8525a
Abstract: No abstract text available
Text: Version 1.3 2007 Features PEX 8525 General Features o 24-lane PCI Express switch - Integrated SerDes o Up to five configurable ports x1, x2, x4, x8, x16 o 23mm x 23mm, 484-ball PBGA package o 31mm x31mm, 644-ball PBGA package o Typical Power: 2.6 Watts
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24-lane,
t9060
PEX8525-SIL-PB-P-1
8525a
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PDF
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Untitled
Abstract: No abstract text available
Text: . Version 1.3 2007 Features PEX 8533 General Features o 32-lane PCI Express switch - Integrated SerDes o Up to six configurable ports o 23mm x 23mm, 484-ball PBGA package o 35mm x 35mm, 680-ball PBGA package o Pin Compatible with PEX 8532 o Typical Power: 3.3 Watts
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32-lane
484-ball
680-ball
PEX8533-SIL-PB-P1-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Version 1.4 2007 Features PEX 8525 General Features o 24-lane PCI Express switch - Integrated SerDes o Up to five configurable ports x1, x2, x4, x8, x16 o 23mm x 23mm, 484-ball PBGA package o 31mm x31mm, 644-ball PBGA package o Typical Power: 2.6 Watts
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Original
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24-lane,
t9060
PEX8525-SIL-PB-P-1
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PDF
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Untitled
Abstract: No abstract text available
Text: . Version 1.4 2007 Features PEX 8533 General Features o 32-lane PCI Express switch - Integrated SerDes o Up to six configurable ports o 23mm x 23mm, 484-ball PBGA package o 35mm x 35mm, 680-ball PBGA package o Pin Compatible with PEX 8532 o Typical Power: 3.3 Watts
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32-lane
484-ball
680-ball
PEX8533-SIL-PB-P1-1
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PDF
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208z
Abstract: SSZA002 Texas Instruments Philippines PBGA 23X23 0.8 pitch tray 23X23 376ZDW high current pogo pin shape 23x23 tray 27X27
Text: Application Report SSZA002 – August 2009 Plastic Ball Grid Array PBGA . SSZA002 – August 2009 Submit Documentation Feedback
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SSZA002
208z
SSZA002
Texas Instruments Philippines
PBGA 23X23 0.8 pitch
tray 23X23
376ZDW
high current pogo pin shape
23x23 tray
27X27
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PDF
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8512E
Abstract: 8512 embedded controller PBGA 376 PEX8512-AC25BI Board-422
Text: Version 1.3 2009 Features PEX 8512 General Features o 12-lane PCI Express switch - Integrated SerDes o Up to five ports o 23mm x 23mm, 376-ball PBGA package o Typical Power: 2.0 Watts PEX 8512 Key Features o Standards Compliant - PCI Express Base Specification, r1.1
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Original
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12-lane
376-ball
150ns
PEX8512-SIL-PB-
8512E
8512 embedded controller
PBGA 376
PEX8512-AC25BI
Board-422
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PDF
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pcb warpage in ipc standard
Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387
Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.
