Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    PACKAGE ENF Search Results

    PACKAGE ENF Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE ENF Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ADV0115

    Abstract: improves EP20K200E EP20K300E
    Text: CUSTOMER ADVISORY ADV0115 EP20K200E and EP20K300E 652-Ball BGA Package Improvement Change Description: The EP20K200E and EP20K300E 652-Ball BGA packages will be re-enforced with a stiffener added to the top of the package. Reason For Change: This change improves EP20K200E and EP20K300E 652-Ball BGA package coplanarity


    Original     		PDF ADV0115 EP20K200E EP20K300E 652-Ball ADV0115 improves

    H.264 encoder cortex a8

    Abstract: ARM Cortex A9 samsung IMX51AEC "ARM Cortex A8" mjpeg sony image sensor 720p nf184 bt.656 CSI IMX51* application note sd card MC13892 registers
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX51AEC Rev. 1, 11/2009 IMX51A Package Information Plastic Package Case 2017 19 x 19 mm, 0.8 mm pitch i.MX51A Automotive and Infotainment Applications Processors Ordering Information


    Original     		PDF IMX51AEC IMX51A MX51A MCIMX51A MX51A) H.264 encoder cortex a8 ARM Cortex A9 samsung IMX51AEC "ARM Cortex A8" mjpeg sony image sensor 720p nf184 bt.656 CSI IMX51* application note sd card MC13892 registers

    SONY VTR M15 DIAGRAM

    Abstract: SAHA Freescale i.MX53 Quick Start Board "eMMC" Thermal Impedance sahara lcd monitor circuit diagram free samsung lpddr2 imx53 MCIMX537CVV8C emmc operation ver 4.41 samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53IEC Rev. 4, 11/2011 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


    Original     		PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 SONY VTR M15 DIAGRAM SAHA Freescale i.MX53 Quick Start Board "eMMC" Thermal Impedance sahara lcd monitor circuit diagram free samsung lpddr2 imx53 MCIMX537CVV8C emmc operation ver 4.41 samsung eMMC 4.5

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53IEC Rev. 4, 11/2011 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


    Original     		PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800

    HMI 14 PIN CONNECTOR CONFIGURATION

    Abstract: emmc jedec mechanical standard emmc bga 162 "thermal switch" t175
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 2, 5/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


    Original     		PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p HMI 14 PIN CONNECTOR CONFIGURATION emmc jedec mechanical standard emmc bga 162 "thermal switch" t175

    Freescale i.MX53 Quick Start Board

    Abstract: emmc 4.4 standard jedec bt.656 CSI 3D Accelerator emmc spec emmc 4.5 spec bga 529
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53IEC Rev. 2, 5/2011 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


    Original     		PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 Freescale i.MX53 Quick Start Board emmc 4.4 standard jedec bt.656 CSI 3D Accelerator emmc spec emmc 4.5 spec bga 529

    SSD1502G32

    Abstract: SSD1502 cyberdisplay VGA kopin KCD-A900-QA-TP KCD-A900-QA cyberdisplay kopin vga SSD1502QT4 color space look-up table mapping
    Text: SSD1502 Display Driver for The CyberDisplay VGA Color Display Part Numbers: KCD-A900-QA TQFP80 package KCD-A900-QA-TP (BGA80 package) Ver. 0.1 August 14, 2006 KOPIN TABLE OF CONTENTS 1 GENERAL DESCRIPTION. 5


    Original     		PDF SSD1502 KCD-A900-QA TQFP80 KCD-A900-QA-TP BGA80 SSD1502 KCD-A900-QA SSD1502G32 cyberdisplay VGA kopin KCD-A900-QA-TP cyberdisplay kopin vga SSD1502QT4 color space look-up table mapping

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 4, 11/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


    Original     		PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p

    samsung EMMC user guide

    Abstract: Jedec lpddr2 samsung lpddr2 Mobile RAM samsung eMMC 4.5 MX53UG n78c AMBA AXI dma controller designer user guide lpddr2 layout SONY VTR M15 DIAGRAM DDR3 jedec
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 4, 11/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


    Original     		PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p samsung EMMC user guide Jedec lpddr2 samsung lpddr2 Mobile RAM samsung eMMC 4.5 MX53UG n78c AMBA AXI dma controller designer user guide lpddr2 layout SONY VTR M15 DIAGRAM DDR3 jedec

    Samsung eMMC 4.41

    Abstract: LPDDR2 SDRAM samsung i.MX53 USB_OTG emmc spec samsung samsung EMMC user guide samsung lpddr2 eMMC 4.4 Jedec lpddr2 sahara lcd monitor circuit diagram free
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 3, 7/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


    Original     		PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p Samsung eMMC 4.41 LPDDR2 SDRAM samsung i.MX53 USB_OTG emmc spec samsung samsung EMMC user guide samsung lpddr2 eMMC 4.4 Jedec lpddr2 sahara lcd monitor circuit diagram free

    axi interface ddr3 memory controller

    Abstract: sd 3.0 emmc 4.4 BT.1120 xtalosc emmc bga 162
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53IEC Rev. 3, 7/2011 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


    Original     		PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 axi interface ddr3 memory controller sd 3.0 emmc 4.4 BT.1120 xtalosc emmc bga 162

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    iMX536

    Abstract: sahara lcd monitor circuit diagram free us10 sd diode samsung lpddr2 Mobile RAM Automotive Telematics On-board unit Platform emmc jedec mechanical standard Samsung board Board design guide eMMC emmc 4.5 spec samsung sony bullet camera sd 3.0 emmc 4.4
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 5, 12/2012 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1


