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    PLCC TRAY 40 PIN Search Results

    PLCC TRAY 40 PIN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    PLCC TRAY 40 PIN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tqfp 10x10 tray

    Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
    Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.


    Original     		PDF

    CCGA

    Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
    Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:


    Original     		PDF

    IC160-0324

    Abstract: No abstract text available
    Text: IC160 Series PLCC SMT Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Current Rating: Insertion/Extraction Force: Soldering Conditions: 500MΩ min. at 500 V DC 250 V AC for 1 minute 30mΩ max. at 10mA / 20mV 1A max. 0.147 N / Pin min., 1.47 N / Pin max.


    Original     		PDF IC160 IC160 Fini24 IC160-0324

    84 pin plcc pcb outline

    Abstract: PLCC 44 socket layout IC1600 IC160-0324
    Text: IC160 Series Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Current Rating: Insertion/Extraction Force: Soldering Conditions: 500MΩ min. at 500V DC 250V AC for 1 minute 30mΩ max. at 10mA / 20mV 1A max. 0.147 N / Pin min., 1.47 N / Pin max.


    Original     		PDF IC160 IC160 84 pin plcc pcb outline PLCC 44 socket layout IC1600 IC160-0324

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    TQFP Shipping Trays

    Abstract: MQFP Shipping Trays PB1083 Lattice PLSI
    Text: Product Bulletin November, 1997 #PB1083 Lattice OEM Customer Ordering Guidelines For Standard Products Introduction Lattice has instituted new OEM ordering guidelines aimed at providing further enhancements to the quality of our products and services. These new guidelines will


    Original     		PDF PB1083 1-888-ISP-PLDS TQFP Shipping Trays MQFP Shipping Trays PB1083 Lattice PLSI

    antistatic epe foam

    Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
    Text: The Operation Instruction of Packing Materials PURPOSE Warehouse and Subcontractors according to the instruction for purchaseing and incoming inspection, formulate the Operation Instruction of Packing Materials. SCOPE Related all packing materials in warehouse.


    Original     		PDF 200mm 150mm 118MIL 150MIL 300MIL antistatic epe foam mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220

    Untitled

    Abstract: No abstract text available
    Text: IC160 Series | YAMAICHI ELECTRONICS Page 1 of 4 Home | Site Map | Japanese | Our News & Events Products & Services About Us Contact Us Products & Services Connectors PLCC Flexible Printed Boards 1.27mm pitch IC Sockets Test & Burn-in Sockets Production IC Sockets


    Original     		PDF IC160 IC140 IC149 IC160Z-028430* IC160Z-032430* IC160Z-044430* IC160Z-052430* IC160Z-068430*

    Untitled

    Abstract: No abstract text available
    Text: www.we-online.com PLCC Socket WR-PLCC 10 09/08 10-1 www.we-online.com PLCC Socket WR-PLCC In the past IC socket were normally mounted on a PCB but upgrade and replacements were not so easy to make, that’s why PLCC socket became so popular. PLCC sockets are soldered to the plated through holes or to the SMT layout on a PCB,


    Original     		PDF UL94-V0

    sot89 MARK JB

    Abstract: V7100 TSOP 66 Package mark JS sot-25 YB SOT-25 150MIL 300MIL 600MIL TO-220t qfn 8 x 8 TRAY
    Text: 成品倉庫封裝材料規格規範手冊 目的 制定成品倉庫相關封裝材料收料標準，作為成品倉庫及外包廠採購及驗收遵循依據。 適用範圍 成品倉庫所有相關封裝材料。 內容 包材資料 WAFER 包裝用材料 參表一


    Original     		PDF 200mm( 150mm( 520mm( 690mm( 179mm( 230mm( 180mm( sot89 MARK JB V7100 TSOP 66 Package mark JS sot-25 YB SOT-25 150MIL 300MIL 600MIL TO-220t qfn 8 x 8 TRAY

    ic str wg 252

    Abstract: HV9961 hv9931 HV9910B HV9910 str 6655 HV9919 pj 899 diode BIBRED STR 6656
    Text: Supertex inc. Short Form Catalog 2009 High Voltage, Mixed Signal Integrated Circuits and MOSFETs 1235 Bordeaux Drive - Sunnyvale - CA - 94089 - USA Telephone: 408 222-8888 Fax: (408)222-4800 or (408)222-4895 For the latest in product and dataheet information,


    Original     		PDF

    STR 6656

    Abstract: HV509 str 6655 pj 899 diode HV9910 K 3264 fet transistor tray qfn 7x7 diode PJ 966 relay 4098 cell phone detector
    Text: Supertex inc. Short Form Catalog 2009 High Voltage, Mixed Signal Integrated Circuits and MOSFETs 1235 Bordeaux Drive - Sunnyvale - CA - 94089 - USA Telephone: 408 222-8888 Fax: (408)222-4800 or (408)222-4895 For the latest in product and dataheet information,


    Original     		PDF

    HV9961

    Abstract: 2N7002 MARKING 1702 HV9963 HV9910 hv9910b SR087 str 6655 STR 6656 DN2450 HV509
    Text: Supertex inc. Short Form Catalog 2011 High Voltage, Mixed Signal Integrated Circuits and MOSFETs 1235 Bordeaux Drive - Sunnyvale - CA - 94089 - USA Telephone: 408 222-8888 Fax: (408)222-4800 or (408)222-4895 For the latest in product and dataheet information,


