RF6561
Abstract: RF6261 RF6261B
Text: RFRD6461 RFRD64613G PowerSmart Power Platform 3G POWERSMART™ POWER PLATFORM PCB Footprint: 7.6mm x 15.3mm x 1.02mm BATTERY RF DETECTOR OUT Boost - Buck DCDC Converter 2 Component Placement Power Platform RF6261B Power Amplifier:
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RFRD6461
RFRD64613G
RF6261B
RF6561
RFRD6461
DS120612
RF6261B)
RF6561)
RF6261
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RF6561
Abstract: RF6261 RF6261B RFRD6461 WCDMA duplexer RF626 SP4T Antenna Switch RF65 rf coupler rf detector
Text: RFRD6461 RFRD64613G PowerSmart Power Platform 3G POWERSMART™ POWER PLATFORM PCB Footprint: 7.6mm x 15.3mm x 1.02mm BATTERY RF DETECTOR OUT Features 2 Component Placement Power Platform RF6261B Power Amplifier: 6.0mm x 8.0mm
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RFRD64613G
RFRD6461
RF6561
RF6261B
RF6561
DS120612
RF6261B)
RF6561)
RF6261
RFRD6461
WCDMA duplexer
RF626
SP4T Antenna Switch
RF65
rf coupler
rf detector
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Untitled
Abstract: No abstract text available
Text: DuPont Pyralux AC flexible circuit materials Technical Information Description DuPont Pyralux AC flexible circuit materials are single-sided copper-clad laminates with all-polyimide composite of polyimide film on copper foil. Pyralux AC products are ideal for use in
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H-73247â
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diamond antenna
Abstract: T-Flex 200 CP177 Tgon T-gon 22 CP230 K177 K228 K200 FSF52
Text: THERMAL_SHORTFORM3 14/12/05 4:52 pm Page 1 global solutions : local support Laird Technologies is the world’s leading designer and manufacturer of electromagnetic interference [EMI] shielding materials, thermal interface products, and wireless antenna
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Festresist
Abstract: CNC machen FR4 substrat smdk
Text: Begriffsbestimmungen für die Leiterplattenfertigung Adapterstift Für die elektrische Prüfungen von Leiterplatten verwendete Kontaktstifte Antipad Gegenüberliegendes Lötauge Absorption Aufnahme eines Stoffes durch Diffusion in einem anderen durch die Phasengrenzfläche hindurch
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MEGTRON 6
Abstract: AN-672
Text: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission 2013.02.15 AN-672 Subscribe Feedback As transceiver data rates increase and the unit interval time UI decrease, the end-to-end link design of a transceiver channel becomes increasingly critical to the overall performance of the link. Consider an Altera
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AN-672
100-Gpbs
CEI-25G-LR
CEI-28G-VSR.
CEI-28G-VSR
MEGTRON 6
AN-672
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4-Layer PCB Layout Guideline for HDMI Products In
Abstract: prepreg FR4 Prepreg 4-Layer PCB Layout Guideline for HDMI Products FR4 microstrip stub "HDMI connector" hdmi connector 4-Layer PCB Layout Guideline prepregs AN204
Text: 204 PI3HDMIxxx 4-Layer PCB Layout Guideline for HDMI Products Introduction The differential trace impedance of HDMI is specified at 100Ω±15% in Test ID 8-8 in HDMI Compliance Test Specification Rev.1.2a and 1.3a. Rev. 1.3a has a more relaxed specification which allows an occurrence of a single
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250ps.
AN204
4-Layer PCB Layout Guideline for HDMI Products In
prepreg
FR4 Prepreg
4-Layer PCB Layout Guideline for HDMI Products
FR4 microstrip stub
"HDMI connector"
hdmi connector
4-Layer PCB Layout Guideline
prepregs
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Nelco 4000-13
Abstract: MEGTRON 6 370HR isola 370HR Nelco 4000-13 si Isola FR406 Rogers 4350B stackup 4000-13EP FR4 Prepreg
Text: PCB Stackup Design Considerations for Altera FPGAs AN-613-1.0 Application Note This application note presents an overview of the PCB stackup construction and material selection criteria. It discusses the important material parameters that influence the electrical
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AN-613-1
Mil-Std-275E)
Nelco 4000-13
MEGTRON 6
370HR
isola 370HR
Nelco 4000-13 si
Isola FR406
Rogers 4350B
stackup
4000-13EP
FR4 Prepreg
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AP24026
Abstract: EMC design ferrite chip spice model 1608HW241 EMC for PCB Layout hall ic 067 IC BOSCH 44 10X10 powerstar ems Design Seminar Signal Transmission
Text: App lica tion No te , V 3 .0 , Ap ril 2005 AP24026 Microcontroller EMC Design Guidelines M i c ro c o n troller Board Lay out Microcontrollers N e v e r s t o p t h i n k i n g . for TriCore Revision History: 2005-04 Previous Version: 2001-04 Page Subjects major changes since last revision
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AP24026
AP24026
EMC design
ferrite chip spice model
1608HW241
EMC for PCB Layout
hall ic 067
IC BOSCH 44
10X10
powerstar ems
Design Seminar Signal Transmission
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pacemaker
Abstract: rf transciever implantable insulin pumps cochlear Implant murata PLATE CAPACITORS
Text: Zarlink Medical RF, SiP and the Future Piers Tremlett, Zarlink Semiconductor NMI at TWI, 12 Dec 07 CONFIDENTIAL Introduction Introduction to the Packaging Foundry at Zarlink Design requirements for RF SiP in Pacemakers Zarlink’s embedded component research projects
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fr-5 laminate
Abstract: DIN IEC 249 VDE/VDI Fr4 ep-gc-02 UL796 M44-9 ISO 7629 NEMA xxxpc prepreg 7628 schema GP 300
Text: VDE/VDI-SCHULUNGSBLÄTTER FÜR DIE LEITERPLATTENFERTIGUNG Starre, starrflexible, flexible und Mehrlagenmaterial; Eigenschaftsmerkmale Basismaterial VDE/VDI 3711, Blatt 2 Seite 1 Basismaterialien für Leiterplatten / Multilayer Die Entwicklung der Basismaterialien für Leiterplatten ist eng verbunden mit der Entwicklung
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MIL-P-13949.
fr-5 laminate
DIN IEC 249
VDE/VDI
Fr4 ep-gc-02
UL796
M44-9
ISO 7629
NEMA xxxpc
prepreg 7628
schema GP 300
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hydrogen peroxide
Abstract: prepregs dry film
Text: Circuit Board Materials Interconnection & Connector Assemblies • COR-LAM Laminates & Prepregs • ADVANCED ELECTRONIC SYSTEMS Photoformed Microcircuits • DELRIN® Acetal Resin • ELECTRONIC MATERIALS Thick Film Materials Conductors Resistors Dielectrics
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TGL 29331
Abstract: Kombinat VEB Elektronische Bauelemente TGL 31428 bauelemente Kombinat bauelemente DDR TGL-31428 21-1 TGL 24815 TGL 24687 TGL 24815 veb taschenbuch
Text: Kontakt bauelemente Kombinat VEB Elektronische Bauelemente K O N T A K T B A UELEM ENTE In h alt S te c k v e rb in d e r, fla che B a u fo rm Seite 6 H F -R u n d ste ckve rb in d e r 61 N F -R u n d ste ckve rb in d e r 101 L ic h tle ite rs te c k v e rb in d e r
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