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    QFP PACKAGE MASS Search Results

    QFP PACKAGE MASS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    QFP PACKAGE MASS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    mask rom

    Abstract: FP-100A Hitachi DSAUTAZ006
    Text: B. Product Lineup Product H8S/2282 H8S/2281 Type Name Model Marking Package Code F-ZTAT version HD64F2282 HD64F2282 100-pin QFP (FP-100A) Mask ROM version HD6432282 HD6432282(*) 100-pin QFP (FP-100A) Mask ROM version HD6432281 HD6432281(*) 100-pin QFP (FP-100A)


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    PDF HD64F2282 HD6432282 HD6432281 HD6432282( HD6432281( 100-pin FP-100A) mask rom FP-100A Hitachi DSAUTAZ006

    lQFP256

    Abstract: TEQFP208 QFP PACKAGE thermal resistance SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY BGA and QFP Package LQFP-256
    Text: Technical Analysis Low-Cost Packaging Technology Using QFP Low-Cost Packaging Technology Using QFP The combination of bus bar technology and TEQFP technology is currently receiving attention in the development of a semiconductor package that realizes function


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    Untitled

    Abstract: No abstract text available
    Text: Quad Flat Package QFP DIP or PGA Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP or PGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface


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    PDF AK208PGA-208QFP QFP-08) QFP-09)

    AK32D300-QFP5X5

    Abstract: AK32D600-QFP5X5 AK32D300-QFP7X7 AK32D600-QFP7X7 AK32D600-QFP7X7-A1-1 AK44D600-QFP .65mm AK44D600-QFP .8mm 10x10 AK44D900-QFP 1.0mm AK48D600-QFP .5mm 7x7 AK48D900-QFP .8mm 12x12
    Text: ACCUTEK Quad Flat Package QFP DIP or PGA Adapters MICROCIRCUIT CORPORATION DIP or PGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface


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    PDF AK208PGA-208QFP QFP-08) QFP-09) AK32D300-QFP5X5 AK32D600-QFP5X5 AK32D300-QFP7X7 AK32D600-QFP7X7 AK32D600-QFP7X7-A1-1 AK44D600-QFP .65mm AK44D600-QFP .8mm 10x10 AK44D900-QFP 1.0mm AK48D600-QFP .5mm 7x7 AK48D900-QFP .8mm 12x12

    HD64F2612

    Abstract: HD6432611 HD6432612 QFP-80 hitachi package
    Text: C. Product Code Lineup Package Hitachi Package Code Product Type QFP-80 (FP-80Q) H8S/2612 F-ZTAT version Standard product HD64F2612 Mask ROM version* Standard product HD6432612 Standard product HD6432611 Note: * In planning D. Package Dimensions The package dimension that is shown in the Hitachi Semiconductor Package Data Book has


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    PDF QFP-80 FP-80Q) H8S/2612 HD64F2612 HD6432612 HD6432611 FP-80Q HD64F2612 HD6432611 HD6432612 QFP-80 hitachi package

    HD64F2612

    Abstract: Hitachi DSAUTAZ006
    Text: D. Product Code Lineup Package Hitachi Package Code Product Type QFP-80 (FP-80A) H8S/2612 E. F-ZTAT version Standard product HD64F2612 Mask ROM version Standard product HD6432612 Standard product HD6432611 Package Dimensions The package dimension that is shown in the Hitachi Semiconductor Pakage Data Book has


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    PDF H8S/2612 QFP-80 FP-80A) HD64F2612 HD6432612 HD6432611 FP-80A FP-80A Hitachi DSAUTAZ006

    MO-235 FOOTPRINT

    Abstract: die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc
    Text: Products LQFP Low Profile Quad Flat Package High reliability, Standard Lead type Packages with rich line-ups • High pin-count, ideal for high-functionality, high-I/Ocount LSIs • Small size, allowing high-density mounting • Thin QFP LQFP with package mounting height of


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    PDF SC-100 MO-235 MO-235 FOOTPRINT die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc

    HDMP-1636AG

    Abstract: HDMP-T1636AG X3-230-1994
    Text: Agilent Gigabit Ethernet and Fibre Channel SerDes ICs Data Sheet HDMP-1636AG Transceiver HDMP-1646AG Transceiver HDMP-T1636AG Transceiver Description The HDMP-1636AG/46AG/ T1636AG transceiver is a single integrated circuit packaged in a plastic QFP package. It provides


