5SMY 12J1721
Abstract: No abstract text available
Text: Data Sheet, Doc. No. 5SYA 1325-01 12 01 5SMY 12J1721 IGBT-Die VCE = 1700 V IC = 75 A Ultra low loss thin IGBT die Highly rugged SPT+ design Large bondable emitter area Passivation: Silicon Nitride plus Polyimide Maximum rated values 1 Parameter Collector-emitter voltage
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12J1721
CH-5600
5SMY 12J1721
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L 9101
Abstract: HSCH-9101 HSCH-9201 HSCH-9251 VF10 HSCH9201
Text: Agilent HSCH-9101/9201/9251 GaAs Beam Lead Schottky Barrier Diodes Data Sheet Features • Gold tri-metal system for improved reliability • Low capacitance • Low series resistance • High cutoff frequency • Polyimide passivation HSCH-9201 Description
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HSCH-9101/9201/9251
HSCH-9201
HSCH-9101
HSCH-9201
HSCH-9251
CH-9201.
10E-5
10E-13
5965-8851E
5988-1897EN
L 9101
VF10
HSCH9201
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dt 92 abb
Abstract: 5SMX12L2510
Text: VRRM = IF = 2500 V 100 A Fast-Diode Die 5SLX 12L2510 Die size: 12.4 x 12.4 mm Doc. No. 5SYA1664-02 Feb. 05 • • • • Fast and soft reverse-recovery Low losses High SOA Passivation: SIPOS Nitride plus Polyimide Maximum rated values 1 Parameter Symbol
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12L2510
5SYA1664-02
CH-5600
dt 92 abb
5SMX12L2510
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Untitled
Abstract: No abstract text available
Text: This document was generated on 03/08/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 15015-0425 Active Premo-Flex FFC and Etched Polyimide Jumpers 0.30mm Pitch Premo-Flex™ Etched Polyimide Jumper, Same Side Contacts Type A ,
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PS-15015-001
15015Series
SD-15015-001
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Untitled
Abstract: No abstract text available
Text: This document was generated on 01/21/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 98268-0257 Active Premo-Flex FFC and Etched Polyimide Jumpers 1.25mm Pitch Premo-Flex™ FFC Jumper, Same Side Contacts Type A , 20 Circuits,
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PS-98268-001
PK-98268-001
SD-98268-001
98268Series
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Untitled
Abstract: No abstract text available
Text: This document was generated on 04/10/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 98267-1115 Active Premo-Flex FFC and Etched Polyimide Jumpers 1.00mm Pitch Premo-Flex™ FFC Jumper, Same Side Contacts Type A , 39 Circuits,
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PS-98267-001
PK-98267-001
SD-98267-001
98267Series
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Untitled
Abstract: No abstract text available
Text: This document was generated on 11/20/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 98267-0473 Active Premo-Flex FFC and Etched Polyimide Jumpers 1.00mm Pitch Premo-Flex™ FFC Jumper, Same Side Contacts Type A , 30 Circuits,
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PS-98267-001
PK-98267-001
SD-98267-001
98267Series
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m22759 Raychem
Abstract: M22759 M22759/86 AS22759 M22759/86-26 19X32 M2275 SAE-AS22759 raychem AWG 14 DSA003262
Text: SPECIFICATION CONTROL DRAWING Title RCW5986 Date WIRE, ELECTRICAL, NORMAL WEIGHT, POLYTETRAFLUOROETHYLENE/POLYIMIDE-INSULATED, SILVER-COATED COPPER, 200°C, 600 VOLTS This product meets all requirements of SAE AS22759/86 for the part numbers specified herein.
