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    QFP 0.3MM PITCH Search Results

    QFP 0.3MM PITCH Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    8501002YC Rochester Electronics LLC Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    8501001YA Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    NG82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 Visit Rochester Electronics LLC Buy
    MQ80C196KB-12 Rochester Electronics LLC Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    TMC2081KBC Rochester Electronics LLC Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 Visit Rochester Electronics LLC Buy

    QFP 0.3MM PITCH Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Oscilloscope

    Abstract: QFP 0.3mm pitch
    Text: MicroGripperTM Oscilloscope Kit Oscilloscope Probe Adapter 0.8mm to 0.3mm Fine-Pitched Probing With Any Standard Oscilloscope w w w w w Connect to devices with lead pitches from 0.8mm to 0.3mm Use on a variety of QFP and SOIC packages Reduces chance of shorting with smallest wire tip diameter 0.08mm


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    PDF DOD-5011) Oscilloscope QFP 0.3mm pitch

    0.3mm qfp

    Abstract: No abstract text available
    Text: MicroGripper 0.5-0.3mm MicroGripper Industry's smallest gripper simplifies testing of High-Performance Integrated Circuits w w w w w w w Used on a variety of QFP & SOIC chip packages Connects to devices with lead pitches as small as 0.3mm Reduces chance of shorting with smallest wire tip diameter 0.08mm


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    PDF 10/pkg. 0.3mm qfp

    QFP 0.3mm pitch

    Abstract: IPC-4101 345C BOX21151 IPC4553 SF-QFE80SC-L-01F
    Text: RoHS COMPLIANT Emulates QFP package: 12.0mm body 14.0mm Tip to Tip 0.5mm pitch 13.2mm [0.520"] PAD DETAIL 0.5mm Top View 19 0.5mm =9.5mm 0.3mm 12.2mm [0.480"] 13.2mm [0.520"] 0.46mm±0.03mm dia. 0.1mm rad. 1.27mm typ. 2 6.4mm 0.250" 1 Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]


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    PDF IPC4553 o6/83/98, SF-QFE80SC-L-01F BOX21151 SF-QFE080SC-L-01F QFP 0.3mm pitch IPC-4101 345C IPC4553

    QFP lead pitch 0.3mm

    Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package
    Text: Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2000 Registration


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    PDF Sep2009 ISO9001 50x50mm QFP lead pitch 0.3mm BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package

    SF-QFJ256SA-L-01

    Abstract: No abstract text available
    Text: Detail A 41.28mm 1.625 38.99mm 1.535 0.0200" pitch Index pin Pin 256 Pin 1 38.99mm 1.535 41.28mm 1.625 Top View 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 6.35mm 0.250 1 0.0200" pitch B Side View 1 DETAIL A Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material.


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    PDF FR4/G10 SF-QFJ256SA-L-01

    SF-QFJ256SC-L-01

    Abstract: qfp 0.3mm pitch
    Text: Detail A 41.28mm 1.625 38.99mm 1.535 0.0200" pitch Index pin Pin 256 Pin 1 38.99mm 1.535 41.28mm 1.625 Top View 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 6.35mm 0.250 1 0.0200" pitch B Side View 1 DETAIL A Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material.


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    PDF FR4/G10 SF-QFJ256SC-L-01 qfp 0.3mm pitch

    QFP 0.3mm pitch

    Abstract: SF-QFE256SB-L-01
    Text: Detail A 39.37mm 1.550 37.08mm 1.460 0.5mm Top View 37.08mm 1.460 39.37mm 1.550 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 1 6.35mm 0.250 Side View 0.5mm. pitch B A DETAIL A 1 2 Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over


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    PDF FR4/G10 SF-QFE256SB-L-01 SF-QFE256SB-L-02 QFP 0.3mm pitch

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS NO. DESCRIPTION Was -B Typo 1 0.30 ±0.05 DATE BY 11/5/96 SDC 2.0 • See Note 6 Ø1.5 +0.1/-0.0 • See Note 1 1.75 A 4.0 R.5 (2) 7.5 • Note 6 1.6 (2) Bo 5.0 16.0 ±0.3 K1 6.4 (2) Ko A Ao 12.0 SECTION A-A R1.0 Typical Ø1.5 MIN Notes: 1. 10 sprocket hole pitch cumulative tolerance


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    PDF 100mm Q07X07-C A1030-96-1

    QFP-128

    Abstract: 0.3mm qfp CA-QFE128RB-M-S-01
    Text: 17.3mm [0.681"] 13.49mm [0.531"] 0.5mm typ. 25.96mm [1.022"] 23.3mm [0.917"] 19.49mm [0.767"] 0.3mm [0.012"] Top View 19.56mm [0.770"] 1 Side View 8.61mm [0.339"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2


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    PDF FR4/G10 CA-QFE128RB-M-S-01 QFP-128 0.3mm qfp

    IC201

    Abstract: IC201-1604-006 IC217-2404-007 IC248-1284-007 QFP 128 pin Socket IC201-2084-029 IC201-1204-017 IC201-1444-026 IC201-1444-034 IC217-1444-003
    Text: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 120 4 - 017 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*


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    PDF IC200 IC248 10mA/20mV W564-002-2 IC201-2084-029 IC201-3044-004 IC201 IC201-1604-006 IC217-2404-007 IC248-1284-007 QFP 128 pin Socket IC201-2084-029 IC201-1204-017 IC201-1444-026 IC201-1444-034 IC217-1444-003

    IC201-0644-003

    Abstract: IC201-1004-008 IC201-0644-003 socket 1004 170 IC201-0804-014 IC201-1004-050 IC200 IC201-0644-019 IC201-0644-040 IC201-0804-020
    Text: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 064 4 - 019 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*


