Untitled
Abstract: No abstract text available
Text: MODULAR JACKS AND PLUGS GSX Series KYCON Ordering Information RoHS Shield Option Series Number of Positions & Contacts Ground Pin Spacing Plating Option Series GSX - Right Angle Modular Jack PCB Mount GSXHT - High Temp,Right Angle Modular Jack PCB Mount Shield Option and Ground Pin Spacing
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LR78160
UL94V-
1-888-KYCON-22
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circuit diagram of Zigbee
Abstract: circuit diagram for wireless headsets E840ILDS Molex 2.4 Ghz SMD On-Ground Antenna circuit diagram headsets Free of circuit diagram of Zigbee Based monopole car antenna 3b smd circuit diagram for wireless rf headsets sig smd
Text: The smallest on-ground antenna of its kind, Molex’s 2.4 GHz SMD antenna requires no ground clearance and offers significant PCB real-estate savings Developed with the power and precision of Laser Direct Structuring LDS technology, Molex’s 2.4 GHz SMD on-ground antenna is the smallest on-ground
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USA/KC/2011
circuit diagram of Zigbee
circuit diagram for wireless headsets
E840ILDS
Molex 2.4 Ghz SMD On-Ground Antenna
circuit diagram headsets
Free of circuit diagram of Zigbee Based
monopole car antenna
3b smd
circuit diagram for wireless rf headsets
sig smd
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15-83-0064
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits • Partial shield assures cable shield ground to PCB ■ Flangeless design minimizes PCB real estate ■ High-temperature LCP housing for SMT processing Reference Information Product Specification: PS-71350A
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PS-7135odation:
PS-71350A
E29179
LR19980
Hz--20
GHz--10
15-83-0064
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Untitled
Abstract: No abstract text available
Text: Accessories VOLTAGE MONITOR • ■ ■ ■ ■ ■ ■ ■ Board Specifications 2-layer design 2 oz. copper power and ground PCB .062" thick PCB UL recognized 94V-0 PCB FR-4 or equivalent Ability to directly drive up to 12 LEDs bi-color or single color
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/-12V,
/-24V,
160mm
100mm
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SMD 8A TRANSISTOR
Abstract: AN735 MAX1710 MAX1711 MAX1712 MAX1846 MAX1847 MAX1864 MAX1865 MAX1917
Text: Maxim > App Notes > AUTOMOTIVE GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT POWER-SUPPLY CIRCUITS Keywords: printed circuit board, PCB layout, parasitic inductance, parasitic capacitance, EMI, DC-DC, dc dc, converters, convertors, ground plane, ground loop
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100MHz.
MAX1711:
MAX1712:
MAX1846:
MAX1847:
MAX1864:
MAX1865:
MAX1917:
MAX668:
SMD 8A TRANSISTOR
AN735
MAX1710
MAX1711
MAX1712
MAX1846
MAX1847
MAX1864
MAX1865
MAX1917
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Untitled
Abstract: No abstract text available
Text: Features and Benefits • 2 level “ground by design” contact system offers outstanding electrical performance while allowing for wider pad tolerances on PCB ■ Ground-signal-ground-signal format provides excellent signal integrity ■ For use in Rambus dual channel memory expansion card
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PS-74191-9999
97129UL
Contacts000
762mm
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Untitled
Abstract: No abstract text available
Text: Features and Benefits • 2 level “ground by design” contact system offers outstanding electrical performance while allowing for wider pad tolerances on PCB ■ Ground-signal-ground-signal format provides excellent signal integrity ■ For use in Rambus single channel memory expansion card
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PS-74191-9999
97129UL
762mm
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IC NAND GATE 7400 quad 3-in
Abstract: LINE67
Text: How do I connect power and ground to symbols? This topic describes how to connect custom power and ground symbols in board PCB schematics. The following topics are discussed: • Creating a power supply symbol with hidden power and ground · Hiding VCC and GND pins on a component or IC
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Untitled
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits • 4 integral PCB shield ground tabs assure positive ground without hardware ■ Covered PC leads allow close placement of other components ■ Preloaded contacts assure high normal force with low insertion force
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Hz--20
GHz--10
Q-105
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P1014
Abstract: backplane 3u
Text: J2, J3 DEVELOPMENT BACKPLANE FEATURES BOARD SPECIFICATIONS • All J2 B row power and ground pins connected per • 2-layer stripline design ANSI/VITA 1-1994 and IEEEP1014 specifications. • 2 oz. copper power and ground All other J2 pins user definable • PCB UL recognized 94V-O
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IEEEP1014
P1014
101PNGJ202
101PNGJ203
101PNGJ204
101PNGJ205
101PNGJ206
101PNGJ207
101PNGJ208
101PNGJ209
backplane 3u
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Untitled
Abstract: No abstract text available
Text: Features and Benefits Electrical Voltage: 30V RMS at 60 Hz outstanding electrical performance while allowing for wider Current: 1.75A pad tolerances on PCB Contact Resistance: 10mΩ max. Ground-signal-ground-signal format provides excellent Dielectric Withstanding Voltage: 400V AC
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PS-74191-9999
97129UL
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Untitled
