56mm carrier tape
Abstract: 28 pin ic TM 1628
Text: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03
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56mm carrier tape
28 pin ic TM 1628
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WNF008
Abstract: code res pack 8 SO3016 UNE008 spansion tray
Text: Chapter 10 Packing Methods and Labels CHAPTER 10 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Box Labeling Packages and Packing Methodologies Handbook 1 March 2008 10-1 Chapter 10 Packing Methods and Labels
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fee 210
Abstract: FBC048
Text: Chapter 4 Summary of Packing Quantities CHAPTER 4 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Methodologies Handbook 17 Oct 2008 4-1 Chapter 4 Summary of Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package ball/lead count. The data is sorted
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Ree10
fee 210
FBC048
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poly aluminum chloride
Abstract: rubidium radioactive
Text: Chapter 11 Chemical Content of Product Carriers and Packing Materials CHAPTER 11 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Recyclability of Packing Materials and Product Carriers Summary of Hazardous Chemicals Not Present in Packing Materials
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IC 50061
Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing
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CCGA
Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:
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JEDEC J-STD-033
Abstract: J-STD-033 MIL-I-18835 JSTD-033 ASTM 1249 MIL-PRF-81705D molecular sieve F-1249 D-3464 D-3464D
Text: Chapter 9 Dry Packing CHAPTER 9 DRY PACKING Introduction Testing for Moisture Sensitivity Dry Packing Process and Materials Handling Dry Packed Products Storing Dry Packed Products Packages and Packing Methodologies Handbook 1 March 2008 9-1 Chapter 9 Dry Packing
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K660
Abstract: material content amd AMD chemical content 9002-86-2
Text: u Chapter 14 Chemical Content of Product Carriers and Packing Materials CHAPTER 14 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Tray Recycling Program Recyclability of Packing Materials and Product Carriers
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a1770
Abstract: EVD30 a3x2g7 E41871 B66298 corrugated B66298V1012T1 250 B 340 smd Transistor u cores Wound Toroids Coil
Text: Ferrites and accessories Packing Date: September 2006 Data Sheet EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited. Packing Packing Survey of packing modes
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FAL0697-T
FAL0677-E
a1770
EVD30
a3x2g7
E41871
B66298
corrugated
B66298V1012T1
250 B 340 smd Transistor
u cores
Wound Toroids Coil
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B 315 D
Abstract: SOT89 pq SOT494 SOD89 SOT233 SOT89 Package pq TRANSISTOR SMD CODE PACKAGE SOT89 TRANSISTOR SMD CODE PACKAGE SOT89 4 250 B 340 smd Transistor msc377
Text: CHAPTER 6 PACKING METHODS page Introduction 6-2 Glossary of terms 6-2 Packing methods in exploded view 6-3 Packing quantities, box dimensions and carrier shapes 6 - 13 Philips Semiconductors Discrete Semiconductor Packages Packing Methods Chapter 6 INTRODUCTION
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OT195
OT223
MSC078
B 315 D
SOT89 pq
SOT494
SOD89
SOT233
SOT89 Package pq
TRANSISTOR SMD CODE PACKAGE SOT89
TRANSISTOR SMD CODE PACKAGE SOT89 4
250 B 340 smd Transistor
msc377
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EPX10
Abstract: corrugated cardboard EPCOS LABEL
Text: Packing Packing Survey of packing modes Ferrites Type Packing Para. RM cores RM 4 to RM 10 RM 12, RM 14 Blister tapes Standard trays 3.2 2.2.1 170 168 PM cores PM 50/39 to PM 114/93 Standard trays 2.2.1 168 P cores all P cores P 9 x 5 to P 22 × 13 Standard trays
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JEDEC J-STD-033A
Abstract: AMD Package moisture LBA399 F-1249 J-STD-033A J-STD-020B J-STD-033 ASTM 1249 MIL-PRF-81705D MIL-I-18835
Text: u Chapter 12 Dry Packing CHAPTER 12 DRY PACKING Introduction Testing for Moisture Sensitivity Dry Packing Process and Materials Handling Dry Packed Products Storing Dry Packed Products AMD’s Moisture Sensitive Products by Package Type Packages and Packing Publication
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ATMEL 234
Abstract: ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC
Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer's needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three
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10/98/xM
ATMEL 234
ATMEL Packing Methods and Quantities
ATMEL 210
atmel tape and reel
ATMEL shipping label
ATMEL Tape and Reel code
ATMEL SOIC tape and reel
ATMEL JEDEC SOIC
atmel tape and reel JEDEC SOIC
ATMEL Packing information JEDEC SOIC
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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1895 ic
Abstract: tfp 370 TFP-32D 2620D 40DA IC 404
Text: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed
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TTP-48D
CP-32D
CP-32DB
CP-40D
CP-40DA
CP-42D
CP-44D
TTP-28/24D
TTP-28D
TTP-28DA
1895 ic
tfp 370
TFP-32D
2620D
40DA
IC 404
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tqfp 10x10 tray
Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.
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antistatic epe foam
Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
Text: The Operation Instruction of Packing Materials PURPOSE Warehouse and Subcontractors according to the instruction for purchaseing and incoming inspection, formulate the Operation Instruction of Packing Materials. SCOPE Related all packing materials in warehouse.
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200mm
150mm
118MIL
150MIL
300MIL
antistatic epe foam
mark JS sot-25
V7100
sot89 MARK JB
150MIL
300MIL
600MIL
SOT-25 JB
QFP Shipping Trays
TTO-220
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MD300-10A
Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
MD300-10A
QFN tray
tray datasheet bga
SIP 400B
TSOP TRAY 40 PIN
BGA package tray 64
NEC A39A 240
TSOP package tray
6-tsop
TRAY DIMENSIONS 132 PGA
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tsop tray matrix outline
Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also
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JEDEC Matrix Tray outlines
Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also
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EIA-481-x,
JEDEC Matrix Tray outlines
ATMEL EIA-481-x Packing
JEDEC tray standard for PLCC
ATMEL Packing Methods and Quantities
EIA-481-x
JEDEC TRAY PLCC
ATMEL Tape and Reel
tsop Shipping Trays
JEDEC tray standard 13
ATMEL shipping label
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SIMM 72
Abstract: No abstract text available
Text: SIEMENS Packing Information Packing Information DRAM Modules Type Packing Modules per Box 72 pin SIMM Boxes with Trays 80 72 pin Small Outline DIMM Boxes with Trays 80 168 pin DIMM Boxes with Trays 40 Semiconductor Group 25
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tfp 370
Abstract: No abstract text available
Text: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed
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TFP-32D
TFP-32DR
TTP-32D
TTP-32DR
TTP-32DB
TTP-50/44DC
TTP-50D
TTP-50DA
TTP-28/24D
TTP-28D
tfp 370
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IC 404
Abstract: No abstract text available
Text: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed
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TFP-32D
TFP-32DR
TTP-32D
TTP-32DR
TTP-32DB
TTP-50/44DC
TTP-50D
TTP-50DA
TTP-28/24D
TTP-28D
IC 404
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Untitled
Abstract: No abstract text available
Text: Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed
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