Ablecube
Abstract: ATM-0018 Ablestik ATM-0087 ablebond ablebond technical 8200C ATM-0089 ablebond ablestik ablestik ablebond
Text: PILOT TECHNICAL DATASHEET ABLEBOND 8200C ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 8200C low bleed die attach adhesive is designed for small and medium sized dies across a variety of leadframes including PPF, Cu and Ag. This electrically conductive adhesive offers improved JEDEC
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8200C
8200C
RP-751
Ablecube
ATM-0018
Ablestik
ATM-0087
ablebond
ablebond technical
ATM-0089
ablebond ablestik
ablestik ablebond
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MO-153
Abstract: MO-187 MO-194 PPF leadframe MO153 MO-153 Packages JEDEC MO-187 JEDEC MO-153 38 Amkor mold compound tssop
Text: LEADFRAME data sheet TSSOP Features: Thin Shrink Small Outline Package TSSOP : With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research
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Untitled
Abstract: No abstract text available
Text: Data Sheet LEADFRAME SOT-223 Test Services ● Program generation/conversion ● Wafer probe ● Burn-in ● -55°C to +165°C test available ● Strip test available Small Outline Transistor SOT-223 SOT-223 is a leadframe based, plastic encapsulated package
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OT-223
OT-223)
OT-223
DS582B
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TO 92 leadframe
Abstract: No abstract text available
Text: Data Sheet LEADFRAME TO-92 Test Services ● Program generation/conversion ● Wafer probe ● Burn-in ● -55°C to +165°C test available ● Strip test available Transistor Outline TO-92 TO-92 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum
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DS583A
TO 92 leadframe
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MO-166
Abstract: PPF leadframe MO166 psop3 outline of the heat slug for JEDEC
Text: LEADFRAME data sheet PowerSOP 3 Features Power Small Outline Package, PowerSOP® PSOP3 : PSOP3 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package utilizes a thick copper heat slug to
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MO-166
MO-166
PPF leadframe
MO166
psop3
outline of the heat slug for JEDEC
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ic packages
Abstract: MO-137
Text: LEADFRAME data sheet ExposedPad SOIC/SSOP Features: ExposedPad SOIC/SSOP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power-constrained standard SOIC and SSOP packages. The ExposedPad SOIC/ SSOPs can increase heat dissipation by
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MS-012
MO-137
ic packages
MO-137
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LD128
Abstract: PPF leadframe
Text: LEADFRAME data sheet SOIC Features Small Outline IC Package SOIC : SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and
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MS-013
MO-119
LD128
PPF leadframe
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Ablestik 8290
Abstract: C194 G600 MS-013 Amkor Wafer level mold compound PPF leadframe
Text: LEADFRAME data sheet SOIC Features: Small Outline IC Packages: Amkor has a broad portfolio of Small Outline ICs SOIC packages, including .150", .208" and .300" body sizes. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best
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MS-013
MS-019
Ablestik 8290
C194
G600
MS-013
Amkor Wafer level mold compound
PPF leadframe
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MO-150
Abstract: C194 MP8000AN G600 MO-137 amkor
Text: LEADFRAME data sheet SSOP Features: Shrink Small Outline SSOP Packages: How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller
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MO-150
MO-118
MO-150
C194
MP8000AN
G600
MO-137
amkor
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MO-112
Abstract: MS-029 MATRIX TRAY MS-022 LD240
Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced
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JEDEC MO-153
Abstract: 78 mo 5 MO-153 tip55 JEDEC MO-187
Text: LEADFRAME data sheet TSSOP/MSOP Features Thin Shrink Small Outline Package, Micro Small Outline Package TSSOP/MSOP : TSSOP and MSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height.
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DS351)
MO-153
MO-194
JEDEC MO-153
78 mo 5
tip55
JEDEC MO-187
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JEDEC MO-187
Abstract: JEDEC MO-153
Text: LEADFRAME Data Sheet TSSOP/MSOP/VSSOP Thermal Performance Forced Convection, Single-layer PCB Pkg Thin Shrink Small Outline Package, Micro Small Outline Package, Very-Thin Shrink Small Outline Package TSSOP/MSOP/ VSSOP TSSOP, MSOP and VSSOP are leadframe based, plastic
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DS350N
JEDEC MO-187
JEDEC MO-153
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Untitled
Abstract: No abstract text available
Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)
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DS571J
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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DUAL ROW QFN leadframe
Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This
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MO-166
Abstract: PPF leadframe MO166 MS-013 tip 142
Text: LEADFRAME data sheet PowerSOP 2&3 Features: Thermal Resistance: PowerSOP® Packages: PSOP This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP (PSOP) improves
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MO-166.
MS-012
MO-166
PPF leadframe
MO166
MS-013
tip 142
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SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY
Abstract: amkor
Text: service green packaging Green / Pb Free Technology Solution A combination of governmental legislation and consumer sentiment has driven the Electronics Industry in general and Semiconductor Packaging specifically to adopt more environmentally friendly materials and processes. Amkor is a leader in the
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SS18C
SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY
amkor
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LD 337
Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Text: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material
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Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : QFN5032 Component Weight : Document No : 20 Process Type : Lead #: No 1 Content in % Material 0.0210376 Silica Fused 40.28% 6 % to % to Unit Content PPM 60676-86-0 0.0192914 91.700% 47.633% Trade secret 0.0008415
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QFN5032
QFN5032-20LD-GRN-RS-18
031314HC08
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : DFN75 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0507958 Silica Fused 39.62% 6 % to % to Unit Content PPM 60676-86-0 0.0465797 91.700% 53.974% Trade secret 0.0020318
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DFN75
DFN75-4LD-GRN-RS-18
07ilver
031314HC02
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN2520 Component Weight : Document No : 6 Process Type : Lead #: No 1 Content in % Material 0.0049499 Silica Fused 47.24% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0045391 91.700% 36.903% Trade secret
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CDFN2520
CDFN2520-6LD-GRN-RS-18
031214HC05
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN5032 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0247989 Silica Fused 35.67% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0227406 91.700% 56.150% Trade secret
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CDFN5032
CDFN5032-4LD-GRN-RS-11
031214HC09
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN3225 Component Weight : Document No : 6 Process Type : Lead #: No 1 Content in % Material 0.0087735 Silica Fused 47.07% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0080453 91.700% 41.258% Trade secret
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CDFN3225
CDFN3225-6LD-GRN-RS-18
031214HC08
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN2520 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0052512 Silica Fused 47.24% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0048153 91.700% 39.149% Trade secret
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CDFN2520
CDFN2520-4LD-GRN-RS-18
031214HC04
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