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    PLCC JUNCTION TO AMBIENT RESISTANCE Search Results

    PLCC JUNCTION TO AMBIENT RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    LF157H Rochester Electronics LLC LF157 - JFET Input Operational Amplifier Visit Rochester Electronics LLC Buy
    9513APC-G Rochester Electronics LLC 9513A - Rochester Manufactured 9513, System Timing Controller, 44 PLCC Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    ADC1038CIWM Rochester Electronics LLC ADC1038 - ADC, Successive Approximation, 10-Bit, 1 Func, 8 Channel, Serial Access, PDSO20 Visit Rochester Electronics LLC Buy
    TL505CN Rochester Electronics LLC TL505 - Analog to Digital Converter Visit Rochester Electronics LLC Buy
    ML2258CIQ Rochester Electronics LLC ML2258 - ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, PQCC28 Visit Rochester Electronics LLC Buy

    PLCC JUNCTION TO AMBIENT RESISTANCE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    tqfp 44 thermal resistance datasheet

    Abstract: plcc junction to ambient resistance EPAD-TQFP-64 tqfp 64 thermal resistance
    Text: THERMAL MANAGEMENT Semiconductor devices dissipate heat while operating. Device junction temperature is a function of : 1 the amount of power dissipated in the circuit, and (2) the net thermal resistance between the heat source and a reference point such as the surrounding ambient of still air. It has been well


    Original     		200LFM tqfp 44 thermal resistance datasheet plcc junction to ambient resistance EPAD-TQFP-64 tqfp 64 thermal resistance PDF

    tqfp 44 thermal resistance datasheet

    Abstract: tqfp 44 thermal resistance plcc junction to ambient resistance 500LFM QL12X16B QL16X24B QL24X32B QL8X12B Thermal Resistance Calculation TO
    Text: THERMAL MANAGEMENT The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external environment. This is represented in


    Original     		QL24X32B QL8X12B QL12X16B QL16X24B tqfp 44 thermal resistance datasheet tqfp 44 thermal resistance plcc junction to ambient resistance 500LFM QL12X16B QL16X24B QL24X32B QL8X12B Thermal Resistance Calculation TO PDF

    Theta-JC

    Abstract: theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007
    Text: 9 The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external


    Original     		QL8X12B QL12X16B QL16X24B QL24X32B QL2005 QL2007 QL2009 QL2003 Theta-JC theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007 PDF

    smd transistor 12W 3 pins

    Abstract: Ultrasonic Cleaning Transducer AN264 LM2901 LM2903 LM2904 M74HC00 M74HC74 RH 6v IC AN264
    Text: AN264 APPLICATION NOTE RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF PLASTIC SMDS by C. Cognetti, E. Stroppolo and R. Tiziani INTRODUCTION Surface Mount Technology SMT has introduced a number of new technical problems, which have delayed the


    Original     		AN264 smd transistor 12W 3 pins Ultrasonic Cleaning Transducer AN264 LM2901 LM2903 LM2904 M74HC00 M74HC74 RH 6v IC AN264 PDF

    PLCC-44 SMD

    Abstract: PLCC-44 SMD heatsink smd transistor 12W 3 pins Ultrasonic Cleaning Transducer Ultrasonic Transducer application notes ultrasonic transducers under water application Ultrasonic Water Transducer transistor smd 4s npn smd transistor 12w M74HC74
    Text: APPLICATION NOTE RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF PLASTIC SMDs By C. Cogn etti, E. Stropp olo and R. T izian i INTRODUCTION Surface Mount Technology SMT has introduced a number of new technical problems, which have delayed the conversion from insertion assembly.


    Original     		PDF

    T17B

    Abstract: intel 24022
    Text: intei lntel387TM SX MATH COPROCESSOR The ambient temperature 0 a is guaranteed as long as Tc is not violated. The ambient temperature can be calculated from the 0 jc thermal resistance con­ stant from the transistor junction to the case) and 0 j a (thermal resistance from junction to ambient)


    OCR Scan     		Intel387 68-pin lntel387TM Intel387TM T17B intel 24022 PDF

    Ablebond 71-1

    Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
    Text: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages  DC resistance R of leads or pins  Capacitance (C) including lead-to-lead and loading capacitances  Inductance (L) including only self-inductance values for pins traces and wires (PGA) or


    Original     		93-WA-EEP-6 91-WA-EEP-27 91-WA-EEP-31 pp1059-1070 pp357-366 Ablebond 71-1 Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board PDF

    5060 PLCC

    Abstract: P432 PLCC-20 PLCC44 PLCC-44 PLCC-84 SO16W SO20 Small Outline SO-12 thermal resistance PLCC20
    Text: APPLICATION NOTE THERMAL MANAGEMENT IN SURFACE MOUNTING The evolutionary trends of integrated circuits and printed circuits boards are, in both cases, towards improved performance and reduced size. From these points of view, a factor of major importance has


