CUI STACK
Abstract: RE20S RE20V 390K
Text: RE20S C U I Stack, Inc., 1997 RE20V Panel Cutout/PCB Layout 4 L 7 Ø6.0 Panel Cutout/PCB Layout 9.5 Panel Cutout Ø6.0 Ø9.2 11 13 Ø9.2 M9 8-Ø1 8 4 3 2 M9 1 L 12 L ELECTRICAL 1. Input Power: 5.0 VDC ±5% @ 7mA 2. Output Voltage: H = Vcc- 0.4V L ≤ 0.4V
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RE20S
RE20V
RE20C
RE20F
RE20XXXXXXX
CUI STACK
RE20S
RE20V
390K
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Untitled
Abstract: No abstract text available
Text: Prototyping Board RE200-LF - EPOXY fibre-glass FR4 1.5 mm single-sided 35 µm CU - hot air leveling HAL-leadfree - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm
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RE200-LF
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RE201-LFDS
Abstract: No abstract text available
Text: HF-Platine RE201-LFDS - fibre de verre époxyde FR4 1,5 mm, double face 35 µm CU NPTH - étamé à chaud (HAL-leadfree) - 34 x 54 pastilles 2,0 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - connecteur 32/ 64/ 96-pôles - DIN 41612 type C - le côé à équiper est totalement plaqueé de CU
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RE201-LFDS
RE201-LFDS
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RE200-HPDS
Abstract: No abstract text available
Text: Prototyping Board RE200-HPDS - SRBP-paper FR2 1.5 mm double-sided 35 µm CU npth - organic soldering protection (OSP) - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm
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RE200-HPDS
RE200-HPDS
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hart
Abstract: No abstract text available
Text: HF-Platine RE201-HPDS - Phenolharz-Hartpapier FR2 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - organischer Oberflächenschutz (OSP) - 34 x 54 Lötinseln 2,0 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm - Steckverbinder 32/ 64/ 96-polig DIN 41612 Bauform C
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RE201-HPDS
96-polig
hart
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RE201-LFDS
Abstract: No abstract text available
Text: HF-Platine RE201-LFDS - Epoxyd FR4 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - heißverzinnt (HAL-leadfree) - 34 x 54 Lötinseln 2,0 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm - Steckverbinder 32/ 64/ 96-polig DIN 41612 Bauform C
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RE201-LFDS
96-polig
RE201-LFDS
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RE200
Abstract: No abstract text available
Text: 2002-05-13 PRODUKTINFORMATION Vi reserverar oss mot fel samt förbehåller oss rätten till ändringar utan föregående meddelande ELFA artikelnr 48-320-02 Labbkort RE200 HP 48-320-10 Labbkort RE200 EP
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RE200
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Untitled
Abstract: No abstract text available
Text: HF-Platine RE201-HPDS - résine phénolplaste FR2 1,5 mm, double face 35 µm CU - Protection organique de la surface OSP - 34 x 54 pastilles 2,0 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - connecteur 32/ 64/ 96-pôles - DIN 41612 type C - le côé à équiper est totalement plaqueé de CU
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RE201-HPDS
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RE201-LFDS
Abstract: No abstract text available
Text: HF-board RE201-LFDS - EPOXY fibre-glass FR4 1.5 mm double-sided 35 µm CU npth - hot air leveling (HAL-leadfree) - 34 x 54 single-hole conductor 2.0 mm² - hole spacing 2.54 x 2.54 mm - hole dia 1,0 mm - connector 32/ 64/ 96-channel - DIN 41612 type C - the component side is totally laminated by copper
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RE201-LFDS
96-channel
RE201-LFDS
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Untitled
Abstract: No abstract text available
Text: Laborkarte RE200-LFDS - Epoxyd FR4 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - heißverzinnt (HAL-leadfree) - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm
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RE200-LFDS
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modo
Abstract: No abstract text available
Text: Placa de circuito impreso HF RE201-HPDS - papel endurecido con resina fenolada FR2 1,5 mm, por dos lados 35 µm CU npth - protección orgánica de la superficie (OSP) - 34 x 54 nodos de soldadura Ø 2,0 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm
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RE201-HPDS
modo
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RE200-HPDS
Abstract: No abstract text available
Text: Laborkarte RE200-HPDS - Phenolharz-Hartpapier FR2 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - organischer Oberflächenschutz (OSP) - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm
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RE200-HPDS
RE200-HPDS