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PEX8518-AB25BI
Abstract: PBGA 376 PEX8518 pci non-transparent bridge
Text: Version 1.5 2007 Features PEX 8518 General Features o 16-lane PCI Express switch - Integrated SerDes o Up to five configurable ports o 23mm x 23mm, 376-ball PBGA package o Typical Power: 2.6 Watts PEX 8518 Key Features o Standards Compliant - PCI Express Base Specification, r1.1
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Original
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16-lane
376-ball
150ns
PEX8518-SIL-PB-
PEX8518-AB25BI
PBGA 376
PEX8518
pci non-transparent bridge
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PDF
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PEX8518-AC25BIG
Abstract: 8518RDK PBGA 376 PEX8518-AC25BI
Text: Version 1.6 2007 Features PEX 8518 General Features o 16-lane PCI Express switch - Integrated SerDes o Up to five configurable ports o 23mm x 23mm, 376-ball PBGA package o Typical Power: 2.6 Watts PEX 8518 Key Features o Standards Compliant - PCI Express Base Specification, r1.1
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Original
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16-lane
376-ball
150ns
PEX8518-SIL-PB-
PEX8518-AC25BIG
8518RDK
PBGA 376
PEX8518-AC25BI
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PDF
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IT 8518
Abstract: PEX8518-SIL-PB-P1-1 A/ITE 8518
Text: Version 1.2 2006 PEX 8518 Features PEX 8518 General Features o 16-lane PCI Express switch - Integrated SerDes o Up to five configurable ports o 23mmx23mm, 376-ball PBGA package o Maximum Power: 3.53 Watts PEX 8518 Key Features o Standards Compliant - PCI Express Base Specification, r1.1
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Original
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16-lane
23mmx23mm,
376-ball
PEX8518-SIL-PB-P1-1
IT 8518
A/ITE 8518
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PDF
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8512
Abstract: PBGA 376 MSI MOTHERBOARD SERVICE MANUAL PEX8512-AC25BI pcie X1 edge connector
Text: Version 1.2 2007 Features PEX 8512 General Features o 12-lane PCI Express switch - Integrated SerDes o Up to five ports o 23mm x 23mm, 376-ball PBGA package o Typical Power: 2.0 Watts PEX 8512 Key Features o Standards Compliant - PCI Express Base Specification, r1.1
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Original
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12-lane
376-ball
150ns
PEX8512-SIL-PB-
8512
PBGA 376
MSI MOTHERBOARD SERVICE MANUAL
PEX8512-AC25BI
pcie X1 edge connector
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PDF
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SAC405
Abstract: IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station
Text: Introduction to the Plastic Ball Grid Array PBGA Q1, Burnette 2008 Terry Dec. 15, 2005 TM Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc in the US and other countries. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent
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countrieESD51
JESD5112,
SAC405
IPC-9702
IPC-9701A
PBGA 23X23 0.8 pitch
ipc 610D
ipc 9702
JEDEC JESD51-8 BGA
bga thermal cycling reliability
fine BGA thermal profile
Service Manual smd rework station
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PDF
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BGA 23X23
Abstract: 324PBGA 324 PBGA 23x23 22X22 23X23 PBGA 23X23 Solder Balls
Text: 324 PBGA / TEPBGA Wire Bond Daisy Chain Test Board and Package Traces: Looking Through Package and at Test Board Perimeter Balls 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 A B C D E Common F G H J K L M N P Thermal Balls R T U V W Y AA AB Slide 1
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22x22
23x23
Defined24
BGA 23X23
324PBGA
324 PBGA 23x23
PBGA 23X23
Solder Balls
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PDF
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NET2272REV1A-LF
Abstract: pex8311 edge connector 8114BA 8524BB Rapid Development Kit PEX8311-AA66BC PEX8114BA PEX8114-AA13BI 8114s
Text: Issue No. 29 PEX 8114 Key Features Application: ♦ Transparent and NonTransparent Modes ♦ Forward and Reverse Modes ♦ Low Power Consumption 2W ♦ Small Footprint 17 x 17 mm BGA Package ♦ Lead Free Available ♦ Supports PCI and PCI-X 33MHz thru 133MHz
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33MHz
133MHz
9056-BA66BI
9054-AC
NET2272REV1A-LF;
NET2272REV1A-LF
pex8311
edge connector
8114BA
8524BB
Rapid Development Kit
PEX8311-AA66BC
PEX8114BA
PEX8114-AA13BI
8114s
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PDF
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|
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QFN-88
Abstract: 88 qfn CX6212 CHIPX DDR PHY ASIC 1602 LCD data sheet CX6214 cx6220 pbga 288 0.13um standard cell library
Text: Data Sheet CX6200 Structured ASIC with USB 2.0 HS OTG PHY Product Description The CX6200 product family combines a built-in, silicon-proven, industry standard PHY for USB 2.0 High Speed HS On-the-Go (OTG) with the well-proven X-Cell architecture, to provide industry leading performance using the UMC standard eight-metal 0.13-µm deep
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CX6200
CX6200
CX6000
1-800-95-CHIPX
0210-6K-080-E
QFN-88
88 qfn
CX6212
CHIPX
DDR PHY ASIC
1602 LCD data sheet
CX6214
cx6220
pbga 288
0.13um standard cell library
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PDF
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QT2225
Abstract: qt2025 s4886 S10124 G.975.1 QT2225-1 S4882 S4884 QT2025-1 S19262
Text: Transport Products Product Selector Guide Table of Contents Physical Layer Devices Framer/Mappers Datacom PHY S19225
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S19225
VOLTA-192.
