AS-XX-XX
PGA-INT-504AS-XX-XX
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY PGA Sockets PGA-ET Series 9 Allows device removal without damaging pins or device body 9 Available for 10 x 10 through 21 x 21 grids 9 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10X10 SOCKETS PGA-ET-11X11
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18x18
PGA-ET-11X11
PGA-ET-12X12
PGA-ET-13X13
PGA-ET-10
PGA-ET-17x17
PGA-ET-18x4
PGA-ET-19X4
PGA-ET-20x4
PGA-ET-21x4
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements SOCKETS * Mates with PGA Series "A" SQUARE Grid Size Dimension A 8x8 .800“ 20 . 32 9x9 .900" (22 . 86)
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10x10
12x12
15x15
18x18
19x19
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste
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18x18
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY_ PGA Interstitial Sockets 7.' t PGA-INT Series * .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications * Screw machine reliability
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E73746
PGA-INT-296BS3-XX-TG30
NT-321
AS-XX-TG30
NT-325AH-XX-TG30
PGA-INT-391AX-XX-TG30
NT-503AS-XX-TG30
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Robinson Nugent pga
Abstract: No abstract text available
Text: SCREW MACHINE Terminal Strips Solderless Backplane Socket SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit assembly technology Hi temp IR compatible
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08urn)
Robinson Nugent pga
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Untitled
Abstract: No abstract text available
Text: Sockets HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit
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16x16
18x18
10x10
SP138
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Untitled
Abstract: No abstract text available
Text: Robinson Nugent- Screw Machine Terminal Strips I Solderless Backplane Socket r SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit
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Untitled
Abstract: No abstract text available
Text: Sockets HIGH DENSITY Pin Grid Array Headers 5X&tJ. PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements * Mates with PGA Series "A" SQUARE .1 2 0 Grid Size Dimension A 8x8 .800" 20 . 32
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10x10
11x11
12x12
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ROGERS MEKTRON
Abstract: Rogers 104JEV 104KEx
Text: Performance Characteristics Dissipation Factor Tem perature Characteristics 20 10 Ui -30 g 1 5 40 -50 -60 2 -ra o -80 -90 -100 -55 -3 5 -15 5 25 45 65 85 105 125 TEMPERATURE, °C Environmental Parameters Impedance Curves Per MIL-C-39014D, MIL-STD-202F - As Applicable
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MIL-C-39014D,
MIL-STD-202F
ROGERS MEKTRON
Rogers
104JEV
104KEx
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Robinson Nugent CATALOG
Abstract: MC68461 SAB80286 WE32104 Z80000 IMST414 FGE2000 MCA2800ALS 82786 intel TC110G
Text: T Circuit C o m p o n en ts Inc. r MicrofQ 3000 PGA Decoupling Capacitors Micro/Q 3000 ceramic capacitors are a family of very low inductance decoupling capacitors specifically designed to be through-hole mounted under pin grid arrays PGAs , PGA sockets, and
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Untitled
Abstract: No abstract text available
Text: Introduction 1. Distinctive Features The V29BMC is a memory controller designed specifically for use in Am29000 based systems. The specific nature of such systems preclude the V29BMC from being a general purpose device. However, within the constraints of the targeted applications, it imposes few architectural restrictions.
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V29BMC
Am29000
V29BM
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744040
Abstract: scx6206 74589 744020 Flip-Flop 7471 744017 744017 counter sn 74373 scx6218 74395
Text: July 1985 SCX m icroC M O S G ate A rray Fam ily A pplication G uide TABLE OF CONTENTS 1.0 General Description . 2 2.0 Product Features. 2 Enhanced Product Features. . 2
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AA32096
744040
scx6206
74589
744020
Flip-Flop 7471
744017
744017 counter
sn 74373
scx6218
74395
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