capacitor 47 nano
Abstract: No abstract text available
Text: X7R Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 0201 0402 0603 0805 1206 Soldering Packaging Reflow Only All Paper Reflow Only All Paper Reflow/Wave All Paper Reflow/Wave Paper/Embossed Reflow/Wave Paper/Embossed 0.60 ± 0.03 0.024 ± 0.001
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reflow
Abstract: soldering
Text: SOLDER REFLOW PROFILE RECOMMENDATIONS Reflow Profiles Table 1 SnPb Assembly Process – Package Peak Reflow Temperatures Table 2 Pb-free Assembly Process – Package Peak Reflow Temperatures Manual Soldering Conditions: ► Peak Temperature at terminals : 350 °C
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10 35L CAPacitor
Abstract: 22 35L CAPacitor 87L TO-92
Text: • Soldering Method and Allowable Range of Reflow Soldering Method ■ Recommended Land Size Allowable Range of Reflow Hot-Plate Reflow Infrared-Ray Reflow Air Reflow Size X Y a φ3 1.6 2.2 0.8 φ4 1.6 2.6 1.0 φ5 1.6 3.0 1.4 φ6.3 1.6 3.5 2.1 φ3x5.5L, φ8×6.2L, φ8×7L
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RIA Connect
Abstract: No abstract text available
Text: THR and SMT - what is it? The reflow process - what is it? What is actually meant by through-hole reflow? As the term suggests, wired components continue to be used. Through-hole reflow, is the new soldering process and the term describes the fact, i.e. reflow is soldering with
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PCB fill silicone
Abstract: No abstract text available
Text: Flame Retardant Silicone Coating Alloy Resistance Wire Tinned End Caps. Suitable For Reflow Soldering Alloy Resistance Wire, Wound To Specific Parameters Terminals Suitable For Reflow Soldering Terminals Suitable For Reflow Soldering Flame Ratardant Silicone Coating
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JIS-C-5202-
PCB fill silicone
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HTR resistors
Abstract: No abstract text available
Text: Flame Retardant Silicone Coating Alloy Resistance Wire Terminals Suitable For Reflow Soldering Tinned End Caps. Suitable For Reflow Soldering Alloy Resistance Wire, Wound To Specific Parameters Terminals Suitable For Reflow Soldering Flame Ratardant Silicone Coating
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535ZQF
HTR resistors
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED REFLOW CONDITION CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXA/PXseries onto a glass epoxy circuit board of 90B50B0.8mm
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90B50B0
40sec
30sec)
30sec
60sec
50sec)
E1001C
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sanyo electrolytic capacitors
Abstract: No abstract text available
Text: Surface Mount Type Aluminum Electrolytic Capacitors • Surface Mount Type Aluminum Electrolytic Capacitors Permissible Reflow Condition Permissible Reflow Condition ; air reflow and IR reflow temperature at the top of capacitor °C Peak temperature 230
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30sMAX.
sanyo electrolytic capacitors
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ISP2100
Abstract: reflow reflow profile
Text: QLogic Corporation Applications Note No. 83210-514-01 A Reflow Soldering Recommendations Products Affected Chip Name Part Number ISP2100 2405088 This applications note describes the reflow soldering recommendations for the ISP2100 chip. The recommended reflow soldering conditions are
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ISP2100
ISP2100
15conds
reflow
reflow profile
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Reflow Soldering Guide
Abstract: berex
Text: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo
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Reflow61110
B61110
Reflow Soldering Guide
berex
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reflow soldering profile BGA
Abstract: reflow temperature bga BGA PROFILING bga rework
Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already
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Untitled
Abstract: No abstract text available
Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:56 AM Page 69 CRYSTALS AND OSCILLATORS RECOMMENDED SOLDER REFLOW TYPICAL SOLDERING CONDITIONS FOR CRYSTALS AND OSCILLATORS SOLDERING METHOD SOLDERING IRON SOLDERING DIP Pre-heat REFLOW Reflow SOLDERING CONDITIONS TEMPERATURE
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reflow soldering profile BGA
Abstract: BGA PROFILING solder joint bga warpage bga rework
Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed
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GP1S33
Abstract: No abstract text available
Text: GP1S33 GP1S33 Subminiature, Reflow Sokieting Type Photointerrupter • Festures ■ OulSne 1. Ultra-compact package 2. PWB mounting type 3. High sensing accuracy Slit width : 0.3mm 4. Applying to reflow soldering Preheat : 160°C within 120 seconds Reflow : 200°C within 60 seconds
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GP1S33
GP1S33
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100Z
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100B
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100B
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100Y
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100MF 35v
Abstract: 8100V
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
100MF 35v
8100V
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WJ 5.5mmL Chip Type High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times WJ Chip type with 5.5mm height.
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2011/65/EU)
120Hz
8100D
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Untitled
Abstract: No abstract text available
Text: VISHAY Soldering Profile Vishay Dale RECOMMENCED PROFILES FOB SOLDER REFLOW Infrared Reflow 10 Second Max. Vapor Phase Reflow Document Number 35033 Revision 12-Jan-OO www.vishay.com 37
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12-Jan-OO
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electrolytic capacitor
Abstract: dip electrolytic capacitor
Text: ALUMINUM ELECTROLYTIC CAPACITORS Reflow soldering method for the chip aluminum electrolytic capacitor 1. Recommended conditions for reflow soldering The chip aluminum electrolytic capacitor is subjected to soldering by reflow method. Temperature and time conditions of reflow soldering shall be set as per each temperature profile shown below
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delamination leadframe
Abstract: No abstract text available
Text: VISHAY ▼ Vishay Telefunken Reflow Soldering Reflow Solder Profile The recommended profile is shown in figure 2 Vishay Telefunken transceivers are surface mount devices and are designed to be assembled to printed circuit boards PCBs using reflow soldering. Possible
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MFK Series
Abstract: No abstract text available
Text: Soldering Surface Mount Reflow Surface Mount Capacitors. Recommended Reflow Soldering Conditions The following conditions are recommended for reflow soldering of surface mount capacitors onto a glass epoxy circuit board of 90 x 50 x 0.8 mm with resist by cream solder (eutectic solder).
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