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    POP PACKAGE TESTING Search Results

    POP PACKAGE TESTING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    POP PACKAGE TESTING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NS6040

    Abstract: amkor DS814A pop sheet DS814 PoP PACKAGE TESTING contactor
    Text: data sheet TEST CONTACTOR PoP Dual Sided Test Contactor Features: • • • • • Benefits: • Single socketing for testing both sides of package • Improved test coverage Stacked Package Amkor PoP Package on Package Dual Sided Test Contactor: Amkor Technology is now offering the PoP


    Original     		PDF DS814A NS6040 amkor DS814A pop sheet DS814 PoP PACKAGE TESTING contactor

    JEDEC Jc-11 free

    Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
    Text: LAMINATE data sheet Package on Package PoP Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA platform in the 4th quarter of 2004. The next four years saw many new


    Original     		PDF wirebon00 JEDEC Jc-11 free PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap

    JEDEC Jc-11 free

    Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
    Text: LAMINATE data sheet Package on Package PoP Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw


    Original     		PDF

    MT29F4G08ABA

    Abstract: MT29F4G08A MT29F8G08A MT29F4G08AB MT29F4G08ABAD MT29C MT29F16G08A Micron MT29F8G08
    Text: Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29C4G48MAYBAAKQ-5 WT, MT29C4G48MAZBAAKQ-5 WT, MT29C4G96MAYBACJG-5 WT, MT29C4G96MAZBACJG-5 WT,


    Original     		PDF 168-Ball MT29C4G48MAYBAAKQ-5 MT29C4G48MAZBAAKQ-5 MT29C4G96MAYBACJG-5 MT29C4G96MAZBACJG-5 MT29C8G96MAYBADJV-5 MT29C8G96MAZBADJV-5 MT29F4G08ABA MT29F4G08A MT29F8G08A MT29F4G08AB MT29F4G08ABAD MT29C MT29F16G08A Micron MT29F8G08

    MT29C4G48MAZAPAKQ-5

    Abstract: MT29C4G96MAZAPCJG-5 MT29C4G96M MT29C4G96MAZAPCJG-5IT MT29C4G48mazapakq MT29F8G16 lpddr2 mcp lpddr2 nand mcp MT29C8G96 samsung* lpddr2* pop package
    Text: Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29C4G48MAYAPAKQ-5 IT, MT29C4G48MAZAPAKQ-5 IT, MT29C4G48MAZAPAKQ-6 IT, MT29C4G96MAZAPCJG-5 IT,


    Original     		PDF 168-Ball MT29C4G48MAYAPAKQ-5 MT29C4G48MAZAPAKQ-5 MT29C4G48MAZAPAKQ-6 MT29C4G96MAZAPCJG-5 MT29C4G96MAZAPCJG-6 MT29C8G96MAZAPDJV-5 MT29C8G96MAZAPDJV-6 09005aef83ba4387 MT29C4G96M MT29C4G96MAZAPCJG-5IT MT29C4G48mazapakq MT29F8G16 lpddr2 mcp lpddr2 nand mcp MT29C8G96 samsung* lpddr2* pop package

    MT29F4G08ABA

    Abstract: MT29C4G48 ELPIDA LPDDR2 POP MT29C4G48MAZBAAKQ-5
    Text: Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAPŒ) MT29C4G48MAYBAAKQ-5 WT, MT29C4G48MAZBAAKQ-5 WT, MT29C4G96MAYBACJG-5 WT, MT29C4G96MAZBACJG-5 WT,


    Original     		PDF 168-Ball MT29C4G48MAYBAAKQ-5 MT29C4G48MAZBAAKQ-5 MT29C4G96MAYBACJG-5 MT29C4G96MAZBACJG-5 MT29C8G96MAYBADJV-5 MT29C8G96MAZBADJV-5 MT29F4G08ABA MT29C4G48 ELPIDA LPDDR2 POP