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    PDF HDMP-1636AG HDMP-1646AG HDMP-T1636AG HDMP-1636AG/46AG/ T1636AG spe-026, HDMP-1636AG/1646AG/T1636AG. 5988-6605EN 5989-3029EN X3-230-1994

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


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    PDF SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket

    MTT150

    Abstract: 315HZ NC1636 teac Teac head CXA2509AQ CXA2510AQ CXA2511AQ F120 A-bex TCC-130
    Text: CXA2509AQ Playback Equalizer Amplifier with Music Sensor Description The CXA2509AQ is an IC designed for use in car stereo cassette decks. Functions include playback equalizer amplifier and music sensor into a single chip. Features • Few external parts • Small package 40-pin QFP


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    PDF CXA2509AQ CXA2509AQ 40-pin CXA2511AQ) CXA2510AQ) 40PIN QFP-40P-L01 QFP040-P-0707 42/COPPER MTT150 315HZ NC1636 teac Teac head CXA2510AQ CXA2511AQ F120 A-bex TCC-130

    MTT150

    Abstract: Teac head 315HZ sony music CXA2509AQ CXA2510AQ CXA2511AQ F120 VOLTMETER SELECTOR SWITCH c10 connection diagram
    Text: CXA2509AQ Playback Equalizer Amplifier with Music Sensor Description The CXA2509AQ is an IC designed for use in car stereo cassette decks. Functions include playback equalizer amplifier and music sensor into a single chip. Features • Few external parts • Small package 40-pin QFP


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    PDF CXA2509AQ CXA2509AQ 40-pin CXA2511AQ) CXA2510AQ) 40PIN QFP-40P-L01 P-QFP40-7x7-0 MTT150 Teac head 315HZ sony music CXA2510AQ CXA2511AQ F120 VOLTMETER SELECTOR SWITCH c10 connection diagram

    HDMP-1636AG

    Abstract: HDMP-1646AG HDMP-T1636AG RX638
    Text: HDMP-1636AG Gigabit Ethernet and Fibre Channel SerDes ICs Data Sheet HDMP-1636AG Transceiver HDMP-1646AG Transceiver HDMP-T1636AG Transceiver Description The HDMP-1636AG/46AG/T1636AG transceiver is a single integrated circuit packaged in a plastic QFP package. It provides a low-cost, low-power physical


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    PDF HDMP-1636AG HDMP-1636AG HDMP-1646AG HDMP-T1636AG HDMP-1636AG/46AG/T1636AG MS-026, HDMP-1636AG/1646AG/T1636AG. 5988-6605EN 5989-3029EN RX638

    S1R72013

    Abstract: S1R72003 free circuit diagram of DMA controller
    Text: PF1316-01 S1R72013 USB2.0 Device Controller z 0.35µm CMOS Process z Installed with UTMI1.0-compliant transceiver circuit z Supports USB2.0 HS/FS modes z QFP-64pin/PFBGA-100pin package „ DESCRIPTION The S1R72013 is a general-purpose device controller LSI that supports the USB2.0-compliant high/full-speed


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    PDF PF1316-01 S1R72013 QFP-64pin/PFBGA-100pin S1R72013 S1R72003 480Mbps) S1R72003 free circuit diagram of DMA controller

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


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    PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    ov7670

    Abstract: OV5642 ov7725 OV7720 OV7690 ov9665 OV6920 ov9655 ov7949 ov5642 omnivision
    Text: 2008 Fall product guide turning the imaging world upside down OmniBSI Backside Illumination Technology color filter co er OmniBSI represents a revolution in the mass production of CMOS image sensors CIS , adopting a radically different approach to traditional pixel


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    PDF OV6130-C48A ov7670 OV5642 ov7725 OV7720 OV7690 ov9665 OV6920 ov9655 ov7949 ov5642 omnivision

    Untitled

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


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    PDF Q1-02

    EIA-556-A

    Abstract: xilinx packaging label polystyrene EIA-556A
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


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    PDF Q1-02 equipmQ100 TQ144 VQ100 EIA-556-A xilinx packaging label polystyrene EIA-556A

    VR10000 Series

    Abstract: uPD70F3033Y NEC VR4300 VR12000
    Text: Microcomputer CD-ROM Microcomputer 32-Bit CD-ROM X13769XJ2V0CD00 X13769XJ2V0CD00 CD-ROM 03-1 03-1 Microcomputer 32-Bit Microprocessor V800 SeriesTM • V800 Series Road Map Support of instructions for multimedia MIPS For multimedia processing applications


