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    Abstract: No abstract text available
    Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM M ICRO S YSTEM S DPS256X32CV3/D PS256X32BV3 DESCRIPTION: The DPS256X32CV3/PS256X32BV3 "VER SA-STAC K” module is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC mounted


    OCR Scan     		PDF PS256X32C PS256X32B DPS256X32CV3/DPS256X32BV3 DPS256X32CV3/DPS256X32BV3 DPS256X32BV3 DPS256X32CV3 500mV DPS256X32CV3only) 30A044-03