LGA 1207 socket F
Abstract: pcb warpage after reflow pcb warpage* in smt reflow amd socket 1207 MMC socket Socket-F Tyco LGA 1207 socket F datasheet SN63 PB37 THERMO PROFILES transistor 1207 PEAK tray drawing
Text: SOCKET F 1207 Application Specification 114-5383 7 MAY ‘07 Rev.C 1. INTRODUCTION This specification covers the requirements for application of lever-actuated Socket F 1207 position onto printed circuit (pc) boards. These sockets accept 1207-position LGA package
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1207-position
LGA 1207 socket F
pcb warpage after reflow
pcb warpage* in smt reflow
amd socket 1207
MMC socket
Socket-F Tyco
LGA 1207 socket F datasheet
SN63 PB37 THERMO PROFILES
transistor 1207
PEAK tray drawing
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TRANSISTOR DNH
Abstract: PS5022 PS1191RA PP1101W PS1101RA PS1101WA PS1102HA PS1192FA PS1192HA peak spectral response 900 nm photo detector
Text: CHARACTERISTICS AND ABSOLUTE MAXIMUM RATING BY MATERIAL n Photo Transistor Through-Hole Shape Absolute Maximum Ratings Collector-Emitter Emitter-Collector Breakdown Collector Breakdown Collector Operating Voltage Dissipation Voltage Current Temp. Part Number
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30MIN.
15MIN.
17MIN.
14MIN.
TRANSISTOR DNH
PS5022
PS1191RA
PP1101W
PS1101RA
PS1101WA
PS1102HA
PS1192FA
PS1192HA
peak spectral response 900 nm photo detector
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MOLEX 24 pin right angle connector
Abstract: right angle 20 pin pcb header connector Molex 87667 right angle 40 pin male connector
Text: PowerPlus SSI Expandable Power & Signal PowerPlusTM (SSI) Expandable Power & Signal Connectors INTRODUCTION Molex’s successfully introduced a new series of power connectors that conform to Server System Infrastructure (SSI) open specification (http://www.ssiforum.org). The DPS and MPS offer a standard
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1-800-78Molex
MOLEX 24 pin right angle connector
right angle 20 pin pcb header connector
Molex 87667
right angle 40 pin male connector
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80021
Abstract: 100C Sirenza AN-21
Text: APPLICATION NOTE-AN054 Detailed Installation Instructions for Power Modules Introduction This document provides useful guidance on the installation of the Sirenza Microdevices’ SDM series of LDMOS high power amplifier modules. Mechanical Considerations
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NOTE--AN054
EAN-102756
80021
100C
Sirenza AN-21
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Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems
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Untitled
Abstract: No abstract text available
Text: Application Note December 1999 JAHW-S-Series Surface-Mount Power Modules WARNING: This application note is intended to provide the user with the best information to date regarding the end application PCB mounting and assembly process of Lucent JAHW-S Surface-Mountable modules. It reflects the known considerations of Surface-Mount Technology based on the testing of a limited number of samples and applications. Users are
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AP00-007EPS
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CL580-3700-8-00
Abstract: M705-221CM5
Text: 0.5 mm Pitch, 1.5 mm Above-the-Board, High-Speed Transmission FPC Connector FH55 Series FH55 Differential Impedance 70ps rise time 20-80% 100+15%[ø] 100[ø] 100-15%[ø] Dimensional Diagram: 40 pins •Characteristics 4 mm (mounting area) 23.4mm 1.FPC Connector for High-Speed Transmission
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TB389
Abstract: dap 6a DAP 015 DAP 08 MO-229
Text: Plastic Packages for Integrated Circuits Ultra Thin Dual Flat No-Lead Plastic Package UTDFN A A E 6 B 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 4 MILLIMETERS D PIN 1 REFERENCE 2X 0.15 C 1 2X L6.1.6x1.6A 3 MIN NOMINAL MAX NOTES A 0.45 0.50 0.55
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MO-229.
TB389.
TB389
dap 6a
DAP 015
DAP 08
MO-229
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Senju M705-GRN360-K2-V
Abstract: Senju M705-GRN360-K2-V solder paste solder paste M705-GRN360-K2-V Senju oz 221 pcb warpage after reflow M705-GRN360 senju M705-GRN360-K2 fh4219
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.3 mm Pitch, 0.65 mm above the board, Top Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors
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31pos.
Senju M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
solder paste M705-GRN360-K2-V
Senju oz 221
pcb warpage after reflow
M705-GRN360
senju
M705-GRN360-K2
fh4219
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heller 1700
Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
Text: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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240-Pin
heller 1700
BGA reflow guide
reflow hot air BGA
BGA PACKAGE thermal profile
pcb warpage after reflow
BGA Solder Ball collapse
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Untitled
Abstract: No abstract text available
Text: Multilayer Organic MLOTM 0805 WLAN/BT Diplexer MLOTM TECHNOLOGY APPLICATIONS The 0805 MLO diplexer is best in class low profile multilayer organic passive device that is based on AVX’s patented multilayer organic high density interconnect technology. The
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Untitled
Abstract: No abstract text available
Text: Multilayer Organic MLOTM 0805 WLAN/BT Diplexer MLOTM TECHNOLOGY APPLICATIONS The 0805 MLO diplexer is best in class low profile multilayer organic passive device that is based on AVX’s patented multilayer organic high density interconnect technology. The
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NS6W183
Abstract: NS6W183T nichia NS6W183
Text: Nichia STS-DA1-0171E <Cat.No.090603> SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE MODEL : NS6W183T NICHIA CORPORATION -0- LED Nichia STS-DA1-0171E <Cat.No.090603> 1.SPECIFICATIONS 1 Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current
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STS-DA1-0171E
NS6W183T
10msec.