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Untitled
Abstract: No abstract text available
Text: Prototyping Board RE200-HP - SRBP-paper FR2 1,5 mm single-sided 35 µm CU - organic soldering protection OSP - 38 x 61 single-hole conductor 2,2 mm Ø - hole spacing 2,54 x 2,54 mm - hole dia 1,0 mm - size 100 x 160 mm
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RE200-HP
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RE200-HPDS
Abstract: No abstract text available
Text: Carte d´Expérimentation RE200-HPDS - résine phénolplaste FR2 1,5 mm, double face 35 µm CU - Protection organique de la surface OSP - 38 x 61 pastilles 2,2 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - dimensions 100 x 160 mm
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RE200-HPDS
RE200-HPDS
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RE20S
Abstract: No abstract text available
Text: RE20S C U I Stack, Inc., 1997 RE20V Panel Cutout/PCB Layout Ø6.0 8 PC Board 15 8 6 9.5 Panel Cutout Ø9.2 M9 15.0 11 13 Ø9.2 M9 8.2 Ø6.0 Ø6.0 24.5 2.5x3 RE20C Panel Cutout/PCB Layout 9.5 9 L 3 12 19.2 RE20F Ø3.2 1.5 8 18.0 11.5 12 8-Ø1 L 8-Ø1 8
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RE20S
RE20V
RE20F
RE20C
20PPR,
25PPR
20PPR
RE20XXXXXXXX
RE20S
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RE200
Abstract: fr4 datasheet FR4 data sheet RE200-LF
Text: Tarjeta experimental RE200-LF - epóxido FR4 1,5 mm, por un lado 35 µm CU - estañado en caliente HAL-leadfree - 38 x 61 nodos de soldadura Ø 2,2 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm - tamaño 100 x 160 mm
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RE200-LF
RE200
fr4 datasheet
FR4 data sheet
RE200-LF
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re200
Abstract: No abstract text available
Text: Laborkarte RE200-HP - Phenolharz-Hartpapier FR2 1,5 mm, einseitig 35 µm CU - organischer Oberflächenschutz OSP - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm
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RE200-HP
re200
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Untitled
Abstract: No abstract text available
Text: Tarjeta experimental RE200-LFDS - epóxido FR4 1,5 mm, por dos lados 35 µm CU npth - estañado en caliente (HAL-leadfree) - 38 x 61 nodos de soldadura Ø 2,2 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm - tamaño 100 x 160 mm
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RE200-LFDS
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re200
Abstract: No abstract text available
Text: Laborkarte RE200-LF - Epoxyd FR4 1,5 mm, einseitig 35 µm CU - heißverzinnt HAL-leadfree - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm
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RE200-LF
re200
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Untitled
Abstract: No abstract text available
Text: Prototyping Boards Dual Inline RE200-HT - High-temperature printed circuit board - On auf polyimide resin base glass fiber P97 1.50 mm, one-sided 35 m CU - Surface in chemical Au - Suitable for temperature ranges up to 260˚ centigrade - 38 x 61 soldering island 2.2 mm
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RE200-HT
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Untitled
Abstract: No abstract text available
Text: Prototyping Board RE200-LFDS - EPOXY fibre-glass FR4 1.5 mm double-sided 35 µm CU npth - hot air leveling (HAL-leadfree) - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm
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RE200-LFDS
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Untitled
Abstract: No abstract text available
Text: Laborkarte RE200-C3 - CEM3 1,5 mm einseitig 35 µm CU - heißverzinnt HAL-bleifrei - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm
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RE200-C3
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RE200
Abstract: RE20
Text: Carte d´Expérimentation RE200-C3 - CEM3 1,5 mm, simple face 35 µm CU - étamé à chaud HAL-leadfree - 38 x 61 pastilles 2,2 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - dimensions 100 x 160 mm
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RE200-C3
RE200
RE20
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RE200B
Abstract: Sensor Pir RE200B RE-200B RE200B sensor RE200B datasheet PIR RE200B Fresnel lens IR RE200B amplifier circuit re200b FL65
Text: INFRARED PARTS MANUAL RE200B FL65 S211FL GLOLAB CORPORATION Thank you for buying our Pyroelectric Infrared components. The goal of Glolab is to produce top quality electronic kits, products and components. All of our kits are designed by Glolab engineers and tested in our laboratory.
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RE200B
S211FL
S211FL
RE200B
Sensor Pir RE200B
RE-200B
RE200B sensor
RE200B datasheet
PIR RE200B
Fresnel lens
IR RE200B
amplifier circuit re200b
FL65
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