    MT29F4G08ABA

    Abstract: MT29F8G08A MT29F4G08ABAD MT29C4G96MAZ MT29F4G08ABB mt29f4g16aba MT29C4G96M MT29F4G08AB smd transistor marking BA1 MT29C8G96
    Text: Preliminary‡ Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29C4G48MAYAPAKQ-5 IT, MT29C4G48MAZAPAKQ-5 IT, MT29C4G48MAZAPAKQ-6 IT, MT29C4G96MAZAPCJG-5 IT,


    Original     		PDF 168-Ball MT29C4G48MAYAPAKQ-5 MT29C4G48MAZAPAKQ-5 MT29C4G48MAZAPAKQ-6 MT29C4G96MAZAPCJG-5 MT29C4G96MAZAPCJG-6 MT29C8G96MAZAPDJV-5 MT29C8G96MAZAPDJV-6 09005aef83ba4387 MT29F4G08ABA MT29F8G08A MT29F4G08ABAD MT29C4G96MAZ MT29F4G08ABB mt29f4g16aba MT29C4G96M MT29F4G08AB smd transistor marking BA1 MT29C8G96

    MT29C4G48MAZBBAKQ-48 IT

    Abstract: MT29C8G96MAZBBDJV-48 IT MT29C4G96MAZBBCJG-48 mt29c4g96
    Text: Micron Confidential and Proprietary 168-Ball NAND Flash with LPDDR PoP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package PoP Combination Memory (TI OMAP ) MT29C4G48MAZBBAKQ-48 IT: 4Gb x16 (NAND) with 2Gb x32 (LPDDR) MT29C4G96MAZBBCJG-48 IT: 4Gb x16 (NAND) with 4Gb x32 (LPDDR)


    Original     		PDF 168-Ball MT29C4G48MAZBBAKQ-48 MT29C4G96MAZBBCJG-48 MT29C8G96MAZBBDJV-48 09005aef855512a5 168ball MT29C4G48MAZBBAKQ-48 IT MT29C8G96MAZBBDJV-48 IT mt29c4g96

    OMAP4

    Abstract: LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera OMAP35xx lf4300 solder dipping pop
    Text: Application Report SPRAAV2 – April 2008 PCB Assembly Guidlines for 0.4mm Package-On-Package PoP Packages, Part II Keith Gutierrez and Gerald Coley .


    Original     		PDF OMAP35xx OMAP4 LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera lf4300 solder dipping pop

    CU-106A

    Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
    Text: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PB Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package


    Original     		PDF 216-ball EDFA164A1PB 1600Mbps M01E1007 E1909E50

    Untitled

    Abstract: No abstract text available
    Text: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PK Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package


    Original     		PDF 216-ball EDFA164A1PK 1600Mbps M01E1007 E2052E20

    Untitled

    Abstract: No abstract text available
    Text: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 14.0mm x 14.0mm, 220-ball FBGA EDFA164A1PF Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Package


    Original     		PDF 220-ball EDFA164A1PF 1600Mbps M01E1007 E1965E40

    EDB4432BAPA

    Abstract: No abstract text available
    Text: DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB4432BAPA Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm


    Original     		PDF 168-ball EDB4432BAPA 1066Mbps M01E1007 E1775E40 EDB4432BAPA

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET 2G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB2432BCPE Specifications Features • Density: 2G bits • Organization — 8M words × 32 bits × 8 banks • Data rate: 800Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm


    Original     		PDF 168-ball EDB2432BCPE 800Mbps M01E1007 E1881E20

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB4432BAPC Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm


    Original     		PDF 216-ball EDB4432BAPC 1066Mbps M01E1007 E1891E10

    Untitled

    Abstract: No abstract text available
    Text: COVER DATA SHEET 16G bits DDR2 Mobile RAMTM PoP 14.0mm  14.0mm, 220-ball FBGA EDBA164B1PM Specifications Features • Density: 16G bits • Organization: — 4 pieces of 4Gb (16M words 32 bits  8 banks) in one package — Independent 2-channel bus


