Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-A07 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-256C-A07 256-pin ceramic QFP (FPT-256C-A07)
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FPT-256C-A07
256-pin
FPT-256C-A07)
F256013SC-1-3
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296-0025
Abstract: Aluminum nitride QFP
Text: QUAD L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02 256-pin ceramic QFP (FPT-256C-C02)
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FPT-256C-C02
256-pin
FPT-256C-C02)
F256012SC-3-3
296-0025
Aluminum nitride QFP
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Untitled
Abstract: No abstract text available
Text: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C01 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-256C-C01 256-pin ceramic QFP
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FPT-256C-C01
256-pin
FPT-256C-C01)
F256003SC-5-3
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-A07 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-256C-A07 256-pin ceramic QFP (FPT-256C-A07) 10.50(.413)MAX 39.64±0.30 SQ (1.561±.012)
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FPT-256C-A07
256-pin
FPT-256C-A07)
F256013SC-1-3
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nitride
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03 256-pin ceramic QFP (FPT-256C-C03)
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FPT-256C-C03
256-pin
FPT-256C-C03)
F256014SC-2-3
nitride
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FPT-256P-M06
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 256 PIN PLASTIC FPT-256P-M06 256-pin plastic QFP Lead pitch 0.40mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-256P-M06 256-pin plastic QFP (FPT-256P-M06) 30.60±0.20 SQ (1.205±.008)
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FPT-256P-M06
256-pin
FPT-256P-M06)
75MAX
20REF
60NOM
10MAX
36MAX
FPT-256P-M06
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FPT-256P-M06
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M06 256-pin plastic QFP Lead pitch 0.40 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-256P-M06 256-pin plastic QFP (FPT-256P-M06)
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FPT-256P-M06
256-pin
FPT-256P-M06)
75MAX
20REF
60NOM
10MAX
36MAX
FPT-256P-M06
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C1995
Abstract: 256 pin ceramic Quad flat package 256-PIN
Text: QUAD FLAT L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-A07 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-256C-A07 256-pin ceramic QFP (FPT-256C-A07) 10.50(.413)MAX 39.64±0.30 SQ (1.561±.012) 2.10(.083) 36.00±0.30 SQ
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FPT-256C-A07
256-pin
FPT-256C-A07)
F256013SC-1-3
C1995
256 pin ceramic Quad flat package
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Untitled
Abstract: No abstract text available
Text: QUAD L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C01 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-256C-C01 256-pin ceramic QFP (FPT-256C-C01) 3.80 (.150) MAX
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FPT-256C-C01
256-pin
FPT-256C-C01)
F256003SC-5-3
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FPT-256P-M09
Abstract: No abstract text available
Text: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 EIAJ code : P-FQFP256-28 x 28-0.40 256-pin plastic QFP FPT-256P-M09 256-pin plastic QFP (FPT-256P-M09) Lead pitch 0.40 mm Package width × package length 28.0 × 28.0 mm Lead shape
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FPT-256P-M09
P-FQFP256-28
256-pin
FPT-256P-M09)
F256025S-c-2-2
FPT-256P-M09
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yamaichi carrier
Abstract: No abstract text available
Text: IC198 Series SMT Quad Flat Package (QFP) - 256 pins 256 Pins QFP - (52 x 76 pins) 0.5 mm pitch Socket Dimensions Specifications Current Rating: Rated Voltage: Contact Resistance: 0.3 A 50V DC 30mΩ max. at 10mA and 20mV max. Insulation Resistance: 500MΩ min. at 500V DC
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IC198
250Veff
UL94V-0)
over2000
IC198-256-2001
25ray)
yamaichi carrier
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A2 diode
Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5
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S176GM-50-3EU,
S176GM-50-8EU-2
S208GD-50-5ML-2
S208GD-50-5EL-1
P208GD-50-LML,
S208GD-50-8EU-2
S216GM-40-8EV
P240GN-50-LMU,
S256GD-40-LMV,
S272GP-50-LMU,
A2 diode
transistor A2
3eb data
lmu a2
TQFP 32 PACKAGE
272-pin
TQFP 100 Pitch 0,4
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QFP Package 128 lead .5mm
Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
Text: 3.16mm [0.124"] 3.54mm [0.139"] 1 39.3mm [1.547"] 41.9mm [1.650"] 32.23mm [1.269"] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket 1.00mm centers, 26X26 array, 27X27mm body to 256 QFP, 0.5mm
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26X26
27X27mm
PC-BGA/QFP-SX72A-Z-01
A54Sx72A-CQ256
A54SX72A-FG484
SI-SX72-ACQ256SFG484
QFP Package 128 lead .5mm
QFP 128 lead .5mm
BGA reflow guide
SI-SX72-ACQ256SFG484
BGA 256 PACKAGE thermal resistance
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7404
Abstract: MQFP Tray 28 QFP JEDEC tray 32MM
Text: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315.0 322.6 SECTION A-A' 32.8 3.82 6.35 7.62 27.3 Applied Package 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) 256-pin Plastic QFP (Fine Pitch) (3.2mm thick)
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208-pin
256-pin
7404
MQFP Tray 28
QFP JEDEC tray
32MM
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Untitled
Abstract: No abstract text available
Text: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C01 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic
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FPT-256C-C01
256-pin
FPT-256C-C01)
F256003SC-5-3
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FPT-256C-C02
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02
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FPT-256C-C02
256-pin
FPT-256C-C02)
F256012SC-3-3
FPT-256C-C02
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FPT-256C-C03
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03
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FPT-256C-C03
256-pin
FPT-256C-C03)
F256014SC-2-3
FPT-256C-C03
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256 pin ceramic Quad flat package
Abstract: Aluminum nitride QFP
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic
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FPT-256C-C02
256-pin
FPT-256C-C02)
F256012SC-3-3
256 pin ceramic Quad flat package
Aluminum nitride QFP
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256 pin ceramic Quad flat package
Abstract: FPT-256C-C03
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic
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Original
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FPT-256C-C03
256-pin
FPT-256C-C03)
F256014SC-2-3
256 pin ceramic Quad flat package
FPT-256C-C03
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FPT-256P-M09
Abstract: QFP PACKAGE thermal resistance
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 256-pin plastic QFP Lead pitch 0.40 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type
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FPT-256P-M09
256-pin
FPT-256P-M09)
45MIN
75MAX
018MIN~
030MAX)
F256025S-1C-1
FPT-256P-M09
QFP PACKAGE thermal resistance
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FPT-256P-M04
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M04 256-pin plastic QFP Lead pitch 0.50 mm Package width x package length 40 × 40 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.50 mm
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FPT-256P-M04
256-pin
FPT-256P-M04)
F256018SC-1C-6
FPT-256P-M04
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 256 PIN PLASTIC FPT-256P-M04 256-pin plastic QFP Lead pitch 0.50mm Package width x package length 40 × 40mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.50mm Target use For hybrid ICs FPT-256P-M04
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FPT-256P-M04
256-pin
FPT-256P-M04)
F256018SC-pitch
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C4228
Abstract: No abstract text available
Text: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.
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26X26X5
C4228
PC-BGA/QFP-SX32A-S-01
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SOP48
Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Text: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7
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OCR Scan
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QFP12
QFP13
QFP15
QFP14
12X12X1
14X20X2
14X14X1
SOP48
CF RM sot89
SOP38
14X14X2
epson QFP 216
45x45 mm bga
14x14x2.7
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