QT2022/QT2032.
S19227
RUBICON-LH/S19262
QT2025.
S19231
QT2025-1.
S19258
QT2225.
QT2225
qt2025
s4886
S10124
G.975.1
QT2225-1
S4882
S4884
QT2025-1
S19262
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PDF
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21111-BRF-001-D
Abstract: crosspoint M21121 M21111 PBGA 23X23 17X17 Equalizer chart express card DVB MINDSPEED pcb layout mindspeed
Text: > Product Overview M21111 3.2 Gbps 17x17 and M21121 3.2 Gbps 34x34 Crosspoint Switch The M21111/21, designed for today’s demanding video, telecom and datacom switching applications are low-power, high-speed crosspoint switches with input equalization and integrated pattern generator/checker. With all channels
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M21111
17x17
M21121
34x34
M21111/21,
M21111-BRF-001-D
21111-BRF-001-D
crosspoint
PBGA 23X23
Equalizer chart
express card DVB
MINDSPEED
pcb layout mindspeed
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PDF
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M21121
Abstract: M21111 phase sequence checker for 3 phase supply MINDSPEED m21111
Text: > Product Overview M21111 3.2 Gbps 17x17 and M21121 3.2 Gbps 34x34 Crosspoint Switch The M21111/21, designed for today’s demanding video, telecom and datacom switching applications are low-power, high-speed crosspoint switches with input equalization and integrated pattern generator/checker. With all channels
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M21111
17x17
M21121
34x34
M21111/21,
M21111-BRF-001-C
phase sequence checker for 3 phase supply
MINDSPEED m21111
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PDF
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STV0289
Abstract: sti5189 analog satellite tuner stv0289 ST40-300 STV0289 date code PBGA 23X23 0.8 pitch jtag st dvb-s transmitter design MPX audio ENCODER TUNER transport stream
Text: STi5189 Low-cost QPSK demodulator and MPEG2 decoder for set-top box applications Data Brief Features • Extensive connectivity USB 2.0 host/ULPI, Ethernet MAC MII/RMII, MPX, DVB-CI ■ External memory interface supporting NOR, NAND and serial Flash ■
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STi5189
STV0289
sti5189
analog satellite tuner stv0289
ST40-300
STV0289 date code
PBGA 23X23 0.8 pitch
jtag st
dvb-s transmitter design
MPX audio ENCODER
TUNER transport stream
|
PDF
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BGA PROFILING
Abstract: MPC852T 62Sn-36Pb-2Ag 4/5/32R2024/25/62Sn-36Pb-2Ag
Text: Motorola PowerQUICC MPC852T Pb-Free Packaging Information Motorola Semiconductor Motorola SPS, NCSD - Q1 2003 – Rev. 1 - Page 1 Motorola General Business Information MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other
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Original
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MPC852T
23x23
16x16
BGA PROFILING
62Sn-36Pb-2Ag
4/5/32R2024/25/62Sn-36Pb-2Ag
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PDF
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fcBGA PACKAGE thermal resistance
Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America
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PDF
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1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
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PDF
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XPC823ZT50
Abstract: MPC823 user manual MPC823 PB28 PC14 127mm
Text: SECTION 23 MECHANICAL DATA AND ORDERING INFORMATION 23.1 ORDERING INFORMATION PACKAGE TYPE FREQUENCY MHz TEMPERATURE ORDER NUMBER 256-Lead Plastic Ball Grid Array with 1.27mm Ball Pitch 25 50 25 0°C to 70°C 0°C to 70°C -45°C to -85°C XPC823ZT25 XPC823ZT50
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256-Lead
XPC823ZT25
XPC823ZT50
XPC823CZT25
XPC823ZC25
XPC823ZC50
XPC823CZC25
MPC823
XPC823ZT50
MPC823 user manual
PB28
PC14
127mm
|
PDF
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ms-029
Abstract: FBGA1152
Text: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)
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PDF
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