    Original     		PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p iMX536 sahara lcd monitor circuit diagram free us10 sd diode samsung lpddr2 Mobile RAM Automotive Telematics On-board unit Platform emmc jedec mechanical standard Samsung board Board design guide eMMC emmc 4.5 spec samsung sony bullet camera sd 3.0 emmc 4.4

    emmc 5.0

    Abstract: iMX536 IC_USB voltage class "ARM Cortex A8" samsung ddr2 nand ESDHC MCIMX THERMAL Fuse m20 tf 115 c lpddr2 layout 15 TFT 20 pin lvds
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 6, 03/2013 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1


    Original     		PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p emmc 5.0 iMX536 IC_USB voltage class "ARM Cortex A8" samsung ddr2 nand ESDHC MCIMX THERMAL Fuse m20 tf 115 c lpddr2 layout 15 TFT 20 pin lvds

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    SZZA003

    Abstract: thermal resistance of low power semiconductor
    Text: Package Thermal Characterization Methodologies Application Report 1999 Printed in U.S.A 0399 SZZA003 Package Thermal Characterization Methodologies SZZA003 March 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products


    Original     		PDF SZZA003 MIL-STD-883 SCAA022A SZZA003 thermal resistance of low power semiconductor

    samsung eMMC 4.5

    Abstract: schema tv sony USB_OTG i.mx53 emmc spec samsung SAHA Camera Module CSI2 samsung EMMC user guide DDR3 jedec imx53
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53IEC Rev. 5, 12/2012 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1 Ordering Information


    Original     		PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 samsung eMMC 4.5 schema tv sony USB_OTG i.mx53 emmc spec samsung SAHA Camera Module CSI2 samsung EMMC user guide DDR3 jedec imx53

    ARM Cortex A8 Neon SIMD

    Abstract: IMX51 sd card MCIMX515DVK8C IMX51CEC ARM cortex A9 neon SIMD IMX51 ARM Cortex A9 samsung IMX51AEC bt.656 CSI free ba 4918
    Text: Freescale Semiconductor Data Sheet: Advance Information IMX51 Package Information Plastic Package Case 2058 13 x 13 mm, 0.5 mm pitch Case 2017 19 x 19 mm, 0.8 mm pitch i.MX51 Applications Processors for Consumer and Industrial Products Ordering Information


    Original     		PDF IMX51 MCIMX512DVK8C, MCIMX513DVK8C, MCIMX515DVK8C, MCIMX511DVK8C. ARM Cortex A8 Neon SIMD IMX51 sd card MCIMX515DVK8C IMX51CEC ARM cortex A9 neon SIMD IMX51 ARM Cortex A9 samsung IMX51AEC bt.656 CSI free ba 4918

    samsung EMMC user guide

    Abstract: eMMC 4.4 Jedec lpddr2 emmc 4.4 standard jedec ARM cortex A9 neon SIMD imx53 Freescale i.MX53 Quick Start Board H.264 encoder cortex a8 schema tv sony SAMSUNG NAND FLASH TRANSLATION LAYER SOFTWARE
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53IEC Rev. 6, 03/2013 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1 Ordering Information


    Original     		PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 samsung EMMC user guide eMMC 4.4 Jedec lpddr2 emmc 4.4 standard jedec ARM cortex A9 neon SIMD imx53 Freescale i.MX53 Quick Start Board H.264 encoder cortex a8 schema tv sony SAMSUNG NAND FLASH TRANSLATION LAYER SOFTWARE

    MCIMX51RM

    Abstract: W12V10 tk 1838 ir ARM Cortex A8 IMX51CEC IR Sensor TK 1838
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX51CEC Rev. 4, 08/2010 i.MX51 Applications Processors for Consumer and Industrial Products Package Information Plastic Package Case 2058 13 x 13 mm, 0.5 mm pitch Case 2017 19 x 19 mm, 0.8 mm pitch


    Original     		PDF IMX51CEC IMX51 MCIMX515DVK8C. MCIMX51RM W12V10 tk 1838 ir ARM Cortex A8 IR Sensor TK 1838

    MAX1074

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX51CEC Rev. 3, 06/2010 i.MX51 Applications Processors for Consumer and Industrial Products Package Information Plastic Package Case 2058 13 x 13 mm, 0.5 mm pitch Case 2017 19 x 19 mm, 0.8 mm pitch


    Original     		PDF IMX51CEC IMX51 MCIMX515DVK8C. MAX1074

    Untitled

    Abstract: No abstract text available
    Text: Freescale 2013 Summary Plan Description Freescale Benefits: Health, Wellness, Life, Savings and More U.S. Active, Expatriate and Assignee Benefits Effective January 1, 2013 Introduction A Rewards Package to Fit Your Lifestyle Welcome to Freescale Rewards, a competitive benefits package that enhances your


    Original     		PDF many942-8226 11BCPA000145 888-FSL-BENS)

    27c040-10

    Abstract: 27C040-12 1S84 8332 memory 27C040-15 SMJ27C040
    Text: SMJ27C040 4194304-BIT UV ERASABLE PROGRAMMABLE READ-ONLY MEMORY SGMS046A- NOVEMBER 1992 - REVISED JUNE 1995 J PACKAGE Organization . . . 512K x 8 Single 5-V Power Supply Industry Standard 32-Pin Dual-in-line Package All inputs/Outputs Fully TTL Compatible


    OCR Scan     		PDF SMJ27C040 4194304-BIT SGMS046A- 32-Pin 27C040-10 27C040-12 27C040-15 400-mV SMJ27C040 1S84 8332 memory