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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: 635m m HIE233SH 3 Materials: M a te s w ith : MIT • «fi >i Ü a intfh Discrete ground plane every 12, 70mm .500" li : Up to 266 signal leads Ground plane soldered to plated-through hole for added PCB retention Insulator Material: Liquid C iystal Polym er	OCR Scan	PDF	HIE233SH 1-800-SAM

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: 635m m HIE233SH 3 Materials: M a te s w ith : MIT • «fi >i Ü a intfh Discrete ground plane every 12, 70mm .500" li : Up to 266 signal leads Ground plane soldered to plated-through hole for added PCB retention Insulator Material: Liquid C iystal Polym er

OCR Scan

PDF

HIE233SH 1-800-SAM