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    PITCH 0.3MM BGA Search Results

    PITCH 0.3MM BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    PITCH 0.3MM BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    0.3mm pitch BGA

    Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
    Text: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1


    Original     		PDF BGA292D 396mm 508mm 635mm FR4/G10 20X20 488mm SF-BGA292D-B-11 0.3mm pitch BGA micro pitch BGA 1mm pitch BGA BGA 20x20

    0.3mm pitch BGA

    Abstract: 34X34 1mm pitch BGA SF-BGA680B-B-11
    Text: C D Ø 0.0156" 2x (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 33mm X Top View (reference only) 1mm [0.039"] pitch typ. 0.508 mm [0.020"] dia pads 0.3mm [0.012"] dia. 2 8.69mm [0.342"] 6.85mm [0.270"] 0.5mm 0.5mm 33mm B 1


    Original     		PDF FR4/G10 34X34 SF-BGA680B-B-11 SF-BGA-680B-B-11 0.3mm pitch BGA 34X34 1mm pitch BGA

    0.3mm pitch BGA

    Abstract: SF-BGA180C-B-11
    Text: 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] sqr. 12mm [0.472"] sqr. Side View 0.3mm [0.012"] dia. typ. 8.75mm [0.344"] 6.79mm [0.268"] 2 3.75mm [0.148"] 1 3 0.8mm pitch typ. 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2


    Original     		PDF FR4/G10 16x16 SF-BGA180C-B-11 0.3mm pitch BGA

    0.3mm pitch BGA

    Abstract: SF-BGA416E-B-11 pitch 0.3mm BGA 27mmx27mm
    Text: C Ø 0.0156" 2x (Tooling Hole) D 0.5mm See BGA pattern code to the right for actual pattern layout Y 0.5mm 25mm 1mm typ. X Top View (reference only) 3.74mm [0.147"] 0.508 mm [0.020"] dia pads 0.5mm 0.5mm 2 0.3mm [0.012"] dia. 25mm 5.32mm [0.210"] B 1 3 Side View


    Original     		PDF FR4/G10 26X26 SF-BGA416E-B-11 0.3mm pitch BGA pitch 0.3mm BGA 27mmx27mm

    eh 11757

    Abstract: 0.3mm pitch BGA JEDEC FBGA Coffin-Manson Equation thermal cycling data weibull 0.4mm pitch BGA BGA Solder Ball 0.35mm FBGA 63 PCB design for very fine pitch csp package bt resin
    Text: Daisy Chain Samples Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF

    QFP lead pitch 0.3mm

    Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package
    Text: Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2000 Registration


    Original     		PDF Sep2009 ISO9001 50x50mm QFP lead pitch 0.3mm BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package

    0.3mm pitch csp package

    Abstract: 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA ALIVH ic micro AN1112
    Text: ご注意 ：日本語のア プ リ ケーシ ョ ン ・ ノ ー ト は参考資料 と し て提供 し てお り 内容が 最新で ない場合があ り ます。 製品のご使用に際 し ては、 必ず最新の英文ア プ リ ケーシ ョ ン ・ ノ ー ト を ご確認 く だ さ い。


    Original     		PDF AN-1112 0.3mm pitch csp package 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA ALIVH ic micro AN1112

    AN-1112

    Abstract: 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national
    Text: ご注意 ：日本語のア プ リ ケーシ ョ ン ・ ノ ー ト は参考資料 と し て提供 し てお り 内容が 最新で ない場合があ り ます。 製品のご使用に際 し ては、 必ず最新の英文ア プ リ ケーシ ョ ン ・ ノ ー ト を ご確認 く だ さ い。


    Original     		PDF AN-1112 AN-1112 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national

    pitch 0.4mm BGA

    Abstract: BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka
    Text: KA, SC hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOA’s original thick film technology


    Original     		PDF 100x10 100x10-6/k pitch 0.4mm BGA BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka

    Untitled

    Abstract: No abstract text available
    Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble


    Original     		PDF 100x10

    Untitled

    Abstract: No abstract text available
    Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble


    Original     		PDF 100x10

    0.3mm pitch BGA

    Abstract: pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm
    Text: 1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:58 PM Page 54 KA, SC hybrid IC EU features NEW • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available


    Original     		PDF Spreadspg189-328 Spreadspg189-328 100x10-6/K 0.3mm pitch BGA pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm

    ALIVH

    Abstract: 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA SMD Devices SMD CODE 185M wlcsp SMT
    Text: ご注意：日本語のアプリケーション・ノートは参考資料として提供しており内容が 最新でない場合があります。製品のご使用に際しては、必ず最新の英文アプ リケーション・ノートをご確認ください。


    Original     		PDF AN-1112 ALIVH 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA SMD Devices SMD CODE 185M wlcsp SMT

    FR4 substrate

    Abstract: No abstract text available
    Text: fBGA96T.5-DC144 TM BALLS PITCH 96 0.5mm SIZE MATRIX ROWS MAT’L CENTER TEL 1-714-898-3830 info@topline.tv 8mm SQ 14 x 14 BALL VIEW 2 none Flex Polyimide BOTTOM SIDE TOP X-RAY VIEW 14 13 12 11 10 9 8 7 6 5 4 3 2 1 1 2 3 A B C D E C D E F G F G H J K L M