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    PDF 32-Bit) X13769XJ2V0CD00 32-Bit X13769XJ2V0CD00 PD70741 V821TM 729/AnnexA/B ASR1600/CNote VR10000 Series uPD70F3033Y NEC VR4300 VR12000

    87CH46N

    Abstract: 87CM23F 87cm14n 87CP71F 87c408n 87CM40AF 87CK38N 87CK40AN 87C846N 87CM21F
    Text: TO SHIBA Products Guide TLCS-870 Products Naming TMP 8 7 C H 0 0 D F Package F QFP N SDIP U //QFP M SOP ROM Size 4 4KB H 16KB N 40KB 8 8KB K 24KB P 48KB C 12KB M 32KB S 60KB Process C CMOS Mask ROM TLCS-870 Series Joshiba Micro-Processor 1-1 P One Time PROM


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    PDF TLCS-870 18-bit 16-bit 87C800N DIP64-P-750-1 87PH00N 87C800F FP64-P-1420-1 87CH46N 87CM23F 87cm14n 87CP71F 87c408n 87CM40AF 87CK38N 87CK40AN 87C846N 87CM21F

    TJ 1H

    Abstract: 27C64 CXP5070 l021
    Text: CXP5070 SONY CMOS 4-bit 1 Chip Microcomputer Description CXP5070 is a CMOS 4-bit 1 chip microcomputer of piggyback/evaluator combined type which has been developed for functional evaluation of the CXP5076/CXP5078. Piggyback type Package Outline Unit : mm 80 pin QFP Ceramic


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    PDF CXP5070 CXP5070 CXP5076/CXP5078. 19MHz ns/32kHz 27C64 80-pin 32kHz TJ 1H l021

    8d15

    Abstract: AIC-6060 AIC6060 SMD HARD DISK CONTROLLER ST412HP ESDI 6060 adaptec
    Text: • :.3bb3ëek ADAPTEC INC MME D E E 021441 b 000502 b AIC-6060 b D A AC 1 "PS2'?>3'b> Single-Chip PC XT/AT Mass Storage Controller AIC-6060 Typical Application FEATURES Host Interface • On-chip registers to emulate the IBM AT Task File, and XT Command Descriptor Block


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    PDF 021MMlb 000202b AIC-6060 16-bit 16-byte 84-pin 100-pin 8d15 AIC6060 SMD HARD DISK CONTROLLER ST412HP ESDI 6060 adaptec

    AIC6250

    Abstract: AIC-6110 adaptec aic aic-6250
    Text: adaptec A IP - R f i IU \ J 1 1 fi î I U Single-Chip SCSI Mass Storage Controller DATA BUFFER SRAM 64K M A X DRAM Ó4K M AX # 8 MB/sec 3 .5 /2 .5 INCH HARD DISK AIC-6110 5 MB/sec MASS STORAGE CONTROLLER SCSI BUS 24 M b/sec DATA SEPARATOR MICROPROCESSOR INTEL 8 0 C 196


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    PDF AIC-6110 68HC11 AIC-6110 31patible 32-bit 48-bit 16-bit AIC6250. AIC6250 adaptec aic aic-6250

    AIC6250

    Abstract: AIC-6110
    Text: adaptec A l O - f i l “1 H U I I U Single-Chip SCSI Mass Storage Controller I x IU DATA BUFFER SRAM 64K MAX DRAM 64K MAX I SCSI BUS 8 MB/sec 3.5/2.5 INCH HARD DISK AIC-6110 5 MB/sec MASS STORAGE CONTROLLER 24 Mb/sec DATA SEPARATOR MICROPROCESSOR INTEL 80C196


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    PDF AIC-6110 31-word 32-bit 48-bit 16-bit AIC-6250. AIC6250

    AIc SCSI

    Abstract: AIC-6110
    Text: adaptec A l O - f i l U I I x IU “1 H I U Single-Chip SCSI Mass Storage Controller DATA BUFFER SRAM 64K M AX DRAM 64K M AX I 8 MB/sec 3 .5 /2.5 INCH HARD DISK AIC-6110 5 MB/sec MASS STORAGE CONTROLLER SCSI BUS 24 M b/sec DATA SEPARATOR MICROPROCESSOR INTEL 8 0 C 196


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    PDF AIC-6110 31-word 32-bit 48-bit 16-bit AIC-6250. AIc SCSI