solder stop mask
Abstract: RE931
Text: Stock No.: RE931 Stock No.: RE931 SSOP-SMD Multiadapter shrink small outline package - pitch 0,65 mm / 0,635 mm - Epoxy fibre glass FR 4 1.5 mm double-sided 35 µm CU - plated through holes 1.00 mm Ø - adapter for 7 different SSOP Pitch (mm) 0,65 0,65 0,65
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RE931
RE932
RE932n
solder stop mask
RE931
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RE931-02
Abstract: RE931-05 RE931 RE931-07
Text: SSOP-SMD Multiadapter shrink small outline package RE931 - epóxido FR4 1,5 mm, por dos lados 35 µm CU (pth) - lado de soldadura y de componentes con una superficie de oro químico y una máscara inhibidora de soldadura - agujeros Ø 1,00 mm - adaptador para 7 SSOP diferentes
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RE931
RE931-01
RE931-02
RE931-03
RE931-04
RE931-05
RE931-06
RE931-07
RE931-02
RE931-05
RE931
RE931-07
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SSOP56
Abstract: adapter ssop56 adaptor ssop56 RE931-07 SSOP5 ssop-56
Text: SSOP56 Adapter shrink small outline package RE931-07 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 56 - hole dia 1.00 mm - size 37.5 x 29.5 mm
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SSOP56
RE931-07
adapter ssop56
adaptor ssop56
RE931-07
SSOP5
ssop-56
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SSOP48
Abstract: SSOP-48
Text: SSOP48 Adapter shrink small outline package RE931-06 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 48 - hole dia 1.00 mm - size 32.5 x 29.5 mm
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SSOP48
RE931-06
SSOP-48
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SSOP14 package
Abstract: SSOP14
Text: SSOP14 Adapter shrink small outline package RE931-01 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 14 - hole dia 1.00 mm - pitch 0.65 mm
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SSOP14
RE931-01
SSOP14 package
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SSOP28
Abstract: RE931-05PI
Text: SSOP28 Adapter shrink small outline package mit Pins RE931-05PI - Epoxydglashartgewebe FR4 1,5 mm, zweiseitig 35 µm CU (durchkontaktiert) - Löt- und Komponentenseiten mit einer Oberfläche aus chem. AU und Lötstoppmaske - pitch: 0,65 (208 mil) - pins: 28
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SSOP28
RE931-05PI
RE931-05PI
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE931-01 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 14 - hole dia 1.00 mm - size 13.0 x 23.5 mm
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RE931-01
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SSOP28 package
Abstract: RE931 shrink SSOP28
Text: SSOP28 Adapter shrink small outline package with pins RE931-05PI - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 28 - size 13.0 x 23.5 mm
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SSOP28
RE931-05PI
SSOP28 package
RE931
shrink
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RE931
Abstract: RE931-02 RE931-05 RE931-07
Text: SSOP-SMD Multiadapter shrink small outline package RE931 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - hole dia 1.00 mm - adapter for 7 different SSOP - pitch 0.65 mm / 0.635 mm
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RE931
RE931-01
RE931-02
RE931-03
RE931-04
RE931-05
RE931-06
RE931-07
RE931
RE931-02
RE931-05
RE931-07
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE931-06 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 48 - hole dia 1.00 mm - size 32.5 x 29.5 mm
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RE931-06
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE931-04 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 24 - hole dia 1.00 mm - size 19.5 x 23.5 mm
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RE931-04
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RE931-05
Abstract: 208-MIL
Text: Multiadapters RE931-05 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 (208 mil) - pins: 28 - hole dia 1.00 mm - size 13.0 x 23.5 mm
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RE931-05
RE931-05
208-MIL
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shrink
Abstract: SSOP24
Text: SSOP24 Adapter shrink small outline package RE931-04 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 24 - hole dia 1.00 mm - pitch 0.65 mm
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SSOP24
RE931-04
shrink
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RE931-05
Abstract: RE931-07 RE931 RE931-02
Text: SSOP-SMD Multiadapter shrink small outline package RE931 - fibre de verre époxyde FR4 1,5 mm, simple face 35 µm CU (entiérement métallisées) - côté de soudure et des composants avec une surface d´or chimique et pourvus d´un masque d´arrêt de soudure
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RE931
RE931-01
RE931-02
RE931-03
RE931-04
RE931-05
RE931-06
RE931-07
RE931-05
RE931-07
RE931
RE931-02
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Untitled
Abstract: No abstract text available
Text: Multiadapters RE931-05PI - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 28 - size 13.0 x 23.5 mm
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RE931-05PI
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SSOP20
Abstract: SSOP20 package
Text: SSOP20 Adapter shrink small outline package RE931-03 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 20 - hole dia 1.00 mm - pitch 0.65 mm
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SSOP20
RE931-03
SSOP20 package
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FR4 epoxy
Abstract: SSOP16 package ssop16 RE931-02
Text: SSOP16 Adapter shrink small outline package RE931-02 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 (208 mil) - pins: 16 - hole dia 1.00 mm - pitch 0.65 mm
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SSOP16
RE931-02
FR4 epoxy
SSOP16 package
RE931-02
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solder stop mask
Abstract: No abstract text available
Text: Multiadapters RE931-03 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 20 - hole dia 1.00 mm - size 20.0 x 23.5 mm
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RE931-03
solder stop mask
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RE931-07
Abstract: No abstract text available
Text: Multiadapters RE931-07 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 56 - hole dia 1.00 mm - size 37.5 x 29.5 mm
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RE931-07
RE931-07
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RE931
Abstract: RE931-02 RE931-05 RE931-07
Text: SSOP-SMD Multiadapter shrink small outline package RE931 - Epoxydglashartgewebe FR4 1,5 mm, zweiseitig 35 µm CU (durchkontaktiert) - Löt- und Komponentenseiten mit einer Oberfläche aus chem. AU und Lötstoppmaske - Lochdurchmesser 1,00 mm - Adaptionsplatine für 7 verschiedene SSOP
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RE931
RE931-01
RE931-02
RE931-03
RE931-04
RE931-05
RE931-06
RE931-07
RE931
RE931-02
RE931-05
RE931-07
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SSOP28 package
Abstract: RE931-05 SSOP28 208mil
Text: SSOP28 Adapter shrink small outline package RE931-05 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 (208 mil) - pins: 28 - hole dia 1.00 mm - pitch 0.65 mm
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SSOP28
RE931-05
SSOP28 package
RE931-05
208mil
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enamelled copper wire swg table
Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
Text: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .
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element-14
127mm
210x297mm)
420x297mm)
33MTR
enamelled copper wire swg table
RS-274-D
for all smd components
F585-34
BS4520
BS4584 PART 3
MELF 3514 dimensions
jigs and fixtures mini project
BS4584 102.5
cuzn40pb2
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