    Original     		PDF

    PALC22V10B-20KMB

    Abstract: PALC22V10B-20WMB PALC22V10B20WMB palc22v10b-15hc V103-6 ecl pal 16 macrocells PALC22V10B palc22v10b-15jc cypress 22V10b PALC22V10B-15KMB
    Text: CYPRESS SEMI CONDUCTOR b£E T> SS f i T b b E QG1D3Ô3 2Mb CYP PALC22V10B CYPRESS SEMICONDUCTOR • Advanced second generation PAL ar­ chitecture • Low power — 90 m A max. standard — 100 mA max. military • CMOS EPROM technology for repro­ grammability


    OCR Scan     		PALC22V10B T-90-20 PALC22V10B-20KMB PALC22V10B-20WMB PALC22V10B20WMB palc22v10b-15hc V103-6 ecl pal 16 macrocells PALC22V10B palc22v10b-15jc cypress 22V10b PALC22V10B-15KMB PDF

    an262

    Abstract: thermal conductivity P432 PLCC-20 PLCC44 PLCC-44 SO16W SO20
    Text: AN262 APPLICATION NOTE THERMAL MANAGEMENT IN SURFACE MOUNTING The evolutionary trends of integrated circuits and printed circuits boards are, in both cases, towards improved performance and reduced size. From these points of view, a factor of major importance has been


    Original     		AN262 an262 thermal conductivity P432 PLCC-20 PLCC44 PLCC-44 SO16W SO20 PDF

    CLCC 64 pins footprint

    Abstract: eprom mtbf CY10E474 64 CERAMIC LEADLESS CHIP CARRIER LCC CY10E301
    Text: CY7C285 CYPRESS SEMICONDUCTOR 64K x 8 Reprogrammable Fast Column Access PROM Features Functional Description • CMOS for optimum speed/power T h e CY7C285 is a high-perform ance 65,536 by 8 -bit C M O S P R O M . It is avail­ able in a 28-pin 300-mil package and fe a ­


    OCR Scan     		CY7C285 300-mil 28-pin 64-byte T-90-20 CLCC 64 pins footprint eprom mtbf CY10E474 64 CERAMIC LEADLESS CHIP CARRIER LCC CY10E301 PDF

    238Q

    Abstract: 7C371-66 7C371-83 CY7C371 CY7C372 FLASH370 319q CLCC 64 pins footprint
    Text: CYPRESS bSE SEMICONDUCTOR D ESSTbbS 0010S3Ö CY7C371 PRELIMINARY CYPRESS SEMICONDUCTOR Ob4 32-Macrocell Flash PLD Features Functional Description • 32 macrocells in two logic blocks • 32 I/O pins • 6 dedicated inputs including 2 clock pins • No hidden delays


    OCR Scan     		CY7C371 32-Macrocell 100MHz 44-pin CY7C372 FLASH370 22V10 238Q 7C371-66 7C371-83 319q CLCC 64 pins footprint PDF

    IDT7201

    Abstract: IDT7202 linear array 512 MTBF 421A1
    Text: CYPRESS SEMICONDUCTOR bSE ]> • ESflTLbS OOlQbM'i ÖEO CY7C421A CY7C425A PRELIMINARY CYPRESS SEMICONDUCTOR High-Speed Cascadable 51 2 x 9 FIFO IK X 9 FIFO • TI L compatible • Three-state outputs • Pin compatible and functional equivalent to IDT7201 and IDT7202


    OCR Scan     		CY7C421A CY7C425A 512x9 10-ns 300-mil 28-pin 32-pin IDT7201 IDT7202 linear array 512 MTBF 421A1 PDF

    FR4 epoxy pcb double sided

    Abstract: double sided pcb, thermal via double sided pcb FR4 Aluminum Base 3 LED emitters PCB HSMC-A100 LED APPLICATION NOTE FR4 1.6mm substrate 4032C
    Text: Thermal Management of Avago MonoPLCC LED Application Note 5373 Introduction Avago SMD LED that provides high luminous intensity output has common semiconductor component character with maximum permissible junction temperature in the range of 110 – 125°C. This means that the temperature of the LED die inside must not exceed this value when


    Original     		AV02-0955EN FR4 epoxy pcb double sided double sided pcb, thermal via double sided pcb FR4 Aluminum Base 3 LED emitters PCB HSMC-A100 LED APPLICATION NOTE FR4 1.6mm substrate 4032C PDF

    MC100H641

    Abstract: MC10H641 MC10H641FN
    Text: MC10H641, MC100H641 Single Supply PECL to TTL 1:9 Clock Distribution Chip Description The MC10H/100H641 is a single supply, low skew translating 1:9 clock driver. Devices in the ON Semiconductor H641 translator series utilize the PLCC−28 for optimal power pinning, signal flow through


