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    PBGA PACKAGE WEIGHT Search Results

    PBGA PACKAGE WEIGHT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PBGA PACKAGE WEIGHT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX

    designs

    Abstract: 90-FBGA W3H32M64E-XSBX White Electronic Designs
    Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX designs 90-FBGA White Electronic Designs

    CEE 32

    Abstract: W3H32M64E-XSBX
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch  Commercial, Industrial and Military Temperature


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX 32M64. CEE 32

    W3H128M72E-XSBX

    Abstract: No abstract text available
    Text: White Electronic Designs W3H128M72E-XSBX PRELIMINARY* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Package: „ CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H128M72E-XSBX A0-12 A0-13 W3H128M72E-XSBX

    W3H128M72

    Abstract: W3H128M72E-XSBX W3H128M72E
    Text: White Electronic Designs W3H128M72E-XSBX Advanced* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Package: „ CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H128M72E-XSBX W3H128M72 W3H128M72E-XSBX W3H128M72E

    8525a

    Abstract: No abstract text available
    Text: Version 1.3 2007 Features ƒ ƒ PEX 8525 General Features o 24-lane PCI Express switch - Integrated SerDes o Up to five configurable ports x1, x2, x4, x8, x16 o 23mm x 23mm, 484-ball PBGA package o 31mm x31mm, 644-ball PBGA package o Typical Power: 2.6 Watts


    Original     		PDF 24-lane, t9060 PEX8525-SIL-PB-P-1 8525a

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm


    Original     		PDF W3H64M72E-XSBX W3H64M72E-XSBX 3H64M72E-ESSB

    Untitled

    Abstract: No abstract text available
    Text: . Version 1.3 2007 Features ƒ PEX 8533 General Features o 32-lane PCI Express switch - Integrated SerDes o Up to six configurable ports o 23mm x 23mm, 484-ball PBGA package o 35mm x 35mm, 680-ball PBGA package o Pin Compatible with PEX 8532 o Typical Power: 3.3 Watts


    Original     		PDF 32-lane 484-ball 680-ball PEX8533-SIL-PB-P1-1

    W3H32M72E

    Abstract: fbga90
    Text: White Electronic Designs W3H32M72E-XSBX ADVANCED* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		PDF W3H32M72E-XSBX W3H32M72E fbga90

    PEX8547

    Abstract: No abstract text available
    Text: . Version 1.5 2007 Features ƒ PEX 8547 General Features o 48-lane PCI Express switch o Three configurable ports x1, x2, x4, x8, x16 o Integrated SerDes o 27mm x 27mm, 676-ball PBGA package o 37.5mm x 37.5mm, 736 ball PBGA package o Typical Power: 4.9 Watts


    Original     		PDF 48-lane 676-ball 110ns PEX8547-SIL-PB-P1-1 PEX8547

    Untitled

    Abstract: No abstract text available
    Text: Version 1.6 2007 Features ƒ ƒ PEX 8548 General Features o 48-lane PCI Express switch - Integrated SerDes o Up to nine configurable ports x1, x2, x4, x8, x16 o 27mmx27mm, 686-ball PBGA package o 37.5mm x 37.5mm, 736-ball PBGA package o Typical Power: 4.9 Watts


    Original     		PDF 48-lane, PEX8548-SIL-PB-P1-1

    Untitled

    Abstract: No abstract text available
    Text: Version 1.4 2007 Features ƒ ƒ PEX 8525 General Features o 24-lane PCI Express switch - Integrated SerDes o Up to five configurable ports x1, x2, x4, x8, x16 o 23mm x 23mm, 484-ball PBGA package o 31mm x31mm, 644-ball PBGA package o Typical Power: 2.6 Watts


    Original     		PDF 24-lane, t9060 PEX8525-SIL-PB-P-1

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB W3H64M72E-XSBXF SN63Pb37 SAC305 256MB"

    Untitled

    Abstract: No abstract text available
    Text: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  30% Space saving vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H64M72E-XSBX W3H64M72E-XSBXF 512MB 667Mbs 533Mbs 400Mbs

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4 or 5 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		PDF W3H64M72E-XSBX 667Mbs

    TCKAB

    Abstract: DNU-A13
    Text: White Electronic Designs W3H64M16E-XBX 64M x 16 DDR2 SDRAM 79 PBGA FEATURES  Data rate = 400 Mb/s  Organized as 64M x 16  Package:  Weight: W3H64M16E-XBX - TBD • 79 Plastic Ball Grid Array PBGA , 11 x 14mm BENEFITS • 1.27mm pitch  Supply Voltage = 1.8V


    Original     		PDF

    W3H64M72E-XSBX

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm


    Original     		PDF W3H64M72E-XSBX W3H64M72E-XSBX

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB with11,

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M16E-XBX *PRELIMINARY 64M x 16 DDR2 SDRAM 79 PBGA FEATURES „ Data rate = 667, 533, 400 Mb/s „ Organized as 64M x 16 „ Package: „ Weight: W3H64M16E-XBX - TBD • 79 Plastic Ball Grid Array PBGA , 11 x 14mm BENEFITS • 1.27mm pitch


    Original     		PDF

    DNU-A13

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M16E-XBX 64M x 16 DDR2 SDRAM 79 PBGA FEATURES  Data rate = 667, 533, 400 Mb/s  Organized as 64M x 16  Package:  Weight: W3H64M16E-XBX - TBD • 79 Plastic Ball Grid Array PBGA , 11 x 14mm BENEFITS • 1.27mm pitch


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB