Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN3225 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0090818 Silica Fused 47.07% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0083280 91.700% 42.708% Trade secret
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CDFN3225
CDFN3225-4LD-GRN-RS-11
031214HC06
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN3225 Component Weight : Document No : 6 Process Type : Lead #: No 1 Content in % Material 0.0087735 Silica Fused 47.07% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0080453 91.700% 41.258% Trade secret
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CDFN3225
CDFN3225-6LD-GRN-RS-18
031214HC08
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN3225 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0090818 Silica Fused 47.07% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0083280 91.700% 42.708% Trade secret
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CDFN3225
CDFN3225-4LD-GRN-RS-18
031214HC07
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LQFP-128L
Abstract: LQFP128L
Text: SPECIFICATION NO. REV. 2000-0026 M DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVITY TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER SR. PRODUCT ENGINEERING MANAGER PLANNING AND LOGISTICS DIRECTOR WW TEST OPERATIONS MANAGER
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FCQFN46-34L
FQFN33-16L,
FQFN44-26L,
H3QFN1212-64L
H3QFN88-52L
H4QFN1010-52L
QFN56-30L
H4QFN1212-64L
LGA5032-06L
LGA5555-76L
LQFP-128L
LQFP128L
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