PBGA JC THERMAL RESISTANCE Search Results

PBGA JC THERMAL RESISTANCE Result Highlights (5)

Part	Manufacturer	Description
PQU650M-F-COVER	Murata Manufacturing Co Ltd	PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical
TCTH011AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type
TCTH022AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function
TCTH021AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type
TCTH012BE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function

PBGA JC THERMAL RESISTANCE Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Theta-JC Abstract: theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007 Text: 9 The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external	Original	QL8X12B QL12X16B QL16X24B QL24X32B QL2005 QL2007 QL2009 QL2003 Theta-JC theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007	PDF
82546 Abstract: 82545GM 82545EM 82546EB 82546GB I1244 AP-458 Text: 82546 EB/GB Gigabit Ethernet Controller Thermal Properties with External Heat Sink Application Note AP-458 Revision Number: 0.5 December 2003 82546 EB/GB Gigabit Ethernet Controller Thermal Properties with External Heat Sink Application Note (AP-458) Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	AP-458) AP-458 82546 82545GM 82545EM 82546EB 82546GB I1244 AP-458	PDF
jc 540 Abstract: intel 540 PBGA jc thermal resistance Text: Thermal Data for the 540-Lead PBGA Package Application Note June 2000 Order Number: 273390-001 Thermal Data for the 540-Lead PBGA Package Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	540-Lead 540-Lead jc 540 intel 540 PBGA jc thermal resistance	PDF
transistor 1167-01 Abstract: No abstract text available Text: Freescale Semiconductor Technical Data Document Number: MPC603E7TEC Rev. 5, 09/2011 PowerPC 603e RISC Microprocessor Family: PID7t-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC family of reduced instruction set computing	Original	MPC603E7TEC PID7t-603e MPC603e. transistor 1167-01	PDF
JESD51-9 Abstract: QL5064 QL2003 QL2005 QL2007 QL2009 QL3012 QL3025 JESD 51-7, ambient measurement Eclipse II Family Text: QuickLogic Customer Specific Standard Products CSSPs — Package and Thermal Characteristics •••••• QuickLogic Application Note 62 Summary This document presents an overview of thermal packaging. It shows a simple method for calculating maximum	Original		PDF
Untitled Abstract: No abstract text available Text: CY7C1062G CY7C1062GE PRELIMINARY 16-Mbit 512 K words x 32 bits Static RAM with Error-Correcting Code (ECC) 16-Mbit (512 K words × 32 bits) Static RAM with Error-Correcting Code (ECC) Features • High speed ❐ tAA = 10 ns ■ Embedded error-correcting code (ECC) for single-bit error	Original	CY7C1062G CY7C1062GE 16-Mbit 119-ball	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:	Original	WEDPS512K32V-XBX 512Kx32 288mm2 512Kx32; 1Mx16	PDF
WEDPS512K32V-XBX Abstract: Theta JB bga thermal resistance max2014 Text: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:	Original	WEDPS512K32V-XBX 512Kx32 288mm2 512Kx32; 1Mx16 WEDPS512K32V-XBX Theta JB bga thermal resistance max2014	PDF
WEDPS512K32V-XBX Abstract: No abstract text available Text: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:	Original	WEDPS512K32V-XBX 512Kx32 288mm2 512Kx32; 1Mx16 WEDPS512K32V-XBX	PDF
D 602 Abstract: WEDPS512K32V-XBX Text: WEDPS512K32V-XBX White Electronic Designs 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES n Low Power CMOS n Access Times of 12, 15, 17, 20ns n TTL Compatible Inputs and Outputs n Fully Static Operation: n Packaging • 143 PBGA, 16mm x 18mm, 288mm 2 • No clock or refresh required.	Original	WEDPS512K32V-XBX 512Kx32 288mm 512Kx32; 1Mx16 2K32V-XBX D 602 WEDPS512K32V-XBX	PDF
Untitled Abstract: No abstract text available Text: WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Low Power Data Retention 'L' Option Access Times of 12, 15, 17, 20ns TTL Compatible Inputs and Outputs Packaging Fully Static Operation: 2 • 143 PBGA, 16mm x 18mm, 288mm	Original	WEDPS512K32V-XBX 512Kx32 288mm 512Kx32; 1Mx16	PDF
WEDPS512K32-XBX Abstract: No abstract text available Text: WEDPS512K32-XBX White Electronic Designs 512Kx32 SRAM MULTI-CHIP PACKAGE FEATURES n Commercial, Industrial and Military Temperature Ranges n Access Times of 12, 15, 17, 20, ns n TTL Compatible Inputs and Outputs n Packaging n 5 Volt Power Supply n Low Power CMOS	Original	WEDPS512K32-XBX 512Kx32 512Kx32, 1Mx16 25-55ns WEDPS512K32-XBX	PDF
FG676 Abstract: JESD-51 Text: Application Note AC220 Package Thermal Characteristics Introduction Managing heat in CMOS Logic devices is a growing issue for today's system designers. As densities increase and process geometries and form factors shrink, the amount of heat generated on these high-speed	Original	AC220 FG676 JESD-51	PDF
p 602 Abstract: WEDPS512K32-XBX bga thermal resistance Text: White Electronic Designs WEDPS512K32-XBX 512Kx32 SRAM MULTI-CHIP PACKAGE FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 12, 15, 17, 20, ns Packaging TTL Compatible Inputs and Outputs • 16mm x 18mm, 143 PBGA 5V Power Supply	Original	WEDPS512K32-XBX 512Kx32 512Kx32, 1Mx16 25-55ns p 602 WEDPS512K32-XBX bga thermal resistance	PDF