    Original     		PDF 220-ball EDBA164B1PM 1066Mbps M01E1007 E1987E30

    Untitled

    Abstract: No abstract text available
    Text: COVER PRELIMINARY DATA SHEET 12G bits DDR2 Mobile RAMTM PoP 14.0mm x 14.0mm, 220-ball FBGA EDBM164B1PD Specifications Features • Density: 12G bits • Organization: — 3 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus


    Original     		PDF 220-ball EDBM164B1PD 1066Mbps M01E1007 E1907E20

    MAX9890

    Abstract: MAX9890A MAX9890AEBL-T MAX9890AETA MAX9890BEBL-T MAX9890BETA
    Text: 19-2932; Rev 0; 8/03 Audio Click-Pop Suppressor The MAX9890 is available in a miniature 1.5mm ✕ 1.5mm ✕ 0.6mm 9-bump chip-scale package (UCSP ), as well as an 8-pin TDFN package (3mm ✕ 3mm ✕ 0.8mm), and is specified for operation over the -40°C to +85°C extended temperature range.


    Original     		PDF MAX9890 MO229 MAX9890A MAX9890AEBL-T MAX9890AETA MAX9890BEBL-T MAX9890BETA

    Untitled

    Abstract: No abstract text available
    Text: TPA152 75-mW STEREO AUDIO POWER AMPLIFIER SLOS210A – JUNE 1998 – REVISED MARCH 2000 D D D D D D D D D PACKAGE TOP VIEW High-Fidelity Line-Out/HP Driver 75-mW Stereo Output PC Power Supply Compatible Pop Reduction Circuitry Internal Mid-Rail Generation


    Original     		PDF TPA152 75-mW SLOS210A TPA302 TPA152 005plifiers

    TPA152

    Abstract: TPA152D TPA152DR TPA152DRG4 TPA302
    Text: TPA152 75-mW STEREO AUDIO POWER AMPLIFIER SLOS210A – JUNE 1998 – REVISED MARCH 2000 D D D D D D D D D PACKAGE TOP VIEW High-Fidelity Line-Out/HP Driver 75-mW Stereo Output PC Power Supply Compatible Pop Reduction Circuitry Internal Mid-Rail Generation


    Original     		PDF TPA152 75-mW SLOS210A TPA302 TPA152 TPA152D TPA152DR TPA152DRG4 TPA302

    TPA152

    Abstract: TPA152D TPA152DR TPA302
    Text: TPA152 75-mW STEREO AUDIO POWER AMPLIFIER SLOS210 – JUNE 1998 D D D D D D D D D PACKAGE TOP VIEW High-Fidelity Line-Out/HP Driver 75-mW Stereo Output PC Power Supply Compatible Pop Reduction Circuitry Internal Mid-Rail Generation Thermal and Short-Circuit Protection


    Original     		PDF TPA152 75-mW SLOS210 TPA302 TPA152 TPA152D TPA152DR TPA302

    LM4881

    Abstract: MO-187 TPA102 TPA6100A2 TPA6100A2D TPA6100A2DGK
    Text: TPA6100A2 50-mW STEREO AUDIO POWER AMPLIFIER SLOS269 – JUNE 2000 D D D D D D D D D D PACKAGE TOP VIEW 50 mW Stereo Output Low Supply Current . . . 0.75 mA Low Shutdown Current . . . 50 nA Pin Compatible With LM4881 and TPA102† Pop Reduction Circuitry


    Original     		PDF TPA6100A2 50-mW SLOS269 LM4881 TPA102 TPA6100A2 MO-187 TPA102 TPA6100A2D TPA6100A2DGK

    Untitled

    Abstract: No abstract text available
    Text: TPA152 75-mW STEREO AUDIO POWER AMPLIFIER SLOS210A – JUNE 1998 – REVISED MARCH 2000 D D D D D D D D D PACKAGE TOP VIEW High-Fidelity Line-Out/HP Driver 75-mW Stereo Output PC Power Supply Compatible Pop Reduction Circuitry Internal Mid-Rail Generation


    Original     		PDF TPA152 75-mW SLOS210A TPA302 TPA152