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    PACKAGE ELECTRICAL DATA Search Results

    PACKAGE ELECTRICAL DATA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE ELECTRICAL DATA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SIGNETICS

    Abstract: 10X10MM TQFN 72-QFN
    Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFN Sawn Signetics TQFN, WQFN, and UQFN The Signetics QFN package is a low cost, lead frame packaging solution that offers excellent thermal and electrical performance with minimal costs. Electrical performance


    Original     		PDF 10x10MM C/-65 C/100% 15PSIG, 168hrs SIGNETICS 10X10MM TQFN 72-QFN

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100

    Untitled

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    EIA-556-A

    Abstract: xilinx packaging label polystyrene EIA-556A
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 equipmQ100 TQ144 VQ100 EIA-556-A xilinx packaging label polystyrene EIA-556A

    ipc-sm-786A

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 J-STD-020 ipc-sm-786A

    EFTEC-64

    Abstract: OPQ0014
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 HQ160 HQ208 HQ240 HQ304 MO-108DDI OPQ0021 143-FA OPQ0020 MO-143-GA EFTEC-64 OPQ0014

    reflow soldering profile BGA

    Abstract: FC-5312
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 FC5312 reflow soldering profile BGA FC-5312

    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    LS 2027

    Abstract: ic LM 356 equivalent 811 0305 01 LM 2545 ic LM 356
    Text: Package Electrical Characterization National Semiconductor maintains a package group which specializes in the electrical characterization of IC packages. This group has access to a complete measurement lab consisting of network analyzers, TDR’s time domain reflection ,


    Original     		PDF SUNSPARC10 SUN630MP parame80 LS 2027 ic LM 356 equivalent 811 0305 01 LM 2545 ic LM 356

    Untitled

    Abstract: No abstract text available
    Text: Finisar Product Specification SW Detector 2Gbps, PIN+Pre-amp, TO-46 HFD3081-108 PRODUCT FEATURES • Low electrical parasitic TO-46 package • High performance GaAs PIN photodiode with separate transimpedance amplifier • Low electrical parasitic TO46 package


    Original     		PDF HFD3081-108 155Mbps HFD3081-108 850nm.

    AUGAT DIP SOCKETS

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Socket Manufacturers Table 1 lists manufacturers known to offer sockets for Xilinx Package types. This summary does not


    Original     		PDF Q1-02 AUGAT DIP SOCKETS

    signetics

    Abstract: No abstract text available
    Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics STBGA Signetics Tape Ball Grid Array Package STBGA is a cavity-down package that uses a tape-based substrate mounted to a copper heat spreader. The package offers superior electrical performance by the


    Original     		PDF 40x40MM 100um 192hr, C/-65 C/100% 15PSIG, 168hrs signetics

    signetics

    Abstract: epbga EBGA epbga 304 signetics data book
    Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics EPBGA Signetics Enhanced Performance Ball Grid Array Package EPBGA is a cavity-down package that uses a laminate substrate mounted to a copper heat spreader. The package offers superior electrical and thermal performance by the


    Original     		PDF 100um 31x31MM 192hr, C/-65 C/100% 15PSIG, 168hrs signetics epbga EBGA epbga 304 signetics data book

    AL0150

    Abstract: AL0220 AL0330 AL0470 AL0680 AL0820 AL1000
    Text: Low Power Inductor AL SERIES ° ° ° ° ° Designed for switch mode power converters & filters Compact Package Rugged Design Extended Operating temperature range DC Current Rating for 40°C temperature rise Electrical Data Electrical Characteristics at 25ºC


    Original     		PDF AL0150 AL0220 AL0330 AL0470 AL0680 AL0820 AL1000 AL0150 AL0220 AL0330 AL0470 AL0680 AL0820 AL1000

    Untitled

    Abstract: No abstract text available
    Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and


    Original     		PDF MSWS3T-1004 17ion A17140

    Untitled

    Abstract: No abstract text available
    Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal


    Original     		PDF MSWS3T-1004 A17140

    Untitled

    Abstract: No abstract text available
    Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal


    Original     		PDF MSWS3T-1004 A17140

    Untitled

    Abstract: No abstract text available
    Text: MSWS4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal


    Original     		PDF MSWS4T-1004 A17141

    Untitled

    Abstract: No abstract text available
    Text: MSW4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal


    Original     		PDF MSW4T-1004 A17141

    Untitled

    Abstract: No abstract text available
    Text: MSWS4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and


    Original     		PDF MSWS4T-1004 A17141

    INTEL740

    Abstract: GPI04 md44 MD56 MD57 AB22-AB23 AB24-AB25
    Text: Electrical, Pinout, and Package Information intei Electrical, Pinout, and Package Information This chapter contains Intel740 graphics accelerator absolute maximum ratings, thermal characteristics, and DC characteristics. Pinout and package information are also provided.


    OCR Scan     		PDF Intel740â INTEL740 GPI04 md44 MD56 MD57 AB22-AB23 AB24-AB25

    ti486

    Abstract: TI-486
    Text: Chapter 5 Electrical Specifications Electrical specifications for the T I486 are provided in this chapter. The specifications include electrical connection requirements for all package pins, maximum ratings, recommended operating conditions, dc electrical, and ac


    OCR Scan     		PDF TI486DLC/E TI486DLC/E-V D31-D0 A31-A2 ti486 TI-486