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    PA-QFE32SA-P-S-01

    Abstract: No abstract text available
    Text: 0.395" 0.259" 0.800" QFE32SA package 9.0mm 0.8 mm pitch typ. 0.800" Top View -01W version 3 level, 0.025" Sqr. WW pin 0.700" 1 0.507" 3 0.250" 2 0.018"±0.001" dia. 0.100" pitch typ. Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating


    Original     		PDF QFE32SA FR4/G10 finish10µ SB-PGA08/032A-01W PA-QFE32SA-P-S-01

    QFJ-144

    Abstract: No abstract text available
    Text: Ironwood Electronics Appendix Pages AP-C.1 APPENDIX C • QFP Chip Package Specifications – Metric . . .page AP-C.2 thru AP-C.5 • QFP Chip Package Specifications – English . . . . . . . . . . . . .page AP-C.6 PO Box 21151, St Paul, MN 55121 • USA • Tel: 800 404-0204 • (651) 452-8100 • Fax:(651) 452-8400


    Original     		PDF QFE32SA QFE44SA QFE44SB QFE44SC QFE44SD QFE44SE QFE44SF QFE44SG QFE44SH QFE44RA QFJ-144