DNA-H-93-140
Abstract: DNA-H-95-61 e1309 JEP133 transistor 2N2222 F1262 FOTP-64 MOSFET DOSIMETER sensor 3414 cobalt-60
Text: N RADIATION OWNER’S MANUAL – RHA-Related Documents Military Performance Specifications 19500 – General Specification for Semiconductor Devices 38534 – Performance Specifications for Hybrid Microcircuits 38535 – General Specification for Intregrated Circuits Microcircuits Manufacturing
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P1156
PSS-01-609
heisen9929
DNA-H-93-140
DNA-H-95-61
e1309
JEP133
transistor 2N2222
F1262
FOTP-64
MOSFET DOSIMETER
sensor 3414
cobalt-60
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INCOMING RAW MATERIAL INSPECTION chart
Abstract: INCOMING RAW MATERIAL INSPECTION Sample form for INCOMING Inspection of RAW MATERIAL SMD MARKING CODE l6 MATRA MHS INCOMING RAW MATERIAL INSPECTION method smd CODE L4 INCOMING MATERIAL FLOW PROCESS
Text: Quality Flows Digital ICs Products This document presents the flows used in manufacturing and screening of TEMIC Digital ICs Microcontrollers, Memories, ASICs and ASSPs . Process Control As shown in the following tables, each device is constructed by manufacturing processes which are under
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168h/125
240h/125
INCOMING RAW MATERIAL INSPECTION chart
INCOMING RAW MATERIAL INSPECTION
Sample form for INCOMING Inspection of RAW MATERIAL
SMD MARKING CODE l6
MATRA MHS
INCOMING RAW MATERIAL INSPECTION method
smd CODE L4
INCOMING MATERIAL FLOW PROCESS
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construction of varactor diode
Abstract: varactor diode q factor measurement ML46580S-992 varactor diode capacitance measurement testing of varactor diode MP3021-001 MA46589 5010 varactor symbol of varactor diode and equivalent circuit varactor high power
Text: Beam Lead Gallium Arsenide Tuning Varactor Diode ML46580S-992 ML46580S-992 Preliminary Specifications High Reliability Semiconductor – Beam Lead Gallium Arsenide Tuning Varactor Diode Features • • • • • Package Outline Constant Gamma of 1.25 Strong Beam Construction
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ML46580S-992
ML46580S-992
MA46585
MA46580
MA46580-46584
MA46585-46589
construction of varactor diode
varactor diode q factor measurement
varactor diode capacitance measurement
testing of varactor diode
MP3021-001
MA46589
5010 varactor
symbol of varactor diode and equivalent circuit
varactor high power
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PIN Diode chip
Abstract: No abstract text available
Text: Attenuator PIN Diode Chip ML47406-S-132 ML47406-S-132 Preliminary Specifications High Reliability Semiconductor Attenuator PIN Diode Chip Features • • • • • Package Outline Glass Passivation Thermocompression bondable Thermosonically bondable Gold metallisation
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ML47406-S-132
ML47406-132
PSS-01-608
ML47406
MA47406
6091A
100mA
PIN Diode chip
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sol 4011 be
Abstract: No abstract text available
Text: A fa Preliminary Specification High Reliability Semiconductor Attenuator PIN Diode Chip_ MA47406 M aann A M P co m pany V1.00 Features • • • • • Package Outline Glass Passivation Thermocompression bondable Thermosonically bondable
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MA47406
MA47406-132
PSS-01-608
sol 4011 be
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HA 4016
Abstract: nia4
Text: ML46580S-992 I M/A-COM Preliminary Specifications High Reliability Semiconductor - Beam Lead Gallium Arsenide Tuning Varactor Diode Features • • • • • M n r - & Microwave Products Package Outline Constant Gamma o f 1.25 Strong Beam Construction Low Parasitic Capacitance
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ML46580S-992
L46580S-992
MA46580-46584
MA46585-46589
HA 4016
nia4
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tk 19 209
Abstract: atmel 0635 IC MC 14017 B
Text: jflmëE W IR E L E S S * i/C Packaging and Packing Information Atmel Wireless & Microcontrollers Standard Bar-Code Labels The Atmel Wireless & Microcontrollers standard bar-code labels are printed at final packing areas. The labels are on each packing unit and contain Atmel Wireless & Microcontrollers’ specific data.
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U6043
2800PCS19
V20010129528448OB-2L1IC
284480B-2L
tk 19 209
atmel 0635
IC MC 14017 B
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CD 4016 ic testing method
Abstract: MA46589
Text: ML46580S-992 M/A-COM Preliminary Specifications High Reliability Semiconductor - Beam Lead Gallium Arsenide Tuning Varactor Diode Features • • • • • Package Outline Constant Gamma of 1.25 Strong Beam Construction Low Parasitic Capacitance High Q
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OCR Scan
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PDF
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ML46580S-992
ML46580S-992
MA46580-46584
MA46585-46589
CD 4016 ic testing method
MA46589
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sol 4011 be
Abstract: No abstract text available
Text: 1_ Preliminary Specification High Reliability Semiconductor Attenuator PIN Diode Chip MA47406 V1.00 Features • • • • • Package Outline Glass Passivation Therm ocom pression bondable Thermosonically bondable Gold metallisation
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MA47406
A47406-132
PSS-01-608
sol 4011 be
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PSS016
Abstract: TK S014 S020
Text: M ä. W I R E L E S S & fiC New Atmel Wireless & Microcontrollers Standard Type Suffix for ICs I £]□□□□□□□□□□□□□ □ Atmel Wireless & Microcontrollers identifier: 1 digit Conditioning: 1 digits Device type: up to 11 digits Package:
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DIP14
DIP18
DIP22
DIP40
SDIP28
SDIP30
SDIP40
S016L
SS016
SS020
PSS016
TK S014
S020
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LTPD
Abstract: JTS68020 127C256 UA7805 JTS68564 i27C64 UA7805 thomson IUA741 TS68882
Text: THOMSON MIL ET SPATIAUX ETE D • iD2bö?5 DGDDGMT S ■ THOMSON COMPOSANTS MILITAIRES ET SPATIAUX is offering a large range of linears, microprocessors, ASICs and CCDs products in die form. These dice are available in a variety of quality classes. OPERATIONAL AMPLIFIERS
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JLF155
JLF156
JLF157
JLM108
JLM108A
JLM124
JLM146
ILM148
JLM158
1LM1B58
LTPD
JTS68020
127C256
UA7805
JTS68564
i27C64
UA7805 thomson
IUA741
TS68882
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TBA 261
Abstract: DIP40 weight TBA 480 silver epoxy MLF48 MLF-28 copper bond wire ti 980
Text: ¿ M M el M « W I R E L E S S S f iC Contents o f an IC in Plastic Package DIP DIP 300 mil Figure 1. DIPI 6 case Component M old Content / CAS-No. Content 7631-86-9 E - 132-0000 1309-64-4 7726-95-6 S i0 2 Epoxy resin Sb (as antimony trioxide) *> Br (no TBA) *»
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