tag 8708 Abstract: No abstract text available Text: PC755/745 PowerPC 755/745 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz PC755 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745) 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)	Original	PC755/745 1SPECint95, SPECfp95 PC755) 7SPECint95, 9SPECfp95 PC745) 64-bit tag 8708	PDF
BGA 11x11 junction to board thermal resistance Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20 Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature	Original	320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20	PDF
CY7C1034DV33 Abstract: No abstract text available Text: CY7C1034DV33 6-Mbit 256K X 24 Static RAM Features Functional Description • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at f = 100 MHz The CY7C1034DV33 is a high performance CMOS static RAM organized as 256K words by 24 bits. This device has an	Original	CY7C1034DV33 CY7C1034DV33	PDF
Untitled Abstract: No abstract text available Text: CY7C1034DV33 6-Mbit 256K X 24 Static RAM Functional Description Features • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at f = 100 MHz ■ Low CMOS standby power ❐ ISB2 = 25 mA The CY7C1034DV33 is a high performance CMOS static RAM	Original	CY7C1034DV33 CY7C1034DV33	PDF
Untitled Abstract: No abstract text available Text: CY7C1024DV33 3-Mbit 128 K x 24 Static RAM Functional Description Features • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at f = 100 MHz ■ Low CMOS standby power ❐ ISB2 = 25 mA The CY7C1024DV33 is a high performance CMOS static RAM	Original	CY7C1024DV33 CY7C1024DV33	PDF
Untitled Abstract: No abstract text available Text: CY7C1024DV33 3-Mbit 128 K x 24 Static RAM Features Functional Description • High speed ❐ tAA = 10 ns The CY7C1024DV33 is a high performance CMOS static RAM organized as 128K words by 24 bits. This device has an automatic power down feature that significantly reduces power	Original	CY7C1024DV33 CY7C1024DV33 I/O23)	PDF
CY7C1024DV33 Abstract: No abstract text available Text: CY7C1024DV33 3-Mbit 128 K x 24 Static RAM Features Functional Description • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at f = 100 MHz The CY7C1024DV33 is a high performance CMOS static RAM organized as 128 K words by 24 bits. This device has an	Original	CY7C1024DV33 CY7C1024DV33	PDF
CY7C1034DV33 Abstract: No abstract text available Text: CY7C1034DV33 6-Mbit 256K X 24 Static RAM Features Functional Description • High speed ❐ tAA = 10 ns ■ Low active power ❐ ICC = 175 mA at 10 ns ■ Low CMOS standby power ❐ ISB2 = 25 mA The CY7C1034DV33 is a high performance CMOS static RAM organized as 256K words by 24 bits. This device has an	Original	CY7C1034DV33 CY7C1034DV33	PDF
Untitled Abstract: No abstract text available Text: MOTOROLA Order this document by MCM69P819/D SEMICONDUCTOR TECHNICAL DATA MCM69P819 Product Preview 256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM The M C M 6 9P 8 19 is a 4 M bit syn ch ro n o u s fa st static RAM d e sig ned to provide a burstable, high pe rform ance, se co n d a ry cach e for the PowerPC™ and oth er	OCR Scan	MCM69P819/D MCM69P819 MCM69P819	PDF
Untitled Abstract: No abstract text available Text: MOTOROLA Order this docum ent by MCM69P819/D SEMICONDUCTOR TECHNICAL DATA MCM69P819 Product Preview 256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM The MCM69P819 is a 4M bit synchronous fast static RAM designed to provide a burstable, high performance, secondary cache for the PowerPC™ and other high	OCR Scan	MCM69P819/D MCM69P819	PDF

PBGA JC THERMAL RESISTANCE Search Results

PBGA JC THERMAL RESISTANCE Result Highlights (5)

PBGA JC THERMAL RESISTANCE Datasheets Context Search

Theta-JC

82546

jc 540

transistor 1167-01

JESD51-9

Untitled

Untitled

WEDPS512K32V-XBX

WEDPS512K32V-XBX

D 602

Untitled

WEDPS512K32-XBX

FG676

p 602

tag 8708

BGA 11x11 junction to board thermal resistance

CY7C1034DV33

Untitled

Untitled

Untitled

CY7C1024DV33

CY7C1034DV33

Untitled

Untitled