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RCW5986
AS22759/86
RCW5986-26-*
RCW5986-24-*
RCW5986-22-*
RCW5986-20-*
RCW5986-18-*
RCW5986-16-*
RCW5986-14-*
RCW5986-12-*
m22759 Raychem
M22759
M22759/86
AS22759
M22759/86-26
19X32
M2275
SAE-AS22759
raychem AWG 14
DSA003262
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SR-4 STRAIN GAGES
Abstract: FAE-25-12SX FAE-12-12SX
Text: SR-4 Strain Gages Micro-Measurements FAE Constantan Foil, Polyimide Carrier Series Strain Gages The complete range of BLH SR-4® strain gages and installation accessories are now a part of the extensive line of measurement products. And, while many similar Micro-Measurements strain gages and installation accessories are also available, our
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22-Feb-10
SR-4 STRAIN GAGES
FAE-25-12SX
FAE-12-12SX
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Polyimide
Abstract: 3m 5419
Text: Technical Data September, 2010 3M Low Static Polyimide Film Tape 5419 Product Description 3M™ Low Static Polyimide Film Tape 5419 is a translucent, polyimide film-backed silicone adhesive tape with unique and extremely low electrostatic discharge properties.
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225-3S-06
Polyimide
3m 5419
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dupont kapton rohs
Abstract: 3M 5413 kapton 5413 E230409 UL-510
Text: Technical Data September, 2010 3M Polyimide Film Tape 5413 Product Description 3M™ Polyimide Film Tape 5413 consists of a Kapton polyimide film and silicone adhesive designed for high temperature applications. Product Construction Backing Adhesive Liner
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225-3S-06
dupont kapton rohs
3M 5413
kapton 5413
E230409
UL-510
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12M6500
Abstract: 5SMX12M6500
Text: VRRM = IF = 6500 V 50 A Fast-Diode Die 5SLX 12M6500 Die size: 13.6 x 13.6 mm Doc. No. 5SYA1666-01 July 07 • • • • Fast and soft reverse recovery Low losses Large SOA Passivation: SIPOS and Silicon Nitride plus Polyimide Maximum rated values 1 Parameter
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12M6500
5SYA1666-01
CH-5600
12M6500
5SMX12M6500
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abb press-pack igbt
Abstract: 5slx12n4506
Text: VCE IC = = 4500 V 40 A IGBT-Die 5SMX 12N4507 Die size: 14.3 x 14.3 mm Doc. No. 5SYA1626-03 July 06 • • • • Low loss, rugged SPT technology Smooth switching for good EMC Emitter metallisation optimized for press-pack packaging Passivation: SIPOS and Silicon Nitride plus Polyimide
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12N4507
5SYA1626-03
sp4507
CH-5600
abb press-pack igbt
5slx12n4506
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ODS-186
Abstract: HP4291A MA4FCP300 MA4FCP300-T MA4FCP300-W
Text: MA4FCP300 Silicon Flip Chip PIN Diode V 1.00 1269 Outline Drawing Features n n n n n n n Low Series Resistance : 2.6 Ω Low Capacitance : 45 fF Fast Switching Speed : 40 nS Silicon Nitride Passivation Polyimide Scratch Protection Designed for Automated Pick and Place Insertion
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MA4FCP300
ODS-186
HP4291A
MA4FCP300
MA4FCP300-T
MA4FCP300-W
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diode 1283
Abstract: Schottky diode Die flip chip SEMICONDUCTOR DEVICE, DIODE 1283 B 1283
Text: Solder Bump Silicon Flip Chip Medium Barrier Schottky Diode Features • • • • • • • • • • • Low Series Resistance : 6.5 Ω Low Capacitance : 95 fF Sn 63/ Pb 37 Solder Bumps Silicon Nitride Passivation Polyimide Scratch Protection Designed for Automated Pick and Place Insertion
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MA4FCS100M-1283
MA4FCS100M-1283W
MA4FCS100M-1283T
diode 1283
Schottky diode Die flip chip
SEMICONDUCTOR DEVICE, DIODE 1283
B 1283
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MA4AGBLP912
Abstract: No abstract text available