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    PDF IC200 IC248 10mA/20mV 65x19 IC201-1004-050 IC201-1004-016 IC216 65x29 IC201-0644-003 IC201-1004-008 IC201-0644-003 socket 1004 170 IC201-0804-014 IC201-1004-050 IC201-0644-019 IC201-0644-040 IC201-0804-020

    qfp 0.3mm pitch

    Abstract: CA-QFE128RB-L-S-01 SF-QFE128RB-L-01
    Text: 17.3mm [0.681"] 13.49mm [0.531"] 0.5mm typ. 25.96mm [1.022"] 23.3mm [0.917"] 19.49mm [0.767"] Top View 0.3mm [0.012"] 19.56mm [0.770"] 1 8.61mm [0.339"] 3 10.52mm [0.414" plugged] 2 Side View 6.35mm [0.250"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]


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    PDF FR4/G10 SF-QFE128RB-L-01 Description20" CA-QFE128RB-L-S-01 qfp 0.3mm pitch SF-QFE128RB-L-01

    IC201-1604-006

    Abstract: IC200-1284-001 IC217 IC217-2404-007 30407 YAMAICHI ic200 YAMAICHI ic248 IC200 IC201-1204-017 ic201-1444-026-2
    Text: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 120 4 - 017 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*


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    PDF IC200 IC248 10mA/20mV W564-002-2 IC201-2084-029 IC201-3044-004 IC201-1604-006 IC200-1284-001 IC217 IC217-2404-007 30407 YAMAICHI ic200 YAMAICHI ic248 IC201-1204-017 ic201-1444-026-2

    IC Package Names and Code Designations

    Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
    Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages


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    PDF 10-001A IC Package Names and Code Designations data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408

    0.3mm qfp

    Abstract: SF-QFE176SA-L-01F
    Text: A RoHS COMPLIANT compatible target board land dimensions A< 0.935" B> 1.055" 25.3mm sqr. [0.995"] 23.7mm sqr. [0.935"] B 0.3mm pad [0.012"] 1 0.8mm pad [0.030"] 0.5mm typ. 0.46mm [0.018"] 1.27mm typ. [0.050"] 2 6.4mm ± 0.25mm [0.250" ± 0.010"] 4.7mm [0.187"]


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    PDF FR4/G10 PCB50µ SF-QFE176SA-L-01F 0.3mm qfp

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS NO. 0.30 ± 0.05 DESCRIPTION DATE 2.0 • See Note 6 1.5 +0.1/-0.0 DIA • See Note 1 1.75 A 4.0 R.5 2 7.5 • Note 6 1.6 (2) Bo 5.0 16.0 ± 0.3 K1 6.4 (2) Ko A Ao 12.0 SECTION A-A 1.0 Radius Typical 1.5 MIN - All Dimensions in Millimeters Notes:


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    PDF 100mm Q07X07-B A0417-95-2

    Untitled

    Abstract: No abstract text available
    Text: Ø1.5+0.1/-0.0. 4.0 ±0.1 • See Note 1 0.30 ±0.05 1.75 ±0.1 2.0 ±0.1 Note 6 A R0.MAX. 11.5 ±0.1 Note 6 13.2 2 Bo 24.0 ±0.3 2.0 (2) K1 A R1.0 REF 13.4 (2) Ø1.5 MIN R0.5 Typical Ko Ao 45 ° TYP SECTION A-A 20.0 ±0.1 Ao = 16.50 mm Bo = 16.50 mm Ko = 1.55 mm


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    PDF 100mm Q1414P-C A0808-97-1

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS Ø1.5 +0.1/-0.0 NO. 2.0 • See Note 6 DESCRIPTION DATE BY 1 SDC 4.0 • See Note 1 0.30 ± 0.05 A 1.75 R0.5 Typical R0.3 MAX 14.2 • See Note 6 13.2 2 B1 2.0 (2) 28.4 Bo 32.0 ± 0.3 Ko 24.0 A K1 0.75 R 13.4 (2) SECTION A-A Ao A1 0.20 ± 0.05


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    PDF 100mm Q1414P-B 14x14 T-6312 A1101-96-5

    Untitled

    Abstract: No abstract text available
    Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble


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    PDF 100x10

    Untitled

    Abstract: No abstract text available
    Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble


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    PDF 100x10

    pitch 0.4mm BGA

    Abstract: BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka
    Text: KA, SC hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOA’s original thick film technology


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    PDF 100x10 100x10-6/k pitch 0.4mm BGA BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka

    Untitled

    Abstract: No abstract text available
    Text: 1C 5 1 /5 3 SERIES S0P/QFP/QFN ICC /QF1(PLCC)/TCP FEATURES • • S ockets tor SOP, QFP and other surface-m ount 1C packages. Custom designs also available for m ulti-lead, fine-pitch and other special packages. SPECIFICATIONS PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact


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    Untitled

    Abstract: No abstract text available
    Text: RN ICPAK Nuaent QFP Sockets REMARKS 3 Check the IC’s pin pitch before insertion. If the IC’s pin pitch is uneven, it might not fit into the socket or the 1C may become damaged. 4) Check that the contacts are clean before mount­ ing. Poor contact may result if the socket contacts


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    05Mm

    Abstract: No abstract text available
    Text: QFP Open Top IC200, IC201, IC218 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage 1,000MQ minimum at 500VDC 500VAC RMS fo r one minute: IC200-2084-009, IC200-2084-010, IC201-1004-008 700VAC RMS fo r one minute: IC200-1284-001, IC 201-0804-005,


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    PDF IC200, IC201, IC218 000MQ 500VDC 500VAC IC200-2084-009, IC200-2084-010, IC201-1004-008 700VAC 05Mm