    Original     		PDF fBGA96T 5-DC144 FR4 substrate

    15X15

    Abstract: PA-QFE160SD-P-S-01 0.3mm pitch BGA
    Text: 1.500" 0.670" 0.530" 0.100" 0.30mm 1.500" 0.530" 0.670" 0.006" 1 3 0.123" 0.250" -01W version 3 level, 0.025" Sqr. WW pin 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ"


    Original     		PDF FR4/G10 15X15 SB-PGA15/160B-01 PA-QFE160SD-P-S-01 0.3mm pitch BGA

    ES29LV160DB-90TG

    Abstract: si 462 laser diode ES29LV160D 12wg ES29LV160DT
    Text: EE SS II - Preliminary - Excel Semiconductor inc. ES29LV160D 16Mbit 2M x 8/1M x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory - Preliminary Draft - GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC


    Original     		PDF ES29LV160D 16Mbit 125oC 16Kbyte 32Kbyte 64Kbyte ES29LV160DT ES29LV160DB 48-pin 48-ball ES29LV160DB-90TG si 462 laser diode ES29LV160D 12wg

    FR4 substrate board

    Abstract: 0.3mm pitch probe BGA zif socket 0.3mm pitch BGA PB-BGA48D-Z-01 1J23
    Text: 7.62mm [0.300"] Top View 33.02mm [1.300"] * This height varies depending on the screw position. 3 5 2 5mm [0.197"]* 9.97mm [0.393"] 6 Side View 7.92mm 4 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni min. . Substrate: 3.60mm ±0.18mm [0.142" ±0.007"]


    Original     		PDF FR4/G10 PB-BGA48D-Z-01 FR4 substrate board 0.3mm pitch probe BGA zif socket 0.3mm pitch BGA 1J23

    ES29LV800EB-70TG

    Abstract: es29lv800et-70tg ES29LV800ET-70WC ES29LV800 ES29LV800E ES29LV800ET-70TGI ES29LV800EB-70TGI ES29LV800ET70TG ES29LV800EB
    Text: EE SS II Excel Semiconductor inc. ES29LV800E 8Mbit 1M x 8/512K x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC • Single power supply operation - 2.7V -3.6V for read, program and erase operations


    Original     		PDF ES29LV800E 8/512K 125oC 16Kbyte 32Kbyte 64Kbyte 15sectors ES29LV800ET ES29LV800EB 48-pin ES29LV800EB-70TG es29lv800et-70tg ES29LV800ET-70WC ES29LV800 ES29LV800E ES29LV800ET-70TGI ES29LV800EB-70TGI ES29LV800ET70TG

    PCB design for very fine pitch csp package

    Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead
    Text: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers


    Original     		PDF

    ES29LV400EB-70TGI

    Abstract: ES29LV400EB-70TG ES29LV400E BB 555 ES29LV400EB
    Text: EE SS II Excel Semiconductor inc. ES29LV400E 4Mbit 512Kx 8/256K x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC • Single power supply operation - 2.7V -3.6V for read, program and erase operations


    Original     		PDF ES29LV400E 512Kx 8/256K 125oC 16Kbyte 32Kbyte 64Kbyte ES29LV400ET ES29LV400EB 48-pin ES29LV400EB-70TGI ES29LV400EB-70TG ES29LV400E BB 555

    ES29LV800DB-90TG

    Abstract: ES29LV800 ES29LV800DB-12TG ES29LV800D ES29LV800DB-70WG ES29lv800dt-70 000000X ES29LV800DB-70WGI ES29LV800DB-70TG ES29LV800DB-70TC
    Text: EE SS II Excel Semiconductor inc. ES29LV800D 8Mbit 1M x 8/512K x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC • Single power supply operation - 2.7V -3.6V for read, program and erase operations


    Original     		PDF ES29LV800D 8/512K 125oC 16Kbyte 32Kbyte 64Kbyte 15sectors ES29LV800DT ES29LV800DB 48-pin ES29LV800DB-90TG ES29LV800 ES29LV800DB-12TG ES29LV800D ES29LV800DB-70WG ES29lv800dt-70 000000X ES29LV800DB-70WGI ES29LV800DB-70TG ES29LV800DB-70TC

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    S71NS512r

    Abstract: A22-A16 PSRAM S71NS512RD0 JEP95 S71NS-R S71NS256RD0 pSRAM_39
    Text: S71NS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 512 Mb 32 Mb x 16-bit / 256 Mb (16 Mb x 16-bit) Flash, 128 Mb (8 Mb x 16-bit) / 128Mb (4 Mb x 16-bit) pSRAM S71NS-R Memory Subsystem Solutions Cover Sheet


    Original     		PDF S71NS-R 16-bit) 128Mb S71NS512r A22-A16 PSRAM S71NS512RD0 JEP95 S71NS256RD0 pSRAM_39

    ES29LV160D

    Abstract: es29lv160dt-70rtci ES29LV160DT-70RTG ES29LV160DT-70RTC
    Text: EE SS II Excel Semiconductor inc. ES29LV160D 16Mbit 2M x 8/1M x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC • Single power supply operation - 2.7V -3.6V for read, program and erase operations


    Original     		PDF ES29LV160D 16Mbit 125oC 16Kbyte 32Kbyte 64Kbyte ES29LV160DT ES29LV160DB 48-pin 48-ball ES29LV160D es29lv160dt-70rtci ES29LV160DT-70RTG ES29LV160DT-70RTC