olin 7025
Abstract: 7025 alloy lead frame CDA 194 X10-4 eftec-64t Eftec 64t resistivity table sn 8400 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS
Text: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units
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5978008001
Abstract: 5978015901 5978014001 5978017501
Text: 15th Edition 106 Toroids A ring configuration provides the ultimate utilization of the intrinsic ferrite material properties. Toroidal cores are used in a wide variety of applications such as power input filters, ground-fault interrupters, common-mode filters
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AE 920 B
Abstract: 5961000211
Text: A ring configuration provides the ultimate utilization of the intrinsic ferrite material properties. Toroidal cores are used in a wide variety of applications such as power input filters, ground-fault interrupters, common-mode filters and in pulse and broadband transformers.
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12100
Abstract: NA 36 foam STM11
Text: Description: Desco’s conductive foam is a non-abrasive, open-cell closed cell in cross linked polyurethane foam compounded for permanent ESD Control Properties. The black conductive foam’s Rtt range of 10E3 to 10E6 allows it to be used with ESD susceptible products. Desco’s conductive foam is available in 3 designs:
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Untitled
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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0-320P
73-7-320A
173-7-330P
173-7-340P
173-7-350P
173-7-410P
173-7-510P
173-7-520P
173-7-610P
173-7-710P
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deltabond
Abstract: Wakefield 120-320 152-1B thermal conductivity 175-6-220-P
Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
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WTS001
p50-68
173-7-220P
173-7-230P
173-7-240P
173-7-1212P
73-7-240A
173-9-210P
173-9-230P
173-9-240P
deltabond
Wakefield 120-320
152-1B
thermal conductivity
175-6-220-P
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Wakefield 120-320
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
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173-7-220P
173-7-230P
173-7-240P
173-7-1212P
73-7-240A
173-9-210P
173-9-230P
173-9-240P
173-9-1212P
174-9-310P
Wakefield 120-320
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x band radar transmitters
Abstract: 6007 Graphite film material rfss INSERTS FOR COMPOSITE OR HONEYCOMB RFML 5301
Text: We practice environmental protection. MICROWAVE ABSORBING MATERIALS CAPABILITIES Microwave absorbers are increasingly being used to enhance shielding performance at higher frequencies. R&F Products, a division of Laird Technologies , offers a wide product range for the EMC design engineer.
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218GHz
all36
x band radar transmitters
6007 Graphite film material
rfss
INSERTS FOR COMPOSITE OR HONEYCOMB
RFML 5301
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NASA SP-R-0022A
Abstract: Arlon ASTM D5470 Tower Mounted Amplifiers TC350 microwave laminate board electronics nasa mtbf antenna thermal conductivity wilkinson power divider
Text: MICROWAVE MATERIALS TC350 Enhanced Thermal Conductivity Ceramic Filled PTFE/ Woven Fiberglass Laminate for Microwave Printed Circuits Boards Features: • “Best in Class” Thermal Conductivity and Dielectric Constant Stability across Wide Temperatures • Very Low Loss Tangent provides Higher
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TC350
BL31QE,
NASA SP-R-0022A
Arlon
ASTM D5470
Tower Mounted Amplifiers
TC350
microwave laminate board
electronics nasa
mtbf antenna
thermal conductivity
wilkinson power divider
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TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
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ASTM D374
Abstract: D4496 QPAD transistor ac 152 D374
Text: Q-PAD II , Q-PAD 3® Grease Replacement Materials without Electrical Isolation Q-Pad II® Eliminates Grease Q-Pad II is a composite of .0015" aluminum foil coated both sides with .0025” thick thermally/electrically conductive Sil-Pad rubber. It is designed for those applications where
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D5470
D4496
ASTM D374
D4496
QPAD
transistor ac 152
D374
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SJ5216
Abstract: ASTM-D1000 ASTM-C501 SJ5200 SJ-6016 SJ5816 adhesive rubber based msds UL94HBF ASTM-D1894 Synthetic Rubber Material Information
Text: Technical Data February 2012 3M Bumpon™ Protective Products Resilient Rollstock SJ5200 • SJ5800 • SJ5900 • SJ6000 • SJ6200 Series Product Description 3M™ Bumpon™ Resilient Rollstock Products are opaque, colored polyurethane materials produced with aggressive
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SJ5200
SJ5800
SJ5900
SJ6000
SJ6200
SJ5216
SJ5208
SJ5832
SJ5816
SJ5808
ASTM-D1000
ASTM-C501
SJ5200
SJ-6016
adhesive rubber based msds
UL94HBF
ASTM-D1894
Synthetic Rubber Material Information
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Solutions for Radar Applications
Abstract: No abstract text available
Text: Solutions for Radar Applications By Dave Cruickshank and Brian Hartnett, Skyworks Solutions, Inc. September 2011 With steady growth forecasted for the foreseeable future, Skyworks Solutions has developed a number of products specifically designed for radar markets, including materials for phase shifter applications and ferrite circulators. A
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960MHz
1200MHz.