Text: MA4AGBLP912 AlGaAs Beamlead PIN Diode V4 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ Topside Low Series Resistance Low Capacitance 5 Nanosecond Switching Speed Can be Driven by a Buffered +5V TTL Silicon Nitride Passivation Polyimide Scratch Protection RoHS Compliant
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MA4AGBLP912
MA4AGBLP912
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Untitled
Abstract: No abstract text available
Text: MADS-001317-1320AG GaAs Solder Bump Flip Chip Schottky Diode M/A-COM Products Rev. V2 Features • • • • • • Low Series Resistance, 4 Ω Low Capacitance, 45 fF High Cutoff Frequency Silicon Nitride Passivation Polyimide Scratch Protection Solderable Bump Die Attach
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MADS-001317-1320AG
MADS-001317-1320AG
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Untitled
Abstract: No abstract text available
Text: Micro-D Well-Master 260 Well-Master™ 260 High Temperature Micro-D GHTM Pre-Wired Connectors GHTM Pre-Wired Connectors with +260°C Mil Spec PTFE/Polyimide Wire GHTM Well-Master™ 260 pre-wired Micro-D connectors withstand +260°C continuous operating temperature. These .050" pitch Micro-D connectors are terminated to #24 or #26
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M22759/87,
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abb press-pack igbt
Abstract: 12L2516
Text: VCE IC = = 2500 V 54 A IGBT-Die 5SMX 12L2516 Die size: 12.4 x 12.4 mm Doc. No. 5SYA 1317-01 11 11 • • • • Ultra low loss thin IGBT die Highly rugged SPT design Emitter metallisation optimized for press-pack packaging Passivation: SIPOS and Silicon Nitride plus Polyimide
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12L2516
CH-5600
abb press-pack igbt
12L2516
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Untitled
Abstract: No abstract text available
Text: Data Sheet, Doc. No. 5SYA 1690-02 11 05 5SLY 12F1700 Fast-Diode Die VRRM = 1700 V IF = 75 A Ultra low losses Fast and soft reverse-recovery Large SOA Passivation: SIPOS, Nitride plus polyimide Maximum rated values 1 Parameter Symbol Repetitive peak reverse voltage
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12F1700
CH-5600
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MJ10050
Abstract: No abstract text available
Text: VRRM = IF = 1200 V 100 A Diode-Die 5SLY 12G1200 Die size: 8.4 x 8.4 mm Doc. No. 5SYA 1683-00 Nov 09 • • • • Ultra low losses Fast and soft reverse-recovery Highly rugged SPT+ design Passivation: Silicon Nitride plus Polyimide Maximum rated values 1
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12G1200
CH-5600
MJ10050
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abb igbt die
Abstract: No abstract text available
Text: VCE IC = = 1200 V 25 A IGBT-Die 5SMX 12E1280 PRELIMINARY Die size: 6.6 x 6.5 mm Doc. No. 5SYA1306-01 July 08 • • • • • Low loss, rugged SPT technology Smooth switching for good EMC Large bondable emitter area Passivation: Silicon Nitride plus Polyimide
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12E1280
5SYA1306-01
CH-5600
abb igbt die
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Untitled
Abstract: No abstract text available
Text: VCE IC = = 1200 V 100 A IGBT-Die 5SMX 12L1280 PRELIMINARY Die size: 12.6 x 12.6 mm Doc. No. 5SYA1309-01 Aug 08 • • • • • Low loss, rugged SPT technology Smooth switching for good EMC Large bondable emitter area Passivation: Silicon Nitride plus Polyimide
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12L1280
5SYA1309-01
CH-5600
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Untitled
Abstract: No abstract text available
Text: This document was generated on 04/02/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 98267-0211 Active Premo-Flex FFC and Etched Polyimide Jumpers 1.00mm Pitch Premo-Flex™ FFC Jumper, Same Side Contacts Type A , 6 Circuits,
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PS-98267-001
PK-98267-001
PK-98267-001
PS-98267-001
SD-98267-001
98267Series
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