    Original     		PDF product25 HV9961 2N7002 MARKING 1702 HV9963 HV9910 hv9910b SR087 str 6655 STR 6656 DN2450 HV509

    KGA0E000BA

    Abstract: kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC
    Text: Mobile SoC Code Information • Microcontroller • MSP • MOS August 2009 -1- Part Number Decoder Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte


    Original     		PDF 16-bit 32-bit ARM10 16-bit HT80Cer KGA0E000BA kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC

    SMD CODE 9Z

    Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
    Text: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2


    Original     		PDF 300mm SMD CODE 9Z 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products

    JEDEC Matrix Tray outlines

    Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
    Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also


    Original     		PDF EIA-481-x, JEDEC Matrix Tray outlines ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label

    EZ80 tube

    Abstract: TUBE EZ80 ZHX1223 0408 G Diode chip base lead plastic QFN tray ZHX1403 ZHX1203 ZHX1423 ZHX1810
    Text: Packaging Product Specification PS007226-0408 Copyright 2008 by Zilog, Inc. All rights reserved. www.zilog.com Warning: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF


    Original     		PDF PS007226-0408 MKT71C1187-00 MKT71C1153-00 MKT71C1188-00 MKT71C1190-00 MKT71C1189-00 MKT71C0002-00 MKT71C1172-00 MKT71C1177-00 EZ80 tube TUBE EZ80 ZHX1223 0408 G Diode chip base lead plastic QFN tray ZHX1403 ZHX1203 ZHX1423 ZHX1810

    tsop tray matrix outline

    Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
    Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also


    Original     		PDF

    ZHX1203

    Abstract: ZHX1223 ZHX1403 ZHX1423 ZHX1810 ZHX1820 ZHX2022 52855 za9l MC 1200 Motor Control Board
    Text: Packaging Product Specification PS007225-0607 Copyright 2007 by ZiLOG, Inc. All rights reserved. www.zilog.com Warning: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZiLOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF


    Original     		PDF PS007225-0607 componeMKT71C1191-00 MKT71C1187-00 MKT71C1153-00 MKT71C1188-00 MKT71C1190-00 MKT71C1189-00 MKT71C0002-00 MKT71C1172-00 ZHX1203 ZHX1223 ZHX1403 ZHX1423 ZHX1810 ZHX1820 ZHX2022 52855 za9l MC 1200 Motor Control Board

    sqfp 14x20

    Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
    Text: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has


    Original     		PDF 30MHz 80C51 sqfp 14x20 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes

    20 pin header connector molex

    Abstract: HEADER 2.0MM guide
    Text: Molex Welcome Connectors Interconnects electrical,electronic, fiber optic.IA, Cable, SIMM, DIMM, PLCC, I/O, Input/output, Microminature, industrial Datasheet Board-to-Board 1.27 .050" EBBI Blind-Mate, Vertical Receptacle-Right Angle Header 71660vb:71661rb


    Original     		PDF 71660vb 71661rb 71661rb PS-71660 E29179 LR19980-239A 71660vb, 20 pin header connector molex HEADER 2.0MM guide

    LM 3558

    Abstract: 49/LM 3558
    Text: IC 160 SERIES P tC C O ,27m m pitch •Term inal Type Solder dip) (Long terminal SMT) FEATURES • Low profile design with package height 3.8 to 5.0mm (SMT type) or (IC identical pattern) 6.0mm (solder dip type). • SMT (IC identical foot pattern and long terminal type) and solder


    OCR Scan     		PDF LSI-PULL-19) 500MQ at500VDC 250VAC LSI-PULL-19 LM 3558 49/LM 3558

    Untitled

    Abstract: No abstract text available
    Text: IC160Series PLCC 1.27mm Pitch YAMAICHI eUBCTRONICS Features v 'r y h i& '6 ^ t £ jL » ^ - r 7 ) h P -7 P 7 T ’ -r;UISth m m m t SM T * * ? : 5.0mmN It/ u tc T * »j 7 * ^ 7 : 6.0m m ) s m s r W R o H S 3 i^ J i5 Low-profile design mountable on PCB at height 5.0mm (SMT)


    OCR Scan     		PDF IC160Series IC160Z- IC1602/ IC160 160Z-0524-40* 160Z-0684-40* 160Z-0844-40* 160Z-0204-40* 160Z-0284-40* 160Z-0444-40*

    ic160z044424

    Abstract: ic160 32 IC160Z-0324 IC160Z-0204-40 bb45 IC160Z-0444 IC160Z-0844-40 IC160 LSI-PULL-19 ic160z-0324-30"
    Text: IC160Series PLCC YAMAICHI 1.27mm Pitch e u e c T R O N ic s Features v fr v K i& '6 ^ t £ jL » ^ - r 7 ) h n - y a y y ^ J i m t ( H H S M T ^ - r ^ : 5.0mmN te/utcT* *j 7 $ ^ 7 : 6.0mm) S M S rW R o H S 3 i^ i5 Low-profile design mountable on PCB at height 5.0mm (SMT)


    OCR Scan     		PDF 127mm IC160 IC160S/ IC160Z-0204-40* IC160Z-0284-40" IC160Z-0444-40" IC160Z-0524-40" IC160Z-0684-40" IC160Z-0844-40" ic160z044424 ic160 32 IC160Z-0324 IC160Z-0204-40 bb45 IC160Z-0444 IC160Z-0844-40 LSI-PULL-19 ic160z-0324-30"