SKYFR-000409
Solutions for Radar Applications
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capacitors coefficient of thermal expansion
Abstract: thermal conductivity maruwa Maruwa Capacitors a 92 similar Alumina submount Maruwa Thin Film Capacitors AS970 MA92W
Text: MARUWA GENERAL CATALOG THIN-FILM SUBSTRATES The thin-film substrates are the result of the fusion of various time-tested ceramic materials and the thin-film metalizing technology developed over many years. The materials permit the production of sophisticated circuit
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underfill
Abstract: Aluminum alloys physical properties AN-1050 SILICON CONTROL RECTIFIER DETAILS alsic 105 SN62 PB36 ag2 International Power Devices silicon carbide LED lead-free solder joint reliability thermal cycle alsic
Text: Application Note AN-1050 DirectFETTM Technology Materials and Practices Application Note Table of Contents Page Factors Causing Thermal Fatigue .2 Summarized Test Results .2
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AN-1050
underfill
Aluminum alloys physical properties
AN-1050
SILICON CONTROL RECTIFIER DETAILS
alsic 105
SN62 PB36 ag2
International Power Devices
silicon carbide LED
lead-free solder joint reliability thermal cycle
alsic
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marking code r2d
Abstract: 102. 1kv
Text: Commercial Chip - R3L 16Vdc to 5kVdc A range of commercial MLC chip capacitors in R3L dielectric. This is a Class I temperature compensating N2200 dielectric with an energy density that exceeds conventional Class I materials. R3L has a predictable negative temperature coefficient, low loss,
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16Vdc
N2200
marking code r2d
102. 1kv
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Sony ACF
Abstract: ANISOLM upilex S 40 hitachi ACF upilex AC-7144 AC-7104 Hitachi 15 inch LCD HD66712TA0 acf film
Text: The Information of TCP Features of TCP TAB Technology Flexible Design The structure and materials used by Tape Carrier Package (TCP) give it the following features as compared with conventional packages: The following can be tailored to the design of the
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HD66120TA2
HD66120TA3
HD66300T00
HD66310T00
HD66330TA0
HD66503TA0
HD66503TB0
HD66520TA0
HD66520TB0
HD66712TA0
Sony ACF
ANISOLM
upilex S 40
hitachi ACF
upilex
AC-7144
AC-7104
Hitachi 15 inch LCD
acf film
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FERRITE TOROIDAL CORE DATA
Abstract: Fair-Rite Products
Text: Fair-Rite Product's Catalog Part Data Sheet, 5977003801 Printed: 2010-11-09 Fair-Rite Products Corp. PO Box J,One Commercial Row, Wallkill, NY 12589-0288 Phone: 888 324-7748 www.fair-rite.com Part Number: 5977003801 Frequency Range: Medium Permeability, 77 (ui=2000) & 78 (ui=2300) materials
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Untitled
Abstract: No abstract text available
Text: V is h ay I n tertec h n o l o g y, I n c . I INNOVAT AND TEC O L OGY Instructional Guide N HN INDUCTORS O 19 62-2012 Inductors - Primer INDUCTORS 101 TABLE OF CONTENTS Introduction Magnetic Core Types Core Materials Electrical Specifications Inductor Technologies
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VMN-SG2139-1203
FO7-2726
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kz5u
Abstract: bismuth titanate thesis titan kyocera bismuth titanate PVA paints high frequency dielectric heating X7R mid voltage dependence
Text: TECHNICAL INFORMATION MULTILAYER CERAMIC CAPACITORS– MATERIALS AND MANUFACTURE by Manfred Kahn AVX Corporation Myrtle Beach, SC Abstract: The economical mass production of highquality, reliable and low-cost multilayer ceramic MLC capacitors requires a thorough
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S-MLCMM00M900-R
kz5u
bismuth titanate
thesis
titan
kyocera bismuth titanate
PVA paints
high frequency dielectric heating
X7R mid voltage dependence
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KJR9022E
Abstract: KJR4013E GTO thyristor driver KJR651 KJR9061E silicone low volatile potting G1821 KJR-9010E KJR651E KJR9060E
Text: Shin-Etsu Liquid Coating Materials for Electronic Devices KJR Series Junction Coating Resins Liquid Type Silicone & Polyimide Silicone for Electronic, Electric and Optical Devices Main Features ●Ultra High Purity ●High Thermal Stability ●High Electrical Stability
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hypalon 40
Abstract: elastomer EPDM silicones hypalon neoprene rubber tubing hypalon heat
Text: H O O K - U P & L E A D W I R E 3.28 Technical Information Conductor and Insulation Materials The technical information provided in this section has been expanded to include additional graphs and supplementary data as an aid in specifying the hook-up and lead
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1-800-BELDEN-1.
hypalon 40
elastomer EPDM silicones
hypalon
neoprene rubber tubing
hypalon heat
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161000F00000
Abstract: 4949G heat staking
Text: Home | Contact Us | About Aavid | Sales Rep Log In -Useful Links- Products Search by part # / Interface Materials / Adhesives Thermal Adhesives Ther - O- Bond 1500 Check distributor part inventory Epoxy casting system for potting and encapsulation Ther - O- Bond 1600
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4949G
4950G
4951G
4952G
4953G
161000F00000
4949G
heat staking
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Untitled
Abstract: No abstract text available
Text: VISHAY ▼ Vishay Telefunken Properties of Encapsutant When assembling IrDC transceivers, it is useful to have an understanding of the properties of the materials used in their consruction. It is often not realised that although IrDC transceivers use semiconductor chips there
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