Soldering Instructions
Abstract: reflow soldering profile BGA BGA reflow guide BGA PROFILING reflow temperature bga
Text: Tel: 800 404-0204 www.ironwoodelectronics.com Giga-snaP & BGA Surface Mount Foot Soldering Instructions Target PCBs, which are intended to accept the Ironwood Electronics BGA surface mount emulator foot can vary greatly in size, mass, and thickness. There are also several manufacturing
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BGA 731
Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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Untitled
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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reflow temperature rohs bga
Abstract: 0.65mm pitch BGA
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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0.65mm pitch BGA
Abstract: ASTM-B-488 157 BGA socket
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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BGA Package 0.35mm pitch
Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
Text: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed
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CH-1072
BGA Package 0.35mm pitch
E-tec Interconnect
.65mm bga land pattern
1072 Diode, SMD
3M Touch Systems
bpw 50
TEC Driver
8 pin ic base socket round pin type lead
qualitek
BGA reflow guide
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Untitled
Abstract: No abstract text available
Text: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been
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DS3802
380mAh
DS3802EXT
DS3802
DS3816
DS3832
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reflow temperature rohs bga
Abstract: No abstract text available
Text: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been
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DS3802
380mAh
DS3802EXT
DS3802
DS3816
DS3832
reflow temperature rohs bga
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Untitled
Abstract: No abstract text available
Text: XO02M610.01 - Rev. C - Page 1 of 2 Construction: • High purity alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat Lead free, RoHS Sn96.5/Ag3.0/Cu0.5 , 12mil diameter, BGA termination (Gnd-Signal-Gnd)
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XO02M610
12mil
10GHz
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Untitled
Abstract: No abstract text available
Text: XO02M610.00 - Rev. C - Page 1 of 2 Construction: • High purity alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat Lead free, RoHS Sn96.5/Ag3.0/Cu0.5 , 12mil diameter, BGA termination (Gnd-Signal-Gnd)
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XO02M610
12mil
20GHz)
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008-0520-0
Abstract: No abstract text available
Text: DDR SDRAM Terminator Technical Data Sheet FEATURES • • • • • • • • 18 Bit SSTL_2 Termination Sets Compliant to JEDEC Standard 8-9A Excellent High Frequency Performance Slim BGA Package 1% Resistor Tolerance Low Channel Capacitance Tape and Reel Packaging
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2011/65/EU
008-0520-0
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4701 RESISTOR
Abstract: No abstract text available
Text: BR02M560.0A - Rev A - Page 1 of 2 Product Family: Thin Film SMT Resistor Networks Part Number Series: Miniature BGA Series Construction: Features: • High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element
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BR02M560
ON/30
4701 RESISTOR
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Untitled
Abstract: No abstract text available
Text: Thermal Solutions for BGAS Home | Contact Us | About Aavid -Useful Links- For use with TO-220 packages Printer friendly version Search by part # Check distributor part inventory Browse Products -By Device- Part Number - 577202B00000G Mechanical Outline Drawing
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O-220
577202B00000G
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Untitled
Abstract: No abstract text available
Text: BR02M560.0A - Rev B - Page 1 of 2 Product Family: Thin Film SMT Resistor Networks Part Number Series: Miniature BGA Series Construction: Features: • High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element
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BR02M560
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Untitled
Abstract: No abstract text available
Text: Thermal Solutions for BGAS Home | Contact Us | About Aavid -Useful Links- For use with TO-220 packages Printer friendly version Search by part # Check distributor part inventory Browse Products -By Device- Part Number - 590102B03600G Mechanical Outline Drawing
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O-220
590102B03600G
59ring
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smd transistor w1a
Abstract: w2f smd transistor SMD W1A SMD W2A smd transistor marking w2a W1A smd code marking code W2F smd transistor w1a 95 DATASHEET SMD W2f smd code W2F
Text: This web update contains information on RoHS compliance legislative requirements, product family status and recommended soldering profiles RoHS/ELV Compliance by Product Family Rev 4: July ‘06 RoHS Compliance Requirements AVX compliance introduction to terms and Product Family Status:
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260oC
250oC
smd transistor w1a
w2f smd transistor
SMD W1A
SMD W2A
smd transistor marking w2a
W1A smd code
marking code W2F
smd transistor w1a 95 DATASHEET
SMD W2f
smd code W2F
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BGA reflow guide
Abstract: pcb warpage* in smt reflow pcb warpage in ipc standard JEDEC SMT reflow profile 324 bga thermal reballing lattice pb-free lattice pb-free products reballing bga
Text: Solder Reflow Guide for Surface Mount Devices November 2010 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which
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TN1076
1-800-LATTICE
BGA reflow guide
pcb warpage* in smt reflow
pcb warpage in ipc standard
JEDEC SMT reflow profile
324 bga thermal
reballing
lattice pb-free
lattice pb-free products
reballing bga
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AN1005
Abstract: paste profile C-200 IPC-A-610C X-RAY INSPECTION
Text: Application Note AN1005 RoHS Compliant ClearONE Printed Circuit Assembly Guidelines Introduction The standard ClearONE terminator is the industry leader in performance and reliability. The need to provide a lead free solution for resistor terminator networks in compliance with the RoHS initiative has
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AN1005
AN1005
paste profile
C-200
IPC-A-610C
X-RAY INSPECTION
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Untitled
Abstract: No abstract text available
Text: BR02M560.0A - Rev B - Page 1 of 2 Construction: • High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element Ball Grid Array BGA electrodes RoHS compliant (Sn96.5, Ag3.0, Cu0.5, SAC solder)
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BR02M560
ON/30
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EME-G700A
Abstract: No abstract text available
Text: LOGIC Devices Green Initiative ROHS Policy LOGIC Devices Incorporated – Green Initiative – Rev. C 4/01/13 1 Table of Contents LOGIC Devices’ Green Initiative . 3
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sn63pb37 solder wire
Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen
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sn63pb37 solder SPHERES
Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual
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AN-353-4
AN-353
AN-81.
sn63pb37 solder SPHERES
J-STD-020 SAC305
JEDEC J-STD-020d.1
Altera Flip Chip BGA warpage
reflow profile SAC305 bga
ALTERA AN81
sn63pb37 solder wire
sn63pb37 solder wire shelf life
pcb warpage in ipc standard
J-STD-020D
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FtBGA
Abstract: 256-FTBGA 132csBGA ispMACH 4A5 132-ucBGA 1048E 484-fpBGA TQFP 132 PACKAGE ispMACH 4A3 POWR607
Text: LEAD-FREE AND HALOGEN-FREE PACKAGING FROM LATTICE RoHS Compliant Packaging Lattice Semiconductor is committed to conducting business in a manner consistent with the efficient use of resources and materials, and the preservation of the natural environment.
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SMD W2A
Abstract: ntc 50-20 varistor W1A smd code SMD W1A SMD W2A 56 W2A smd smd code W2F smd marking code w1a for all smd components W2F AVX HQ
Text: TransGuard AVX Multilayer Ceramic Transient Voltage Suppressors GENERAL DESCRIPTION The AVX TransGuard® Transient Voltage Suppressors TVS with unique high-energy multilayer construction represents state-of-the-art overvoltage circuit protection. Monolithic
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260oC)
260oC
SMD W2A
ntc 50-20 varistor
W1A smd code
SMD W1A
SMD W2A 56
W2A smd
smd code W2F
smd marking code w1a
for all smd components W2F
AVX HQ
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