Abstract: No abstract text available
Text: Features and Benefits Electrical Voltage: 30V RMS at 60 Hz outstanding electrical performance while allowing for wider Current: 1.75A pad tolerances on PCB Contact Resistance: 10 mΩ max. Ground-signal-ground-signal format provides excellent Dielectric Withstanding Voltage: 400V AC
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PS-74191-9999
97129UL
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Untitled
Abstract: No abstract text available
Text: Features and Benefits Electrical Voltage: 30V RMS at 60 Hz outstanding electrical performance while allowing for wider Current: 1.75A pad tolerances on PCB Contact Resistance: 10mΩ max. • Ground-signal-ground-signal format provides excellent Dielectric Withstanding Voltage: 400V AC
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PDF
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PS-74191-9999
97129UL
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Untitled
Abstract: No abstract text available
Text: J2, J3 DEVELOPMENT BACKPLANE FEATURES BOARD SPECIFICATIONS • All J2 B row power and ground pins connected per • 2-layer stripline design ANSI/VITA 1-1994 and IEEEP1014 specifications. • 2 oz. copper power and ground All other J2 pins user definable • PCB UL recognized 94V-O
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IEEEP1014
P1014
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XAPP689
Abstract: XAPP623 FF1152 XC2V6000
Text: Application Note: FPGAs R Managing Ground Bounce in Large FPGAs Author: Tony Duong XAPP689 v1.2 October 30, 2007 Summary Ground bounce must be controlled to ensure proper operation of high-performance FPGA devices. Particular attention must be applied to minimizing board-level inductance during PCB
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XAPP689
XAPP689
XAPP623
FF1152
XC2V6000
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PBP-06I
Abstract: No abstract text available
Text: PICMG Backplane PICMG General Description PBP-19P4 PBP-18D4 19-slot 4xPCI PICMG backplane 18-slot dual-system PICMG backplane 265.2 265.2 Support ATX type and 3.3V power connector 155.35 155.35 Frame rated PCB at 94-V0 10.16 10.16 4-layer PCB with ground and power
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PBP-19P4
PBP-18D4
19-slot
18-slot
94-V0
PBP-13R4
PBP-08P4
PBP-082V
PBP-06I
PBP-08I
PBP-06I
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Untitled
Abstract: No abstract text available
Text: RIGHT ANGLE GROUND PLANE SOCKET SPECIFICATIONS Board Mates: QRM8 -GP required Integral ground/power plane For complete specifications and recommended PCB layouts see www.samtec.com?QRF8-RA Insulator Material: Black LCP Contact Material: BeCu Ground Plane Material:
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Untitled
Abstract: No abstract text available
Text: RIGHT ANGLE GROUND PLANE HEADER SPECIFICATIONS Right Angle Integral metal plane for power or ground Board Mates: QSS For complete specifications and recommended PCB layouts see www.samtec.com?QTS-RA Selectively plated Insulator Material: Liquid Crystal Polymer
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Untitled
Abstract: No abstract text available
Text: RIGHT ANGLE GROUND PLANE HEADER SPECIFICATIONS Right angle Board Mates: QSH For complete specifications and recommended PCB layouts see www.samtec.com?QTH-RA Integral metal plane for power or ground Insulator Material: Black Liquid Crystal Polymer Terminal Material:
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Untitled
Abstract: No abstract text available
Text: STEWART CONNECTOR SYSTEMS INC. , R R 2, BOX 2020 GIEN BOCK, PENNSYLVANIA 17327 PART NO.: SS-668802S-A -FLS-A D 2 PORT PCB HARMONICA JACK PAC EMI-RFI ONE PIECE SHIELDED, ESD GROUNDED '- F I S ’ FLANGED *-A D " DESIGNATES TOP PANEL GROUND FORMED AT .120 [3.05] x 25\ NO BOTTOM PANEL GROUND,
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SS-668802S-A
CT660129A0
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Untitled
Abstract: No abstract text available
Text: 635m m HIE233SH 3 Materials: M a te s w ith : MIT • «fi >i Ü a intfh Discrete ground plane every 12, 70mm .500" li : Up to 266 signal leads Ground plane soldered to plated-through hole for added PCB retention Insulator Material: Liquid C iystal Polym er
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HIE233SH
1-800-SAM
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Untitled
Abstract: No abstract text available
Text: Catalog 1307612 AMP SDL Shielded Data Link Connectors Revised 7-01 Side Entry R eceptacles H A - Panel Ground and PCB Ground - .275 [6.99 f 6 ~~O • Material and Finish . A Contacts— Copper alloy, plated .000050 [0.00127] min, gold on mating area with tin-lead plated solder tails over
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Untitled
Abstract: No abstract text available
Text: F -21 1-1 Q sTRIP QSS-050-01 -L -D -R A-WT QSS-025-01 -L -D -R A 0,635mm .025" QSS-RA SERIES RIGHT ANGLE GROUND PLANE SOCKET Right Angle SPECIFICATIONS Board Mates: QTS Integral metal plane for power or ground For complete specifications and recommended PCB layouts see
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QSS-050-01
QSS-025-01
635mm)
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Untitled
Abstract: No abstract text available
Text: iamteo Q 5trip Q T E -0 1 4 -0 1 -L -D -A -R T 1 0,80mm .0315" Q T E - 0 6 0 -0 1 -L -D -A QTE SERIES HIGH SPEED GROUND PLANE HEADER Integral metal plane for power or ground SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com ?QTE
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408-395-59CO
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