NS6x183T
10reel
20reel
NS6x183T
NS6W183
NS6W183T
nichia NS6W183
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Untitled
Abstract: No abstract text available
Text: Nichia STS-DA1-0133 <Cat.No.081002> SPECIFICATIONS FOR NICHIA CHIP TYPE RED MODEL : NJSR107T NICHIA CORPORATION LED Nichia STS-DA1-0133 <Cat.No.081002> 1.SPECIFICATIONS 1 Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage
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STS-DA1-0133
NJSR107T
10sec.
10msec.
NJSx107T
10reel
20reel
NJSx107T
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4707n
Abstract: NS2B095AT
Text: Nichia STS-DA1-0177C <Cat.No.090428> SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE MODEL : NS2B095AT NICHIA CORPORATION LED Nichia STS-DA1-0177C <Cat.No.090428> 1.SPECIFICATIONS 1 Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current
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STS-DA1-0177C
NS2B095AT
10sec.
10msec.
NS2x095AT
15reel
30reel
NS2x095AT
4707n
NS2B095AT
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M705-221-CM5-32-10
Abstract: M705-221CM5-32-10 senju solder paste
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. NEW 0.3 mm Pitch, 1.2 mm above the board, Top and bottom Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors
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Untitled
Abstract: No abstract text available
Text: MLOTM RF-RF SMT Crossover GENERAL DESCRIPTION The MLOTM SMT RF-RF Crossover is a very low profile crossover that intersects an RF and RF circuit trace in an SMT package. The RF-RF Crossover is a low cost solution for applications where a critical RF circuit trace intersects a RF circuit
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ISL28190
Abstract: ISL28190FHZ-T7 ISL28190FRUZ-TK ISL28290 ISL28290FRUZ-T7 ISL28290FUZ ISL28290FUZ-T7
Text: ISL28190, ISL28290 Data Sheet April 13, 2007 Single and Dual Ultra-Low Noise, Ultra-Low Distortion, Rail-to-Rail, Op Amp The ISL28190 and ISL28290 are tiny single and dual ultra-low noise, ultra-low distortion operational amplifiers. Fully specified to operated down to +3V single supply. These
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ISL28190,
ISL28290
ISL28190
ISL28290
-87dBc
-90dBc,
OT-23
ISL28190FHZ-T7
ISL28190FRUZ-TK
ISL28290FRUZ-T7
ISL28290FUZ
ISL28290FUZ-T7
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NS3W183T
Abstract: NS3W183
Text: Nichia STS-DA1-0663 <Cat.No.090309> SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE MODEL : NS3W183T NICHIA CORPORATION -0- LED Nichia STS-DA1-0663 <Cat.No.090309> 1.SPECIFICATIONS 1 Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current
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STS-DA1-0663
NS3W183T
10msec.
NSxx183T
400MAX.
10reel
20reel
NSxx183T
NS3W183T
NS3W183
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NFSW036BL
Abstract: NFSW036BLT
Text: Nichia STS-DA1-0721 <Cat.No.081204> SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE MODEL : NFSW036BLT NICHIA CORPORATION -0- LED Nichia STS-DA1-0721 <Cat.No.081204> 1.SPECIFICATIONS 1 Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current
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STS-DA1-0721
NFSW036BLT
10sec.
10msec.
NxSx036xLT
NxSx036xLT
NFSW036BL
NFSW036BLT
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STS-DA1-0634C
Abstract: 0634C NS6W183T
Text: Nichia STS-DA1-0634C <Cat.No.090603> SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE MODEL : NS6W183T-H3 NICHIA CORPORATION -0- LED Nichia STS-DA1-0634C <Cat.No.090603> 1.SPECIFICATIONS 1 Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current
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STS-DA1-0634C
NS6W183T-H3
10msec.
NSxx183T-Hx
10reel
20reel
NSxx183T-Hx
0634C
NS6W183T
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Untitled
Abstract: No abstract text available
Text: Nichia STS-DA1-0370A <Cat.No.090311> SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE MODEL : NS2L095BT NICHIA CORPORATION LED Nichia STS-DA1-0370A <Cat.No.090311> 1.SPECIFICATIONS 1 Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current
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STS-DA1-0370A
NS2L095BT
10sec.
10msec.
NS2x095xT
000MAX.
15reel
30reel
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Untitled
Abstract: No abstract text available
Text: Nichia STS-DA1-0822 <Cat.No.090615> SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE MODEL : NS3W183T-H3 NICHIA CORPORATION -0- LED Nichia STS-DA1-0822 <Cat.No.090615> 1.SPECIFICATIONS 1 Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current
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STS-DA1-0822
NS3W183T-H3
10msec.
NSxx183T-Hx
10reel
20reel
NSxx183T-Hx
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Untitled
Abstract: No abstract text available
Text: Backplane Connector System s m o le x 2.50mm .098" Pitch Omnigrid MXOI Mil ELECTRICAL • ■ ■ ■ CURRENT CAPABILITY Contact resistance (mOhm) Insulation resistance (MOhm) Current rating fully loaded connector A Dielectric strength (kv) For I/O cable connector
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OCR Scan
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82905mm
J-113
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