    Original     		MC10H641, MC100H641 MC10H/100H641 PLCC-28 MC10H640/D MC100H641 MC10H641 MC10H641FN PDF

    CY10E301

    Abstract: 7C245A CY7C245A CLCC 64 pins footprint CY7C245A-25QMB motorola 28pin smd control board
    Text: CYPRESS SEMI CONDUCTOR bSE J> 2Sf i ^t . bS 0010171 7bE CY7C245A r^ Y p p irc c ; Reprogrammable 2K x 8 Registered PROM SEMICONDUCTOR • SV ±10% V cci commercial and military Features • Windowed for reprogrammability • CMOS for optimum speed/power • High speed


    OCR Scan     		CY7C245A 15-ns 10-ns 300-mil, 24-pin 2048-OR T-90-20 CY10E301 7C245A CLCC 64 pins footprint CY7C245A-25QMB motorola 28pin smd control board PDF

    MC100H641

    Abstract: MC10H641 MC10H641FN
    Text: MC10H641, MC100H641 Single Supply PECL to TTL 1:9 Clock Distribution Chip Description The MC10H/100H641 is a single supply, low skew translating 1:9 clock driver. Devices in the ON Semiconductor H641 translator series utilize the PLCC−28 for optimal power pinning, signal flow through


    Original     		MC10H641, MC100H641 MC10H/100H641 PLCC-28 MC10H640/D MC100H641 MC10H641 MC10H641FN PDF

    Untitled

    Abstract: No abstract text available
    Text: QL8X12A pASIC 1 FAMILY Very-High-Speed IK 3K Gate CMOS FPGA A pril 1993 pASIC HIGHLIGHTS Eg Very-High-Speed, Flexible FPGA Architecture - ViaLink metal-tometal, low-resistance antifuse (<50 ohm) interconnect technology allows data path performance over 125 MHz with logic cell delays of under 2.5 ns.


    OCR Scan     		QL8X12A 8-by-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: MC10H641, MC100H641 Single Supply PECL to TTL 1:9 Clock Distribution Chip Description The MC10H/100H641 is a single supply, low skew translating 1:9 clock driver. Devices in the ON Semiconductor H641 translator series utilize the PLCC−28 for optimal power pinning, signal flow through


    Original     		MC10H641, MC100H641 MC10H/100H641 MC10H640/D PDF

    PBD 3545

    Abstract: transistor 1317 1522-PBD
    Text: January 1993 PBD 3545/1 Universal Sink Driver Description Key Features PBD 3545/1 is a bipolar universal high-current highly-protected low side driver with transparent input and 2 A continuous-current sink capability. A high-level input activates the output.


    Original     		354wever 1522-PBD S-164 O-220 3545/1N 3545/1QN PBD 3545 transistor 1317 PDF

    Thermal Management

    Abstract: Heatsinks for 14 pin dip 16 pin dip with heat sink njm3717 NJM3771 NJM3772 NJM3774 NJM3770A NJM3777
    Text: Thermal Management New JRC’s stepper motor ICs are power Ics encapsulated in Dual in Line DIP , EMP and PLCC (Plastic Leaded Chip Carrier) packages. The silicon die is directly bonded to a heat-spreading lead-frame for efficient heat-transfer to an external heat sink, or to a copper ground plane on the printed circuit board.


    Original     		PDF

    ipc-sm-786A

    Abstract: Yamaichi IC51-0804-808 Yamaichi TQFP yamaichi IC51-0562-1387 IC51-0644-807 Enplas drawings IC51-0562 socket IC51-0644-807 Datasheet Yamaichi TQFP 120 DIMENSIONS PQFP 132
    Text: Medium-Pin-Count Surface-Mount Package Information First-In, First-Out FIFO Technology SSPA001B February 1997 1 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest


    Original     		SSPA001B 44-pin 56-pin IC51-0562-1387 64-pin IC51-0644-807 68-pin IC51-0684-390 80-pin IC51-0804-394 ipc-sm-786A Yamaichi IC51-0804-808 Yamaichi TQFP yamaichi IC51-0562-1387 IC51-0644-807 Enplas drawings IC51-0562 socket IC51-0644-807 Datasheet Yamaichi TQFP 120 DIMENSIONS PQFP 132 PDF

    TO-220 package thermal resistance

    Abstract: A 3548 application note PBD 3545 PBD 3545 3548-1 pbd 3548 robot circuit diagram free 1522-PBD PBD3548 BYV98
    Text: February 1999 PBD 3548/1 Universal Source Driver Description Key Features PBD 3548/1 is a bipolar universal high-current highly-protected high side driver with transparent input and 2 A continuous-current source capability. A low-level input activates the output.


    Original     		3548/1QNT 3548/1N TO-220 package thermal resistance A 3548 application note PBD 3545 PBD 3545 3548-1 pbd 3548 robot circuit diagram free 1522-PBD PBD3548 BYV98 PDF

    Untitled

    Abstract: No abstract text available
    Text: £B CA3262A, CA3262 Quad-Gated Inverting Power Drivers November 1995 Features Description • Independent Over-Current Limiting On Each Output The CA3262 and CA3262A are used to interface low-level logic to high current loads. Each Power Driver has four inverting switches consisting of a non-inverting logic input


    OCR Scan     		CA3262A, CA3262 CA3262 CA3262A PDF